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Chapter 3. Effect of the Titanium Buffer Layer on the Corrosion and Adhesion of

3.4 Summary

Ta films with α-β dual-phase structure were successfully deposited by magnetron sputtering. The surfaces deposited with Ta were harder and had a high H/E ratio compared to the uncoated Ti6Al4V substrate. Moreover, Ta film with a Ti buffer layer has a lower compressive residual stress which improved the film cohesion. The passive films on bare Ti6Al4V caused a decrease of one order of magnitude in the corrosion current density, reaching 2.4×10−9 A·cm−2 at a slower scan rate, whereas the coated films had a similar low corrosion current density at high and low scan rates. Ta coatings improved the corrosion resistance of the bare Ti6Al4V substrate.

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