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TSV placement optimization for liquid cooled 3D-ICs with emerging NVMs

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Academic year: 2019

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Figure

Figure 1.1: A 3-tier liquid cooled 3D-IC where inter-tier connections are achieved using TSVs
Figure 1.2: A 3-tier 3D-IC where inter-tier networks are connected using TSVs
Figure 1.3: A 2-tier liquid cooled 3D-IC implemented using micro-channels, a pump and a heat exchanger
Figure 1.4: A metal-insulator-metal RRAM cell structure. The switching occurs by the drift of oxygenvacancies between high and low oxygen vacancy concentration regions.
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