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A Feasibility Study on Embedded Micro Electromechanical Sensors and Systems (MEMS) for Monitoring Highway Structures

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Figure

Figure 1. Main components of MEMS (Attoh-Okine 2003)
Figure 2. Process flow sequence for MEMS device fabrication (Tanner 2001, Mensah 2003)
Figure 4. The wireless embedded sensor platform (WESP) (Darrin et al. 2004)
Figure 16. Instrumentation plan for 56 nodes on the Golden Gate Bridge’s main span (Pakzad et al
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