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Realisation of electroplating moulds with different thick photoresists for MEMS applications

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Figure

Fig. 1. Schematic representation of an atom cloud in the vicinity of high current density carrying wires.
Fig. 4. Mask design used for wire fabrication.
Fig. 7. Fabrication process flow for the gold electroplating and evaporationtechniques.
Fig. 9. SEM side view of gold wires fabricated by sputtering.
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