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Next Generation of 100 μm Pitch Wafer Level Packaging and Assembly for Systems on Package

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Figure

Fig. 1.WLP versus conventional packaging.
Fig. 3.Flip-chip package.
Fig. 6.(a) Plan view of package. (b) Slim sector model for the package withSB interconnections.
Fig. 8.Solder bump specifications for 100-�m pitch.
+7

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