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The integration of Si-based resonant interband

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Figure

Figure 1.1:  Emerging Technology Sequence. Adopted from 2001 ITRS [4].
Figure 4.9: The schematic layout of (a) resistors, (b) comb structures, (c) Van der Pauw, and (d) Cross-Bridge Kelvin Resistors (CBKR)
Figure 5.4:  Aluminum spikes creating a conducting path and shorting device.
Table 5.2:  Device structure schematics and electrical performance.
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