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A new joining-device for manufacturing tubular butt joints with higher curing temperatures of film adhesives

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Academic year: 2020

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Figure

Fig. 1 Alignment and bondline pressing
Fig. 3 Example of a void (1) and an air inclusion (2). Consequence of clamping the adherends during the adhesive cure
Fig. 4 Concept and demonstrator of the new joining device
Table 2 Material selection with  thermal expansion coefficient (from [9–11],) the onset temperature and diameter in the joining device
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