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TND6001/D. New EMI Challenges Facing OEMs as They Incorporate High Speed Serial Interfaces into Streamlined Smartphone Designs TECHNICAL NOTE

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Figure

Figure 1. Comparison of Parallel and Serial Configurations
Figure 2. Comparison of Handset Shipments and Related IC Shipments [Source: ABI Research]MIPI Powered ICIC ShipmentsHandset ShipmentsUnits(Billion)20092010201120122013201420157654321
Figure 4. Common Mode Filtering (180 5  out of phase and in phase)I1
Figure 6. Comparison of ESD Clamping Capabilities of Ceramic and Silicon-based CMF SolutionsSilicon-based CMF SolutionCeramics-based Solution w/Varistor
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