Development of imaging arrays for solar
UV observations based on wide band-gap
materials
Udo Schühle
*a, Jean-François Hochedez
b, José Luis Pau,
Carlos Rivera, Elias Muñoz
c, José Alvarez, Jean
-
Paul Kleider
d, Philippe Lemaire
e,
Thierry Appourchaux, Bernhard Fleck, Anthony Peacock
f, Mathias Richter, Udo Kroth,
Alexander Gottwald
g, Marie-Claude Castex
i, Alain Deneuville, Pierre Muret
k, Milos
Nesladek
m, Franck Omnes
n, Joachim John, Chris Van Hoof
p,Emanuele Pace
q aMax-Planck-Institut für Aeronomie;
bRoyal Observatory of Belgium;
cUniversidad
Politécnica de Madrid,
dLaboratoire de Génie Electrique de Paris,
eInstitut
d’Astrophysique Spatiale Orsay,
fEuropean Space Agency Noordwijk,
gPhysikalisch-Technische Bundesanstalt Berlin,
iUniversité de Paris-Nord,
kLaboratoire d’Etudes des
Propriétés Electroniques des Solides CNRS Grenoble,
mIMO Institute for Material
Research Diepenbeek,
nCentre de Recherche sur l'Hétéro-Epitaxie et ses Applications
(CRHEA-CNRS) Valbonne,
pInteruniversity Microelectronics Ctr. Leuven,
qXUVLAB
Outline of the talk
1. Introduction: Why new detectors?
2. Requirements for new detectors
3. Prospects towards new semiconductor devices
4. Prototype wide band-gab sensors: GaN, AlGaN
devices
5. Efficiency measurements with new one-pixel
devices
Conclusions of last years talk:
• SOHO UV instruments have been very stable
due to the successful cleanliness program.
but
• SOHO UV detectors have been remarkably
unstable.
Those were either channel plate
devices, or (intensified) CCDs!
Those were either channel plate
devices, or (intensified) CCDs!
MCP detectors
Anode design options
• Wedge and strip anode
• Cross Delay line anode
• Cross strip anode
• CCD
Example: flatfield of SUMER XDL detector
•
Distortion
•
ADC nonlinearity
•
Multifiber bundles (hexagonal)
•
Moire pattern (from 3 MCPs)
•
Dead pores
Intensified CCDs
„Ultra Compact Design“
Quest for high resolution
0.5 arcsec
Solar Orbiter mission
High-resolution
mission to the Sun and Inner Heliosphere
EIT
TRACE
Payload instrumentation:
o EUV spectrograph
o EUV imagers
o UV coronograph
What are our goals?
Imaging sensors with high sensitivity and resolution,
• large pixel array
• radiation hard
• smallest pixel size
• high count rate
• sensitive in a huge wavelength range
• solar blind
• stable calibration
• low dark noise
Advantages/disadvantages
S i l i c o n D e t e c t o r s
W i d e B a n d g a p D e t e c t o r s
N e e d c o o l i n g t o - 6 0 C o r l e s s
( D a r k c u r r e n t & r a d i a t i o n s )
R o o m t e m p e r a t u r e o p e r a t i o n s
(sim p l e r & c o s t - e f f e c t i v e )
C o n t a m i n a n t s s t i c k a n d p o l y m e r i z e
( c o l d t r a p )
L o w c o n t a m i n a t i o n r i s k , l o n g - t e r m s t a b i l i t y
D e g r a d a t i o n o f t h e c h a r g e t r a n s f e r e f f i c i e n c y
b y i o n i z i n g r a d i a t i o n
R a d - h a r d n e s s
W h o l e m ission lifetim e i n c r e a s e d
C o s m i c r a y h i t s p l a g u e t h e s i g n a l
( p o i n t s & s t r i k e s )
S m a l l e r c r o s s - s e c t i o n = > l e s s a r t i f a c t s
Q E i n s u f f i c i e n t , i n h o m o g e n e o u s , a n d
u n s t a b l e
H i g h e r Q E . S t a b i l i t y a n d f l a t - f i e l d
i m p r o v e d
M C P I n t e n s i f i e r s n e e d e d
V U V s e n s i t i v e
M inim a l p i x e l s i z e ~ 1 0 m i c r o n s
P o t e n t i a l l y m u c h s m a l l e r
M o s t s e n s i t i v e i n v i s i b l e , f i l t e r s n e e d e d
( f r a g i l e , a b s o r b i n g U V )
V i s i b l e - B l i n d
S o m e f i l t e r s c a n b e r e m o v e d
G a i n i n e f f e c t i v e a r e a
Devices fabricated for tests
MSM GaN device
Schottky GaN device
1x 6 linear micro-array of
MSM photodiodes
Single-photodetectors
Metal-semiconductor-metal
§
Active areas: 500 x 500 µm
2250 x 250 µm
250 x 50 µm
230 x 30 µm
2§
Finger widths (Pt/Ti/Au or Ni/Au)
and spacings: 2,4,7 and 10 µm
Schottky photodiodes
§
Extended Ti/Al or Ti/Al/Ti/Au ohmic contact.
§
Active areas: 1 mm, 600 µm, 400 µm and 200
µm diameter disks.
§
Semitransparent 100 Å-thick Au.
§
Ni (300 Å)/ Au (1000 Å) pad.
§
Passivation: SiO
2or SiN.
Solar-blindness of present WBGS detectors
200
400
600
800
1000
1E-8
1E-7
1E-6
1E-5
1E-4
1E-3
0,01
0,1
1
10
100
E = 28 KV/cm
electron/photon
Wavelength (nm)
Pace
et al.
2000.
Nitride
Diamond
Pau
et al.
2003.
10-1 101 103 10-10 10-8 10-6 x = 0 x = 0.19 x = 0.26 x = 0.35 λ = 325 nm Photocurrent (A) Irradiance (W/m2 ) 280 320 360 400 440 480 10-3 10-2 10-1 100 AlxGa1-xN x = 0 x = 0.19 x = 0.26 x = 0.35Responsivity (a.u.)
Wavelength (nm)
Micro-arrays
0.1 1 10 100 1000 10000 Pixel 1 Pixel 2 Pixel 3 Pixel 4 Pixel 5 Pixel 6Current (pA)
0.01 0.1 1 Pixel 1 Pixel 2 Pixel 3 Pixel 4 Pixel 5 Pixel 6AC Responsivity (a.u.)
• Minimum pixel size: 30 x 30 µm
2.
• Finger widths: 2, 4 and 7 µm.
• Homogeneity studies.
• Pixel-to-pixel cross-talk analysis.
• Image persistence effects.
VUV efficiency of MSM GaN devices
100 150 200 250 7 µm 4 µm 2 µmDC Responsivity (a.u.)
Wavelength (nm)
Finger width
EUV efficiency of GaN Schottky device
• Absolute responsivity
measured at the electron
storage ring BESSY II
• Compared to a
calibrated PtSi reference
diode