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STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials

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Figure

Figure 5. Roadmap of thermal technologies [23].
Figure 5nomial curve fit. STAR-CCM+ also allows the user to
Figure 7. Component temperatures.
Figure 11. Convective heat transfer coefficient contours.
+4

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