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RADSAGA Resubmission. First meeting. Steffen MUELLER Alexander KOELPIN. Institute for Electronics Engineering (LTE) University of Erlangen-Nuremberg

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(1)

RADSAGA

Resubmission

First meeting

Steffen MUELLER Alexander KOELPIN

Institute for Electronics Engineering (LTE) University of Erlangen-Nuremberg

(2)

Outline

1.

Introducing LTE

2.

RadHard activities

3.

LTE’s potential role

(3)

LTE embedded in FAU

Friedrich-Alexander-University of Erlangen-Nuremberg Humanities, Social Sciences and Theology Business, Economics, and Law

Engineering Sciences Medicine

Chemical and Biological Engineering Electrical, Electronic, and Communication Engineering Computer Science Mechanical Engineering Material Science and Engineering IDC

EAM EES EMF LEB LRT LSE LTE LHFT LZE LMS LIT LIKE AL

F A CTUL TI E S DE P A R TME NTS CHA IRS

(4)

Introducing LTE (Lehrstuhl für Technische Elektronik)

Staff:

● 3 professors

● Prof. Dr.-Ing. Dr.-Ing. habil. Robert Weigel (Head of Institute)

● Prof. Dr.-Ing. Georg Fischer

● PD Dr.-Ing. habil. Alexander Kölpin

● 4 external teaching professors:

● Dr. Frank Ohnhäuser (eesy-ic)

● Dr. Heindrich Milosiu (Fraunhofer IIS)

● Martin Allinger (eesy-ic)

● Prof. Dr.-Ing. Larissa Vietzorreck (TU Munich)

● 2 permanent guest scientists / joint lab actitivties

(5)

Introducing LTE

Staff

● 2 groups

● Electronic Systems (PD Dr.-Ing. habil. Alexander Kölpin)

● Electronic Circuits (Dr.-Ing. Amelie Hagelauer)

● 50 internal PhD students

● 25 external PhD students

● 40 students (BSc/MSc)

● 6 technical staff members

● 3 secretarial staff members

(6)

Introducing LTE

● Sites
(7)

Introducing LTE

The cradle of …

● Fundamental research on MP3 audio codec under Prof. Dr.-Ing. Dieter Seitzer (former Head of Institute) together with Karlheinz Brandenburg and

Heinz Gerhäuser

“Home of MP3”

● 46 years of “Halbleiter-Schaltungstechnik”

a.k.a. “Tietze/Schenk”

 international recognized literature on analog and digital circuit design

(8)

Introducing LTE

Competencies:

“from chips to systems”

● Chip design (CMOS, RF, MEMS)

● Circuit technology (analog, mixed-signal, digital)

● Microwave technology (up to 170 GHz)

● Test and measurement

● Hardware related programming

● System theory

Application areas:

● Information electronics ● Automotive electronics ● Industrial electronics ● Medical electronics
(9)

Introducing LTE

Research activities

● 80 running projects

● 3,7 Mio.€ third-party funds in 2014

● 17 PhD thesis finished in 2014

● ~60 student thesis per year

● ~120 international papers per year

● ~40 international talks per year

● ~10 patents per year

● Research clusters

● BMBF Medical Valley Erlangen (http://www.medical-valley-emn.de)

● Energy Campus Nuremberg (http://www.encn.de)

● German Research Foundation (DFG)

● Research group “BATS” (http://www.for-bats.de)

(10)

Introducing LTE

Conference organization

● EuMW (European Microwave Conference) 2013

● GEMIC (German Microwave Conference) 2015

(11)

Introducing LTE

Equipment and Labs

● 2500qm labs and offices

● Analog measurement setups incl. wafer prober up to 170 GHz

● Digital measurement setups incl. logic analyzer up to 4 GHz

● Wireless embedded systems lab (8x8 MIMO up to 6 GHz)

● PCB rapid prototyping

● SMD assembly and flip-chip bonding technology

● Electronic and computer labs

(12)

Outline

1.

Introducing LTE

2.

RadHard activities

(13)

RadHard Activities

Design of radiation tolerant/hard electronics

● On system and module level  hardening by design

● Usage of COTS components (costs, availability, flexibility)

● Experience with TID-effects: up to 1 Mrad, Co-60, ELDRS

Design of reliable

communication and sensor systems

Analysis of

redundancy and diversity

concepts on

hardware and software layer

Methods for complex components, modules and system

test beds

(14)

RadHard Activities: FPGAs

Evaluation of 3 different SRAM-based FPGA types

(different vendors and performance classes)

Remote monitoring of elementary logic cells

(MUL, SR, PLL, BRAM, CRAM)

2 fully-automated test beds

FPGA Test, Gen. 1

(15)

RadHard Activities: Memories

Evaluation of 4 different technologies

Data retention test incl. annealing

2 automated test beds

(16)

RadHard Activities: ADC/DACs

Evaluation of different ADCs/DACs

● 12/14/16/24-Bit ADCs

● 12/14/16-Bit DACs

● Single- & multiple-input devices

● Low- (<1 MSPS) and

High-Speed (>10MSPS) devices

Generic interface (unisex socket)

Anti-aliasing filter onboard

(17)

RadHard Activities: Galvanic isolation

Unidirectional transmission of digital signals

Multichannel architecture (up to 8 channels)

Features:

● Data rate: 10 Mbits/s (per channel)

● Breakdown voltage: > 1500 V

● Dimensions: 50 x 50 mm (8 channels)

Modulation

Isolation

Demodulation

(18)

RadHard Activities: Linear Regulator

Evaluation of 2 rapid prototyping designs

Design A

● Pass-element: BJT ● Vin = 5V, Vout = 1.2 to 3.3V ● Iout,max. = 0.8A

Design B

● Pass-element: MOSFET ● Vin = 5V, Vout = 1.2 to 3.3V ● Iout,max. = 3A
(19)

Outline

1.

Introducing LTE

2.

RadHard activities

(20)

LTE’s potential role

System design for radiation tolerant communication links

● Circuit design of basic building blocks

● Strategies for A/D partitioning

● Synergy with WP3.3 “Radiation tolerant communication links to be used for distributed systems and mixed-field radiation environments” ?

 bringing former experience from NPP’s industry projects to accelerator use-cases

Optional: various RF related topics, e.g.

● Proprietary wireless link for harsh environments

● Radar technology (6-port) for localization and/or high precision distance measurements

(21)

LTE’s potential role

For RF topics:

● Cooperation with IHP Institute

● IHP holds knowledge for radhard process

● Prof. Dr.-Ing. Kissinger (= former PhD student of LTE)

http://www.ihp-microelectronics.com/en/research/rf-circuits/overview.html

Maybe synergies with automotive industry?

TBD!

● FAU.INI (http://www.ini.fau.de)

Education

● Circuit design hands-on lab training

(tools for system simulation, PCB design, rapid-prototyping)

● Temporarily hosting of PhD students at LTE

● Contributing to conference organization?

(22)

Contacts

● PD Dr.-Ing. habil. Alexander Kölpin

https://lte.techfak.uni-erlangen.de/en/person/alexander_koelpin/

● Dipl.-Ing. Steffen Müller

(23)

RADSAGA Resubmission

First meeting

https://lte.techfak.uni-erlangen.de/en angen (http://www.medical-valley-emn.de g (http://www.encn.de http://www.for-bats.de) http://www.ihp-microelectronics.com/en/research/rf-circuits/overview.html http://www.ini.fau.de https://lte.techfak.uni-erlangen.de/en/person/alexander_koelpin/ https://lte.techfak.uni-erlangen.de/en/person/ste_mueller/

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