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Characterization of bagasse binderless particleboard manufactured in high-temperature range

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Figure

Fig. 2 Influence of pressing temperature on modulus of rupture(MOR) of bagasse and recycled chip binderless particleboards
Fig. 4 Influence of pressing temperature on internal bond strength(IB) of bagasse and recycled chip binderless particleboards
Table 3 Chemical components of bagasse and recycled chip
Fig. 7 Weight change in a cyclic accelerated aging treatment ofbinderless particleboards in optimum pressing temperature and PMDIparticleboards

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