Flex and Flex-Rigid Printed Circuits

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Flex and Flex-Rigid Printed Circuits 2010-2016

Description: BPA’s latest report on the markets and technologies for flexible and rigid-flex printed circuits forecasts that the global market for bareboard flex will increase from $8.6 billion to $12.7 billion by 2016. The

corresponding market for flex assemblies will increase from $26.3 billion to more than $40 billion in 2016. While new applications for flex such as smart card displays, tablet computers, biometric sensors, LED lighting and wireless communication antenna (this last applicable to all market sectors) are all strong growth markets, the dominant end-market is and will continue to be mobile phones and smartphones. Here the preferred mobile phone form factor has shifted away from clamshell and slider to touchscreen display, and as data transmission rates increase with sensor and display resolution, so FPC and rigid-flex technologies are changing and advancing.

The “Flex and Flex-Rigid Printed Circuits 2010-2016” report focuses on all the key applications in each market sector to see what is driving the market forward and what will be required in future. Market forecasts are provided for each major region by technology and by application. Opportunities are identified for fabricators, equipment and material suppliers.

Key report highlights:

- Flexible and flex-rigid substrates are key technologies in future generation electronic system design and development.

- The market for flex and rigid-flex printed circuit boards for all sectors will increase to $12.7bn by 2016. Mobile phone and display interconnects dominate Asian production and markets. These segments account for nearly half of all FPC production.

- Flex and flex-rigid production in China will increase from $2 billion in 2010 to more than $4 billion by 2016 accounting for 25% of worldwide production. Asia in total will account for more than 90% of worldwide flex production by 2016

Key report benefits:

- Identifies opportunities for small, medium and large players

- Identifies and examines the technologies, materials and- processes that you will need to participate in these markets

- Identifies winning strategies for successful players

- Provides a totally integrated assessment of the global flexible and flex-rigid substrate supply chain. Key questions answered in this report:

- How large are the markets for flexible and flex-rigid substrates? How fast are they growing? How will they develop over the next five years?

- What are the next emerging applications for flex and flex-rigid substrates?

- Which new flexible and flex-rigid substrate technologies will emerge as mainstream approaches - when and why?

- What new opportunities are emerging for companies in the supply industry for new materials, process equipment and assembly services?

- Who are the players in flexible and flex-rigid substrates worldwide? How are they differentiated? - How is flexible and flex-rigid substrate manufacturing and end-market demand distributed worldwide? - How will the trade balance of Western and Eastern production change over the next five years? - What will be the winning strategies for successful flexible and flex-rigid substrate suppliers? - How will EMS and ODMs impact the supply base?

Contents: 1. EXECUTIVE SUMMARY 2. INTRODUCTION

- Definition of a Flexible Circuit - Classification of Regions

3. REVIEW OF THE NEED FOR FPC AND RIGID-FLEX SUBSTRATES IN AUTOMOTIVE AND INDUSTRIAL APPLICATIONS

- Introduction - Automotive

- Industrial, Instrumentation and Control

4. REVIEW OF THE NEED FOR FPC AND RIGID-FLEX SUBSTRATES IN THE CONSUMER, COMPUTER, DATA STORAGE AND COMMUNICATIONS SECTOR

- Introduction

- Computer and Business - Consumer

- Communications: Datacom and Telecom Infrastructure - Mobile Phone Handsets, Smartphones and PDAs

5. REVIEW OF THE NEED FOR FPC AND RIGID-FLEX SUBSTRATES IN MEDICAL, MILITARY AND AEROSPACE APPLICATIONS

- Introduction - Medical Sector

- Military, Avionics and Space Sector 6. FLEXIBLE SUBSTRATE MATERIALS - Introduction - Polyimide - Adhesiveless Polyimide - Thermoplastic Polyimide - LCP - PTFE - PEEK 7. SUBSTRATE TECHNOLOGIES - Introduction

- Fineline and Advanced Structuring Technologies - Multilayer Flex

- Transparent Flexible Circuits - Metal-Backed Flexible Circuits - YFlex

- Rigid-Flex

- Embedded Active and Passive Components - Stretchable Electronics

- Assembly on Flex - Connector Technology - IC Packaging Technologies 8. FLEXIBLE COVERLAY MATERIALS - Introduction

- Drivers for Use of Photoimageable Coverlay - Coverlayer Suppliers and Producers 9. MARKET FORECASTS

- Introduction

- Worldwide Production of FPC and Rigid-Flex - Market Demand for Polyimide Laminate - Worldwide Demand for Flexible Circuit Coverlay - Flex Assemblies Market

10. FPC FABRICATORS - Introduction

- Asia (excluding Japan) - Japan

- North America - Western Europe

- Market Structure of FPC and Rigid-Flex Assembly - The Impact of EMS and ODMs on the Supply Base - Future Market Structure

11. OPPORTUNITIES - Summary

- Emerging Opportunities

APPENDIX – LISTS OF FABRICATORS IN EACH REGION LIST OF TABLES

- Summary of Demand for Flex and Rigid-Flex Printed Circuits - Applications Requiring Flex and Rigid-Flex Circuits

- Automotive LED Lighting Technology Roadmap - Applications Requiring Flex and Rigid-Flex Circuits - Notebook Computer Technology Roadmap - Hard Disk Drive Technology Roadmap

- Flexible Interconnects and Layer Counts for Mobile Phones

- Technology Roadmap for Mobile Phone Substrate and Key Flex Interconnects - Applications Requiring Flex and Rigid-Flex Circuits

- Medical OEMs

- MRI Players and FPC Use - CT Flexible Circuit Requirement

- Medical Imaging FPC Technology Roadmap - Ultrasound Market

- Technology Roadmap for ITE Hearing Aid - Implantable Device – Technology Roadmap - World Military Expenditure 2010

- DoD Budget Requests

- Top Aerospace and Defence Companies - UCAV Projects

- Military and Aerospace Applications Using Rigid-Flex

- FPC and Rigid-Flex Technology Roadmap for Defence Applications - Comparison of Polyimide Brands with PEN and LCP

- Producers of 3CCL and Adhesiveless Polyimide - LPKF’s Laser Patterning Process Parameters - Comparison of Assembly Technologies - Key Suppliers and Flex Coverlay Products - Top Ten Flex Circuit Fabricators

- Top Ten Asian FPC Fabricators 2010 - Top Ten Japanese Fabricators 2010

- Top Ten North American FPC Fabricators 2010 - Top Ten W European FPC Fabricators 2010 - Regional Variation in FPC Prices 2010 LIST OF FIGURES

- FPC In Automotive - Sensor Applications Uses - ZF Active Suspension Assembly - LED Daytime Running Light on Audi A4

- World Automotive Lighting Market 2009 (€13.4 billion) - Flexible Circuit for Indicator Light

- Parvus – Miniature Robot

- Quanta Display from Acer 4601 Travelmate - Motorola Xoom Assembly

- HDD Market Share 2010 (650 Million Units) - Hitachi 60GB TravelstarTM 2.5” HDD Actuator Flex - HP Optical Drive Flex Interconnects

- 15” LCD Display

- Nikon Coolpix S1000PJ (12MPX) - Digital Camera Market Share 2010

- 6th Generation IPOD Nano Touch Display and Audio Interconnect - Citala Display Technology

- Aveso Display

- Sonovation SonicSlideTM - Router System Architecture

- 10Gbps Avalanche Photodiode Receiver Optical Sub-Assembly (APD ROSA) - OEM Market Share 2010 Mobile Phone Handsets

- Mobile Phone Handset Shipments 2010-2016

- Mobile Phone Handset Shipments 2010-2016, Split by Form Factor - Apple iPhone – FPC Components

- HTC Smart F3188

- Megapixel Camera Modules

- OptimalTM WLP Image Sensor Compared with Conventional Module - Worldwide Imaging Market % Split by Application

- X-Ray Sensor Panel Construction - GE Lightspeed VCT XTE 64 Slice Scanner - GR Medical’s V-Res Detector

- Intravascular Ultrasound Probes

- Micrograph of Ultrasound Flex Component - BHTE and ITE Hearing Aids

- Pacemakers OEM Market Share 2010 - Defibrillators OEM Market Share 2010

- Size Reduction of Implantable Pacemakers and Defibrillators - Neurostimulation Devices Market Share 2010

- NDI Medical’s MicropulseTM - Given Image Pillcam

- RF Wireless Communication for Implanted Devices and External Controller - US Aerospace Industry 2010 Total: $216.5bn

- Missile Market Share Total Market 190,000 Units / $48.1 Billion - Cross-Section of AMRAAM Missile

- Rigid-Flex for Missile

- 14GHz (1 x 2) Antenna Array on a 425µm LCP Substrate - Moisture Absorption Comparison

- Comparison of PEEK and Polyimide

- Fine Line Structuring 16µm Lines, 50µm Pitch - Semi-Additive Processing

- Compass Technology Fine Line - Compass Technology 9µm Blind Via - LPKF’s Laser Patterning Process Steps

- Microsection of a Plasma-Ablated Via and Blind Via - Dyconex 7-Layer Flex

- Y-Flex 2-Layer Board Using Toshiba’s B2IT Process - Y-Flex 4-Layer Board Using Toshiba’s B2IT Process - Multilayer Flex-Rigid for Radar Application - Cross-Sectional Construction

- NOK FlexboardTM

- Young Poong Rigid-Flex Build-Up Board - Coesen Rigid-Flex Cross-Section - Yellow Flex

- Aspocomp Snap-Off Rigid-Flex - Hicoflex Process Stages

- Hicoflex Hearing Aid and Substrate with Die - Impact of Tensile Strain on Copper Conductors - Stretchable Electronics Array on Catheter - Flow Path for Assembly on Flex

- TCP and COF Package Structures

- OCCAM Process Applied to Flexible Circuits - DKN/ADK Film Base Connector

- Cross-Section of Tessera 3-Die Folded Flex Package

- Construction of Substrate for Tessera 3-Die Folded Flex Package - Stakpak® CSP DRAM Stacking BGA

- Process Paths

- Worldwide Production of Polyimide FPC 2010-2016 (000s sq m) - Global Market for FPC by End Application (US$ Million)

- FPC Production in China 2010-2016 (US$ Million) - FPC Production in China 2010-2016 (000s sq m) - Demand for FPC In China 2010-2016 (US$ Million) - Markets for Rigid-Flex in China 2010-2016 (US$ Million) - Markets for Multilayer Flex in China 2010-2016 (US$ Million) - FPC Production in Asia (exc China & Japan) 2010-2016 (US$ Million) - FPC Production in Asia (exc China & Japan) 2010-2016 (000s sq m) - Asian Markets for FPC 2010-2016 (US$ Million)

- Asian Markets for Rigid-Flex 2010-2016 (US$ Million) - Asian Markets for Multilayer Flex 2010-2016 (US$ Million) - Production of FPC in Japan 2010-2016 (US$ Million) - Production of FPC in Japan 2010-2016 (000s sq m) - Market Demand for FPC in Japan 2010-2016 (US$ Million) - Demand for Rigid-Flex in Japan 2010-2016 (US$ Million) - Demand for Multilayer Flex in Japan 2010-2016 (US$ Million) - FPC Production in N America 2010-2016 (US$ Million) - FPC Production in N America 2010-2016 (000s sq m) - Markets for FPC in N America 2010-2016 (US$ Million) - Markets for Rigid-Flex in N America 2010-2016 (US$ Million) - Markets for Multilayer Flex in N America 2010-2016 (US$ Million) - FPC Production in Europe 2010-2016 (US$ Million)

- FPC Production in Europe 2010-2016 (000s sq m)

- Markets for FPC in W Europe by Sector 2010-2016m (US$ Million) - Markets for Rigid-Flex in W Europe by Sector 2010-2016 (US$ Million) - Markets for Multilayer Flex in W Europe 2010-2016 (US$ Million) - Demand for Polyimide Laminate 2010-2016 (000s sq m)

- Worldwide Demand for Polyimide FCCL 2010-16 (000s sq m) - Worldwide Demand for Coverlay 2010-2016 (000s sq m) - Market for Flex and Rigid-Flex Assemblies

- Regional FPC Production - Flex Assembly Market Structure

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