Thermally Conductive Interface Materials for Cooling Electronic Assemblies. Thermal Solutions SELECTION GUIDE

(1)

S E L E C T I O N G U I D E

Thermal Solutions

Thermally Conductive

Interface Materials for

Cooling Electronic Assemblies

(2)

HT- 04503 HT- 07006 LT I - 04503 LT I - 06005

Method Description:1-ASTM D374 2-Internal TO-220 test RD 2018 3-Extended ASTM 5470 4-ASTM D149 5-Internal MDSC test RD 2014 6-UL File QMTS2-E1218882 (Temperature Index)

HT LTI

Part

Number Glass Transition

5 (ºC) UL6 (TI-ºC) Breakdown4 (kVAC) Impedance2 (ºC/W) Thickness1 (10-3_in/10-6_m) MP- 06503 MP 150 150 90 90 90 140 140 130 130 130 120 960 120 480 120 6.0 11.0 6.5 9.5 8.5 0.45 0.70 0.45 0.60 0.65 3/ 75 6/150 3/ 75 5/125 3/75 2.2 2.2 2.2 2.2 1.3

PRODUCT FAMILY THERMAL PERFORMANCE DIELECTRIC PERFORMANCE OTHER

Thermal Clad

®

Insulated Metal Substrates

IMS

®

Circuit Boards

Panels

IsoEdge

®

Thermal Clad is a versatile substrate allowing circuit boards to be configured for shapes, bends and multiple thickness-es. In this motor control application, the dielectric has been selectively removed and the metal formed with three-dimen-sional features.

Thermal Clad substrates are available in panel form. Material selection should be based on thermal, dielectric and mechanical application requirements.

Circuit layer - 1oz to 10oz Dielectric layer - HT, LTI or MP Base plate copper or aluminum 0.020-0.125" (0.5-3.2mm)

• Panels 18" x 24" (457.2 x 609.6mm) and 20" x 24" (508 x 609.6mm)

Ideal for use in DC/DC converter applications, IsoEdge high thermal performance technology replaces older flat-based heat sinks and insula-tors used in combination to meet safety agency criteria. IsoEdge’s thin powder dielectric coating provides excellent heat transfer with inherent 3-D dielectric safety while minimizing time-consuming assembly and safety approval times. Circuit Layer 1oz to 10oz Dielectric Layer (HT, LTI, MP) Base Layer Copper or Aluminum 0.020-0.125"

Anatomy of a Thermal Clad Board

The use of Thermal Clad in heat-rail applications has grown significantly and is currently used in automotive, audio, motor control and power conversion applications. Utilizing the many advantages of surface mount assembly, attachment capabilities and high thermal performance,Thermal Clad offers a cost effective solution for heat man-agement. When using Thermal Clad as the metal base substrate, the assembly process can be fully automated, thus eliminating the high labor cost of hand assembly.T-Clad also allows for unique shape requirements as it can be custom formed.

Due to the size constraints and watt-density requirements in DC/DC conversion, Thermal Clad has become the favored choice.Thermal Clad offers a variety of thermal performances, is compatible with mechanical fasteners and is highly reliable. It can be used in almost every form-factor and fabricated in a wide variety of substrate metals, thicknesses and copper foil weights.

In high-brightness LED applications, light output and long life are directly attributable to how well the LEDs are managed thermally.Thermal Clad is an excellent solution for designers. Because T-Clad is a metal based material, it can be configured for custom shapes and thicknesses thus allowing the designer to put high-brightness LEDs in virtually any application. Mounting high-brightness LEDs on T-Clad assures the lowest possible operating temperatures and maximum brightness, color and life.

Compact high reliability motor drives built on Thermal Clad have set the benchmark for watt-density. Dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements. With the ability to fabricate in a wide variety of form-factors, the imple-mentation into either compact or integrated motors drives is realized.The availability of Thermal Clad HT makes high temperature operation possible.

Heat-Rail and Forming

LEDs

Motor Drives

Power Conversion

Thermal Clad substrates minimize thermal impedance and conduct heat more effec-tively and efficiently than standard printed wiring boards (PWB’s).These substrates are more mechanically robust than thick-film ceramics and direct bond copper construc-tions that are often used in these applicaconstruc-tions.

Additional Thermal Clad benefits:

• Increased power density • Extend the life of dies • Improved product thermal and

mechanical performance

• Better use of surface mount technology

t

Conductivity3 (W/m-K)

Operating (VAC)

(3)

Sil-Pad

®

Thermally Conductive Insulators

More than 20 years ago, Bergquist set the standard for elastomeric thermal interface materials with the introduction of Sil-Pad. Today, Bergquist is a world leader with a complete family of Sil-Pad materials to meet critical needs of a rapidly changing electronics industry.

The Sil-Pad family of elastomeric thermal interface materials encompasses dozens of products, each with its own unique construction, properties and performance. Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications.

Sil-Pad provides:

• Excellent thermal performance

• Eliminates the mess of grease

• More durable than mica

• Efficient "total applied cost" that compares favorably with other alternatives

Features

• Thermal impedance: 0.66°C-in2_{/W (@50 psi)} • Inherent tack on both sides • Pad is re-positionable • Excellent thermal performance

at low pressures • Electrically isolating • Auto-placement • Auto-dispensable Applications • Power supplies • Automotive electronics • Motor controls Specifications Thickness: 0.012" (0.30mm)

Dielectric Breakdown Voltage (Vac): 5000 Thermal Conductivity: 1.1 W/m-K Construction: Silicone/Fiberglass

Features

• Thermal impedance: 0.53°C-in2_{/W (@50 psi)} • Exceptional thermal performance at

lower application pressures • Smooth and non-tacky on both sides • Superior breakdown voltage and surface

“wet out” values

• Designed for applications where electrical isolation is critical

• Excellent cut-through resistance

Applications • Power supplies • Automotive electronics • Motor controls • Audio amplifiers • Telecommunications • Discrete devices Specifications Thickness: 0.009-0.016" (0.229-0.406mm) Dielectric Breakdown Voltage (Vac): 6000 Thermal Conductivity: 1.8 W/m-K Construction: Silicone/Fiberglass

Features

• Thermal impedance: 0.41°C-in2_{/W (@50 psi)} • Tough dielectric barrier against

cut-through • High performance film

• Designed to replace ceramic insulators

Applications

• Power supplies • Power semiconductors • Motor controls • CAGE Number 55285 • U.L. File Number E59150

Specifications

Thickness: 0.006" (0.152mm)

Dielectric Breakdown Voltage (Vac): 6000 Thermal Conductivity: 1.3 W/m-K Construction: Silicone/Film

Features

• Thermal impedance: 0.42°C-in2_{/W (@50 psi)} • Elastomeric compound coated on

both sides Applications • Power supplies • Automotive electronics • Motor controls • Power semiconductors Specifications Thickness: 0.010" (0.254mm)

Features

• Thermal impedance: 0.35°C-in2_{/W (@50 psi)}

• Eliminates grease processing constraints • Electrically isolating and easy to handle • Conforms to surface textures

• Installation prior to soldering and cleaning

Applications

• Between a transistor and a heat sink • Between two large surfaces such as an

L-bracket and the chassis of an assembly • Between a heat sink and a chassis • Under electrically isolated power modules

or devices such as resistors or transformers • U.L. File Number E59150

Specifications

Thickness: 0.005" (0.127mm) Dielectric Breakdown Voltage (Vac): N/A Thermal Conductivity: 2.0 W/m-K Construction: Silicone/Fiberglass Features • Thermal impedance: 0.61°C-in2_{/W (@50 psi)} • Electrically isolating • Low mounting pressures

• Smooth and highly compliant surface • General-purpose thermal interface

material solution Applications • Power supplies • Automotive electronics • Motor controls • Power semiconductors Specifications Thickness: 0.009" (0.229mm)

t

Sil-Pad K-10

Sil-Pad A1500

Q-Pad

®

3

Sil-Pad 900S

Sil-Pad 1100ST

Sil-Pad 1200

t

Sil-Pad 1500ST (soft tack) high performance thermal interface material is designed specifi-cally for use in high-volume auto-dispensing and auto-placement applications.

(4)

Features

• Highly conformable, low hardness • “Gel-like” modulus

• Designed for low-stress applications • Puncture, shear and tear resistant

Applications

• Telecommunications • Computers and peripherals • Power conversion

• Between heat-generating semiconductors or magnetic components and a heat sink • Area where heat needs to be transferred

to a frame, chassis or other type of heat spreader

Specifications

Thickness: 0.020-0.250" (0.508-6.350mm) Hardness, Bulk Rubber (Shore 00): 5 Dielectric Breakdown Voltage (Vac): >6000 Thermal Conductivity: 1.0W/m-K

The Bergquist Company developed the Gap Pad thermal interface material family to meet the electronics industry's growing need for interface materials with greater conformability, higher thermal performance and easier application.

The extensive Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface tex-tures are present. Bergquist application spe-cialists work closely with customers to specify the proper Gap Pad material for each unique thermal management requirement.

Gap Pad provides:

• Elimination of air gaps to reduce thermal resistance

• High conformability to reduce interfacial resistance

• Low-stress vibration dampening

Features

• Fiberglass reinforced for puncture, shear and tear resistance

• Easy release construction • Electrically isolating

Applications

• Telecommunications • Computers and peripherals • Power conversion

• RDRAM®_{memory modules / chip scale}

packages

• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader

Specifications

Thickness: 0.010-0.020" (0.254-0.508mm) Hardness, Bulk Rubber (Shore 00): 40 Dielectric Breakdown Voltage (Vac): >6000 Thermal Conductivity: 1.5W/m-K

Features

• Low “S-Class” thermal resistance at very low pressures

• Highly conformable, “S-Class” softness • Designed for low-stress applications • Fiberglass reinforced for puncture, shear

and tear resistance

Applications

• Processors • Server S-RAMs • Mass storage drives

• Wireline/wireless communications hardware • Notebook computers • BGA packages • Power conversion Specifications Thickness: 0.010-0.125" (0.254-3.175mm) Hardness, Bulk Rubber (Shore 00): 30 Dielectric Breakdown Voltage (Vac): >3000 Thermal Conductivity: 3.0W/m-K

Features

• Ultra-conforming, designed for fragile and low-stress applications

• Ambient and accelerated cure schedules • 100% solids - no cure by-products • Excellent low and high temperature

mechanical and chemical stability

Applications

• Automotive electronics • Computers and peripherals • Telecommunications

• Thermally conductive vibration dampening • Between any heat-generating

semiconductor and a heat sink

Specifications

Density (g/cc): 1.6 Hardness (Shore 00): 30 Dielectric Strength (V/mil): 500 Thermal Conductivity: 1.0W/m-K

Features

• Optimized shear thinning* • Stays in place, highly slump resistant • Ultra-conforming, designed for fragile

and low stress applications • No cure by-products

Applications

• Automotive electronics • Computers and peripherals • Telecommunications

• Thermally conductive vibration dampening • Between any heat-generating

semiconductor and a heat sink

Specifications

Density (g/cc): 2.7 Hardness (Shore 00): 50 Dielectric Strength ( V/mil): 400 Thermal Conductivity: 1.8W/m-K

Features

• Two-part formulation for easy storage • Thixotropic nature makes it easy to

dispense

• Ultra-conforming, designed for fragile and low-stress applications

• Ambient or accelerated cure schedules

Applications

• Automotive electronics • Discrete components to housing • PCBA to housing

• Fiber optic telecommunications equipment

Specifications

Density (g/cc): 2.9 Hardness (Shore 00): 32 Dielectric Strength (V/mil): 275 Thermal Conductivity: 3.6W/m-K

t

Gap Pad

®

Thermally Conductive Gap Filling Materials

Gap Filler 1000

(Two-Part)

Gap Filler 1500

(Two-Part)

Gap Filler 3500S35

(Two-Part)

Gap Pad VO Ultra Soft

Gap Pad 1500R

Gap Pad 3000S30

Bergquist Gap Filling materials deliver superior thermal conductivity and are the ideal solution for liquid dispensed applications. As form-in-place elastomers, their ultra-conforming properties provide infinite-thickness coverage for uneven board topography. They are ideal for fragile and low-stress applications such as power electronics and discrete devices. Their low viscosity offers faster through-put, with less pressure on the dispensing equipment, which can cause material breakdown and affect mechanical per-formance. As cured, these products are dry to the touch, with no cure by-prod-ucts, for a cleaner assembly.

t

* ”Optimized Shear Thinning” - Maximizes dispensing capacity and equipment reliability.

(5)

Hi-Flow phase change materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure total wet-out of the inter-face without overflow. The result is a thermal interface comparable to grease, without the mess, contamination and hassle.

Hi-Flow

®

Phase Change Interface Materials

Features

• Thermal impedance: 0.37°C-in2_{/W (@25 psi)} • Used where electrical isolation is

not required

• Low volatility - less than 1% • Easy to handle in the manufacturing

environment

Applications

• Spring or clip mount applications where thermal grease is used

• Microprocessors mounted on a heat sink • Power semiconductors

• Power conversion modules

Specifications

Thickness: 0.0055" (0.139mm) Reinforcement Carrier: Aluminum Continuous Use Temp: 130°C Thermal Conductivity: 0.9 W/m-K

Features

• Thermal impedance: 0.10°C-in2_{/W (@25 psi)}

• Can be manually or automatically applied to the surfaces of a

room-temperature heat sink • Foil reinforced, adhesive-coated • Soft, thermally conductive 55°C phase

change compound

Applications

• Computers and peripherals • Power conversion

• High performance computer processors • Power semiconductors

• Power modules

Specifications

Thickness: 0.004" (0.102mm) Reinforcement Carrier: Aluminum Continuous Use Temp: 120°C Thermal Conductivity: 1.0 W/m-K

Features

• Thermal impedance: 0.13°C-in2_{/W (@25 psi)} • Field-proven polyimide film • Excellent dielectric performance • Excellent cut-through resistance

Applications

• Spring / clip-mounted • Discrete power semiconductors

and modules

Specifications

Thickness: 0.004-0.005" (0.102-0.127mm) Reinforcement Carrier: Polyimide Continuous Use Temp: 150°C Thermal Conductivity: 1.6W/m-K

Thermally Conductive Adhesives

Features

• High bond strength to a variety of surfaces

• Double-sided, pressure-sensitive adhesive tape

• High performance, thermally conductive acrylic adhesive

• Can be used instead of heat-cure adhe-sive, screw mounting or clip mounting

Applications

• Mount heat sink onto BGA graphic processor or drive processor • Mount heat spreader onto power

con-verter PCB or onto motor control PCB

Specifications

Thickness: 0.005/0.008/0.011" (0.127/0.203/0.279mm) Reinforcement Carrier: Fiberglass Dielectric Breakdown Voltage (Vac): 3000/6000/8500

Thermal Conductivity: 0.8W/m-K

Features

• Designed to replace mechanical fasteners or screws

• For applications that require electrical isolation

• Double-sided pressure sensitive adhesive tape

Applications

• Heat sink onto BGA processor • Heat sink onto drive processor • Heat spreader onto power converter PCB • Heat spreader onto motor control PCB

Specifications

Thickness: 0.0055" (0.14mm) Reinforcement Carrier: Film

Dielectric Breakdown Voltage (Vac): 7000 Thermal Conductivity: 0.4W/m-K

Features

• Eliminates the need for mechanical fasteners

• One-part formulation for easy dispensing • Mechanical and chemical stability • Maintains structural bond in

severe-environment applications • Heat cure

Applications

• PCBA to housing

• Discrete component to heat spreader

Specifications

Density (g/cc): 2.4 Hardness (Shore A): 80 Dielectric Strength (V/mil): 250 Thermal Conductivity: 2.0W/m-K

t

Bergquist Liquid Adhesives allow mechanical attachment of the component to the heat sink with thermal transfer properties without the need for added fasteners. It's pre-cure, gel-like viscosity also makes it a good fit for automated or manual dispensing. The above application photo depicts TO-251 components fully bonded to a heat sink utiliz-ing Bond-Ply LMS lamination.

t

Hi-Flow 105

Hi-Flow 225F-AC

Hi-Flow 300P

(6)

T

Corporate Headquarters and Sales Office: 18930 West 78th Street

Chanhassen, MN 55317

Circuits Manufacturing Facility: 1600 Orrin Road Prescott,WI 54021

DOMESTIC AGENTS

For a complete list of Bergquist sales representatives in the U.S. contact

The Bergquist Company: 1-800-347-4572.

INTERNATIONAL SALES OFFICES

HONG KONG

The Bergquist Company Asian Headquarters Room 15, 8/F

Wah Wai Industrial Centre No. 38-40,

Au Pui Wan Street Fotan, Shatin, N.T. Hong Kong Tel: 852-2690-9296 Fax: 852-2690-2344

THE NETHERLANDS

The Bergquist Company European Headquarters Bramenberg 9a 3755 BT Eemnes The Netherlands Tel: 31-35-5380684 Fax: 31-35-5380295

CHINA

The Bergquist Company China

Rm. 7C Aihe Mansion

No. 629 Ling Ling Road Shanghai, China 200030 Ph: 86-21-6464-2206 Fax: 86-21-6464-2209

GERMANY

Bergquist ITC GmbH Haderslebener Str. 19A, D-25421 Pinneberg Tel: 49-4101-803-230 Fax: 49-4101-803-100

SOUTH KOREA

The Bergquist Company Korea, Ltd.

#5303 Dongil Technotown Anyang 7 Dong

Manan Ku, Anyang Si Kyunggi Do

South Korea, 430-817 Tel: 82-31-448-0382 Fax: 82-31-448-0383

U.K. and IRELAND

Bergquist UK Ltd. Unit 27 Darin Court Crownhill Ind. Est. Milton Keynes MK80AD Tel: 44-1908-263663 Fax: 44-1908-263773 AUSTRALIA AUSTRIA BELGIUM BRAZIL CANADA CHINA DENMARK FINLAND FRANCE HOLLAND HONG KONG ISRAEL ITALY JAPAN MALAYSIA MEXICO NEW ZEALAND NORWAY PORTUGAL RUSSIA SINGAPORE SPAIN SWEDEN SWITZERLAND TAIWAN THAILAND TURKEY

Toll Free: (800) 347-4572 • Main: (952) 835-2322 • Fax: (952) 835-0430 • www.bergquistcompany.com

Thermal Products• Membrane Switches • Touch Screens • Electronics