MB SIM Technology Co., Ltd. Electrics / Electronics Training Competencies

MB SIM Technology Co., Ltd.

Company Overview

Core Competences

3

2

1

Consulting Services

Training Competencies

Training Concepts

Reference Training Courses

7

6

5

4

Electronics Solutions

Cooperation Partners

8

Contact Partner

9

INDEX

COMPANY OVERVIEW

Positioning

locally in China

Joint Venture

Shareholders

ƒ 75 % MB-technology GmbH

ƒ 25 % SIMIT – Shanghai Institute Of Microsystems And Information Technology

Business

Activities

ƒ Dedicated and market oriented engineering services for electronic solutions and consulting along the entire value creation chain with local resources

ƒ Combination with MB Tech services for supporting localization & adaption of JVs and foreign company subsidaries in China

ƒ Low cost engineering and offshoring services to customers worldwide

Employees

Business

Location

ƒ 40 local engineers plus global MBtech Group network of consulting & engineering experts

History

ƒ 1995 – 1999: Joint Research Laboratory for Electronic Packaging ƒ 01/2000 – 09/2005: Joint Venture between DaimlerChrysler and SIMIT ƒ 09/2006: Foundation of MB SIM Technology Co., Ltd.

1

Systems engineering

Electronics solutions

Consulting services

MB SIM Tech

Service Offering

Software engineering

Validation &

compliance

_{Test engineering}

Technology &

Innovation Consulting

Process Consulting

Translation

Training &

Qualification

Vehicle engineering

Powertrain solutions

With global MBtech support Local core competencies

MB SIM Tech electronics solutions

Systems

engineering

Software

engineering

Test

engineering

Validation &

compliance

ELECTRONICS SOLUTIONS

MB SIM Tech consulting

Technology &

process

consulting

Qualification

& training

Technology

survey

Technical

documentation

translation

CONSULTING SERVICES

Electronics

Technology

Quality

Series

Production

Series

Supply

Chain

„Flip Chip technology

on electronics manufacturing

„Lead free technology

on electrics manufacturing

„ESD protection

technology

ƒ Quality system and standard training (ISO/IEC17025, TS16949, ISO9001, ISO14001) ƒ TS16949 tools (PPAP,APQP,FMEA SPC,MSA) ƒ QC tools and 8D ƒ Total quality management ƒ 6 Sigma ƒ DOE and QFD ƒ Quality cost analysis

„Lean manufacture „5S implementation „Visual management „Total productive

(TPM)

„ Production plan and

material control „Continue improvement (Kaizen) „Project management „Procurement management „Supply chain management „Supplier selection and qualification „Supplier quality management „Inventory and warehouse management „Failure analysis on electronics packaging ƒ Reliability tests and

qualification

ƒ Moisture sensitivity and relevant issues ƒ Soldering & solder

joint failure analysis ƒ CSAM and its

applications ƒ X-ray imaging and

its application ƒ Fundamentals of

SEM/EDX

Test & Failure

Analysis

Course model

„_{Public Seminar: Expertise communication and improvement} „_{Standard single training: Only one topic course provided}

„_{Combined training: Training course combines two or more topics}

„_{Customized training: The training course is customized to meet the customers needs}

„_{On customer site training: A package service for customers} „_{Public training: Participate personally in appointed training rooms}

Venue Choice

TRAINING CONCEPTS

TT1: Introduction to Technology Development on Electronics Manufacturing

Objectives of course

Target participants

Course outline

Duration

•Understand the history and development of electronics manufacturing

•Understand the history and development of electronics packaging

Engineers and technicians in the field of chip design, electronic packaging, & assembly, system development and manufacture.

- The history and development of electronic productions

- Development of Integrated Circuit Technology

- Development of RF devices, MEMS and other devices for special application

- Introduction of electronic packaging

- The functions of electronic packaging - Categories of electronic packaging - Examples of common electronic packages

- The development trends of electronic packaging

- Packaging development of IC devices

- Packaging development of passive components - Development of PCBs

4 hours

•Understand the background of lead-free

•Master the basic knowledge of lead-free technology

Objectives of course

Target participants

Course outline

Duration

- Background of lead-free technology

- The harm of Pb to human health - Legislation about lead-free

- Current situation of lead-free technology

- Introduction of lead-free technology

- Definition of lead-free

- Main materials for lead-free soldering - Schedule of lead-free implementation

- Challenges during lead-free process

- Solderability problem of lead-free materials - Reliability of lead-free solder joints

Engineers and technicians in the field of chip design, electronic packaging, & assembly, system development and manufacture.

4 hours

REFERENCE TRAINING COURSES

Course outline

- Introduction of flip chip technology

- Origin of flip chip technology

- Advantage and application of flip chip technology

- Basic process of flip chip technology

- Bumping process

- Main flip chip techniques - Under filling process

- Reliability of flip chip

- Influence of materials and processes on lifetime of flip chip devices - Typical failure modes of flip chip devices

Objectives of course

Target participants

Duration

•Understand the characteristics of flip chip

•Master the basic knowledge of flip chip technology

Engineers and technicians in the field of chip design, electronic packaging, & assembly, system development and manufacture.

REFERENCE TRAINING COURSES

TT3: Flip Chip Technology on Electronics Manufacturing

Course outline

- Introduction ESD theory - ESD technology and skills

- ESD protection system and management - ESD standard

Objectives of course

Target participants

Duration

•Understand the characteristics of ESD •Set up ESD system and reduce the damage

Production engineers Electronic engineers

Quality engineer and relative engineers 6 hours

REFERENCE TRAINING COURSES

Objectives of course

Target participants

Course outline

Duration

•Comprehensive understanding of failure analysis electronics packaging

Engineers engaged in quality, reliability and failure analysis from

component/board assembling

companies and system manufacturers.

- Definition and classification of failures/ Why do electronic products fail?

- The objectives of failure analysis/ Understand the importance of failure analysis - Philosophical approach of failure analysis/ Technique approach of failure analysis - Common misunderstandings and mis-practice/ Failure analysis flow charts

REFERENCE TRAINING COURSES

QFA1: Failure Analysis on Electronics Packaging

Objectives of course

Target participants

Course outline

Duration

•Understanding basic concept of reliability test •Understanding common qualification test procedure

of plastic packaged IC

Engineers engaged in quality, reliability and failure analysis from

component/board assembling

companies and system manufacturers.

- Basic concept of reliability and reliability test

- Difference between reliability screening and reliability test - Common accelerated models in reliability test

- Common test methods in qualification of plastic packaged IC

REFERENCE TRAINING COURSES

QFA2: Reliability Tests and Qualification of Plastic Packaged ICs

Objectives of course

Target participants

Course outline

Duration

•Understanding moisture effects on plastic device reliability

•Understanding how to judge the MSL of plastic devices

Engineers engaged in quality, reliability and failure analysis from

component/board assembling

companies and system manufacturers.

- Problem caused by moisture penetration - Popcorn phenomena and root cause

- Understanding Moisture relevant Standards

- How to judge the root cause of failure relevant to moisture - Practical guideline for moisture sensitive devices

REFERENCE TRAINING COURSES

QFA3: Moisture Sensitivity and Relevant Issues

Objectives of course

Target participants

Course outline

Duration

•Understand common techniques for solder joint failure analysis and their limitations

Engineers engaged in quality, reliability and failure analysis from

component/board assembling

companies and system manufacturers.

- Common solder joint failure modes and investigation techniques; x-ray, dye penetration, cross-sectioning, SEM/EDX. - Black pad failure, gold brittleness failure, ternary alloy failure etc.

REFERENCE TRAINING COURSES

QFA4: Soldering & Solder Joint Failure Analysis

Objectives of course

Target participants

Duration

•To understand CSAM, its applications in electronics manufacturing, its strength and limitations.

Engineers engaged in quality, reliability, process and failure analysis from component/board assembling

companies and system manufacturers.

Course outline

- Introduction of CSAM fundamentals

- Its applications in electronics manufacturing (with many examples)

REFERENCE TRAINING COURSES

TM1: CSAM and its Applications in Electronics Manufacturing

Objectives of course

Target participants

Duration

•Understand soft x-ray imaging, its strength, limitations.

•Understand its typical application in electronics manufacturing.

Engineers engaged in quality, reliability, process and failure analysis from component/board assembling

companies and system manufacturers.

Course outline

- Principle of soft X-ray imaging

- Typical applications of soft x-ray imaging in electronics manufacturing

REFERENCE TRAINING COURSES

TM2: X-ray Imaging and its Application in Electronics Manufacturing

Objectives of course

Target participants

Course outline

Duration

• To know the fundamentals of SEM/EDX

• To know the application of SEM/EDX as a failure analysis method in electronics packaging

SEM/EDX manipulator, Failure analysis Engineer and other relevant staff

-Interaction between incident electrons and specimen -- Fundaments of SEM/EDX

- Examples showing the applications of SEM/EDX

REFERENCE TRAINING COURSES

TM3: Fundamentals of SEM/EDX and its Applications in Electronics Packaging

„

_{MBtech Group}

„

_{Team board member:}

Packaging Branch of China Semiconductor Association

„

Shanghai SMT, Electronics Manufacturing Association,

YangZi Triangle SMT Expert Group

„

_{Material and Equipment Suppliers:}

Seho, Sonoscan, Feinfocus, Kester, Nisene (B&G), UIC, Rhesca

„

Training Organization:

German Chamber of Commerce AHK

COOPERATION PARTNERS

Further information: www.mbtech-group.com

MB SIM Technology Co., Ltd. Bldg. 8, 865 Changning Road Shanghai 200050, P.R. China Tel: +86-21-62405529 Fax: +86-21-62131233 [email protected]

Guogeng Xiao

CONTACT PARTNER