CPC1718. Single-Pole, Normally Open ISOPLUS -264 DC Power Relay INTEGRATED CIRCUITS DIVISION. Description. Characteristics. Features.

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DS-CPC1718 - R05 www.ixysic.com 1

Characteristics

Features

17.5ADC Load Current with 5°C/W Heat Sink Low 0.075Ω On-Resistance

100VP Blocking Voltage

2500Vrms Input/Output Isolation Low Thermal Resistance (0.3 °C/W)

Electrically Non-conductive Thermal Pad for Heat Sink Applications

Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation

Machine Insertable, Wave Solderable

Applications

Industrial Controls / Motor Control Robotics

Medical Equipment—Patient/Equipment Isolation Instrumentation

Multiplexers Data Acquisition Electronic Switching I/O Subsystems

Meters (Watt-Hour, Water, Gas) Transportation Equipment Aerospace/Defense

Approvals

UL 508 Certified Component: File E69938 CSA Certified Component: Certificate 1172007

Pin Configuration

Description

Ordering Information

Switching Characteristics

Parameter Rating Units

Blocking Voltage 100 VP

Load Current, TA=25°C:

With 5°C/W Heat Sink 17.5

ADC No Heat Sink 6.75 On-Resistance 0.075 Ω RθJC 0.3 °C/W 1 2 3 4 + - - + Part Description

CPC1718J ISOPLUS-264 Package (25 per tube)

I

NTEGRATED

C

IRCUITS

D

IVISION

Single-Pole, Normally Open

ISOPLUS™-264 DC Power Relay

e

3

Form-A IF ILOAD 10% 90% ton toff

IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays.

As part of this family, the CPC1718 single-pole normally open (1-Form-A) DC Solid State Power Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The combination of low on-resistance and high load current handling

capability makes this relay suitable for a variety of high performance DC switching applications.

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1 Specifications

1.1 Absolute Maximum Ratings @ 25°C

1.2 Electrical Characteristics @ 25°C

1 Higher load currents possible with proper heat sinking. 2 Measurement taken within 1 second of on-time.

3 For applications requiring high temperature operation (> 60ºC) a LED drive current of 20mA is recommended.

Symbol Ratings Units

Blocking Voltage 100 VP

Reverse Input Voltage 5 V

Input Control Current 100 mA

Peak (10ms) 1 ADC

Input Power Dissipation 150 mW

Isolation Voltage, Input to Output 2500 Vrms

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

Parameter Conditions Symbol Minimum Typical Maximum Units

Output Characteristics Load Current 1 t k a e P ≤10ms IL - -40 AP k n i S t a e H o N s u o u n it n o C 6.75 Continuous TC=25°C 32 ADC Continuous TC=99°C IL(99) 8.5

On-Resistance 2 IF=10mA, IL=1A RON - 0.03 0.075 Ω

Off-State Leakage Current VL=100VP ILEAK - - 1 µA

Switching Speeds Turn-On

IF=20mA, VL=10V ton - 7.5 20 ms

Turn-Off toff - 0.19 5

Output Capacitance VL=25V, f=1MHz Cout - 1600 - pF

Input Characteristics

Input Control Current 3 IL=1A IF - - 10 mA

-t n e rr u C t u o p o r D t u p n I IF 0.6 - - mA

Input Voltage Drop IF=5mA VF 0.9 1.2 1.4 V

Reverse Input Current VR=5V IR - - 10 µA

Input/Output Characteristics

Input-to-OutputCapactiance - CI/O - 1 - pF

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2 Thermal Characteristics

2.1 Thermal Management

Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5°C/W.

2.2 Heat Sink Calculation

Higher load currents are possible by using lower thermal resistance heat sink combinations.

Parameter Conditions Symbol Minimum Typical Maximum Units

Thermal Resistance (Junction to Case) - RθJC - - 0.3 °C/W

Thermal Resistance (Junction to Ambient) Free Air RθJA - 33 - °C/W

-) g n it a r e p O ( e r u t a r e p m e T n o it c n u J TJ -40 - 100 °C TJ = Junction Temperature (°C), TJ≤ 100°C * TA = Ambient Temperature (°C)

IL(99) = Load Current with Case Temperature @ 99°C (ADC) IL = Desired Operating Load Current (ADC), IL≤ IL(MAX)

RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W

RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) PD(99) = Maximum power dissipation with case temperature held at 99ºC = 3.33W

* Elevated junction temperature reduces semiconductor lifetime. Heat Sink Rating

R

θCA

=

(T

J

- T

A

) I

L(99)

- R

θJC

2

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3 Performance Data

Unless otherwise specified, all performance data was acquired without the use of a heat sink.

The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.

35 30 25 20 15 10 5 0 4.5 6.0 7.5 9.0 10.5 12.0 D evice Count (N)

Typical Turn-On Time (N=50, IF=20mA, IL=1ADC, TA=25ºC) Turn-On (ms) 0.17 0.19 0.21 0.16 0.18 0.20 D evice Count (N) 25 20 15 10 5 0

Typical Turn-Off Time (N=50, IF=20mA, IL=1ADC, TA=25ºC) Turn-Off (ms) 35 30 25 20 15 10 5 0 0.026 0.028 0.030 0.032 0.034 0.036 D evice Count (N)

Typical On-Resistance Distribution (N=50, IF=10mA, IL=1ADC, TA=25ºC) On-Resistance (Ω) 35 30 25 20 15 10 5 0 1.30 1.31 1.32 1.33 1.34 D evice Count (N)

Typical LED Forward Voltage Drop (N=50, IF=10mA, IL=1ADC, TA=25ºC)

LED Forward Voltage (V) LED Forward Current (mA)

Turn-On (ms) 0 5 10 15 20 25 30 35 40 45 24 22 20 18 16 14 12 10 8 6 4 50 2 0 Typical Turn-On vs. LED Forward Current

(IL=1ADC, TA=25ºC)

LED Forward Current (mA)

0 5 10 15 20 25 30 35 40 45 0.19 0.18 0.17 0.16 0.15 0.14 0.13 0.12 0.11 0.10 50 Turn-Off (ms) Typical Turn-Off vs. LED Forward Current

(IL=1ADC, TA=25ºC)

Typical LED Forward Voltage Drop vs. Temperature 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 100 120 IF=50mA IF=10mA IF=20mA Temperature (ºC) LED Forwa rd V olta g e D rop (V) -40 21 18 15 12 9 6 3 0 -20 0 20 40 60 80 100 Temperature (ºC) IF=10mA IF=20mA Typical Turn-On vs. Temperature

(IL=1ADC) Turn-On (ms) -40 0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 -20 0 20 40 60 80 100

Typical Turn-Off vs. Temperature (IL=1ADC)

Temperature (ºC)

IF=20mA

IF=10mA

Turn-Off (ms)

LED Current (mA)

-40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100

Typical IF for Switch Operation vs. Temperature

(IL=1ADC)

Temperature (ºC)

Load Current (A)

0 10 9 8 7 6 5 4 3 2 1 0 0.03 0.06 0.09 0.12 0.15 0.18 0.21

Typical Load Current vs. Load Voltage (IF=10mA, TA=25ºC)

Load Voltage (V) Temperature (ºC)

0 20 40 60 80 100 Load Current (A DC ) 0 5 10 15 20 25 30 35

Maximum Load Current vs. Temperature with Heatsink

1ºC/W

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5 www.ixysic.com R05 Unless otherwise specified, all performance data was acquired without the use of a heat sink.

The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.

-40 0.066 0.060 0.054 0.048 0.042 0.036 0.030 0.024 0.018 0.012 -20 0 20 40 60 80 100 Typical On-Resistance vs. Temperature (IF=10mA, IL=1ADC) On-Resistance () Temperature (ºC) -40 0.11 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 -20 0 20 40 60 80 100 On-Resistance () Temperature (ºC) Typical On-Resistance vs. Temperature (IF=10mA, IL=Max Rated)

-40 128 126 124 122 120 118 116 114 112 -20 0 20 40 60 80 100 Temperature (ºC)

Typical Blocking Voltage vs. Temperature Blo ckin g V olta g e (V P ) -40 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -20 0 20 40 60 80 100

Typical Leakage vs. Temperature Measured Across Pins 1&2

(VL=100VP) Leaka g e ( µA) Temperature (ºC)

Load Current (A)

50 45 40 35 30 25 20 15 10 5 0 1ms 10µs 100µs 10ms100ms 1s 10s 100s

Energy Rating Curve Free Air, No Heat Sink

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4 Manufacturing Information

4.1 Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

4.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

4.3 Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed.

4.4 Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.

Device Moisture Sensitivity Level (MSL) Rating

1 L S M J 8 1 7 1 C P C

Device Maximum Temperature x Time

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4.5 Mechanical Dimensions

NOTE: Back-side heat sink meets 2500Vrms isolation to the pins.

26.162 ± 0.254 (1.030 ± 0.010) 19.914 ± 0.254 (0.784 ± 0.010) 20.396 ± 0.508 (0.803 ± 0.020) 15.240 ± 0.508 (0.600 ± 0.020) 3.810 ± 0.254 (0.150 ± 0.010) 2.362 ± 0.381 (0.093 ± 0.015) 0.635 ± 0.076 (0.025 ± 0.003) 2.794 ± 0.127 (0.110 ± 0.005) 5.029 ± 0.127 (0.198 ± 0.005) 1.181 ± 0.076 (0.047 ± 0.003) 1.930 ± 0.381 (0.076 ± 0.015) 17.221 ± 0.254 (0.678 ± 0.010) 20.600 ± 0.254 (0.811 ± 0.010) 1.270 TYP (0.050 TYP) DIMENSIONS mm (inches)

For additional information please visit our website at: www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC1718-R05

©Copyright 2013, IXYS Integrated Circuits Division All rights reserved. Printed in USA.

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