NanoMas Technologies, Inc
NanoMas Technologies, Inc
Nanoparticle Inks
Nanoparticle Inks
for Printed Electronics
for Printed Electronics
Zhihao
Zhihao
Yang
Yang
President & CTO
President & CTO
NanoMas Technologies, Inc.
NanoMas Technologies, Inc.
[email protected]
[email protected]
Technology Revolutions in Electronics
Technology Revolutions in Electronics
for the Past 100 Years
for the Past 100 Years
•
•
Vacuum Tube Transistors: 1906
Vacuum Tube Transistors: 1906
by Lee De Forest
by Lee De Forest
•
•
Solid State Transistors: 1947 by
Solid State Transistors: 1947 by
John Bardeen and Walter
John Bardeen and Walter
Brattain (Bell Telephone
Brattain (Bell Telephone
Laboratories)
Laboratories)
•
•
Integrated Circuits: 1958 by Jack
Integrated Circuits: 1958 by Jack
Kilby
What Next?
What Next?
The industry has followed the prediction of Moore
The industry has followed the prediction of Moore
’
’
s Law
s Law
for the last 40 years without major technology revolution.
for the last 40 years without major technology revolution.
Moore
Moore
’
’
s Law
s Law
: The number of transistors per unit area is
: The number of transistors per unit area is
doubling every 1.5 years.
doubling every 1.5 years.
--
--
Gordon Moore (founder of
Gordon Moore (founder of
Intel Corporation).
Intel Corporation).
Moore
Moore
’
’
s Law is reaching its physical limit in next 5 to 10
s Law is reaching its physical limit in next 5 to 10
years.
years.
What will be the next technology revolution in the
What will be the next technology revolution in the
electronics industry?
electronics industry?
Pentacene organic circuits on polymeric or cloth substrates
Polymeric substrate AMLCD
a-Si:H active matrix Gamma ray detector on
polyimide substrate a-Si:H strain bridge array
Plastic solar cell
Low
Large Area & Flexible Displays
Large Area & Flexible Displays
World's thinnest flexible active-matrix display (Philips)
Flexible active matrix e-paper SVGA display (Plastic Logic)
World's first 3mm thick flexible digital watch (Citizen)
The plastic TFT-LCD display (Samsung)
Low
Low
-
-
cost RFIDs and Disposable Electronics
cost RFIDs and Disposable Electronics
Current cost: 7
Current cost: 7--10 cents per tag10 cents per tag Target cost: 1
Printed Electronics Manufacturing
Tremendous Market Growth Potential for
Tremendous Market Growth Potential for
Printed Electronics in Next 20 Years
Printed Electronics in Next 20 Years
Recent report by
Recent report by IDTechExIDTechEx predicts the PE market will reach $300B in 2027predicts the PE market will reach $300B in 2027
$0.0 $2,000.0 $4,000.0 $6,000.0 $8,000.0 $10,000.0 $12,000.0 $14,000.0 2006 2007 2008 2009 2010 2011 Year $ i n M il li o n
(Data from NanoMarkets LLC)
2011 Total PE Reveue $12,385 (in Million)
Printable Display, $3,801 RFID, $2,557 Printable Signage, $1,250 Printable Backplanes, $1,134 Printable Photovoltaic, $1,042 Other (21% Overall), $2,601
Highly conductive and high resolution patterns fabricated using
Highly conductive and high resolution patterns fabricated using lowlow--cost and cost and roll
roll--toto--roll processes (such as inkjet and gravure printing) are one of roll processes (such as inkjet and gravure printing) are one of the most the most critical technology components in making printed electronics and
critical technology components in making printed electronics and displaysdisplays
Market of Applications:
Market of Applications:
Flat panel display backplanes (TFT electrodes and busFlat panel display backplanes (TFT electrodes and bus--bars) bars)
EMI Shielding : plasma display, LCD, etc EMI Shielding : plasma display, LCD, etc
RFID tagsRFID tags
Electroluminescent lighting Electroluminescent lighting
Printed circuit boards (PCBs) Printed circuit boards (PCBs)
Touch screensTouch screens
Printed Conductors
Printed Conductors
NanoMas Solutions:
Make conducting patterns using
metal nanoparticle inks!
Technology Comparison for Printed Conductors
Technology Comparison for Printed Conductors
10 100 10-1 100 10-1 10-6 10-5 10-4 10-3 10-2 10 102 103 104 105 106 Conductive Polymers Carbon Nanotubes Sputtered ITO Resistivity Conductivity (Ohm-cm) (S/cm) Silver Micro-Powder Pastes
Evaporated Metals
Metal Nanoparticle Inks
Printable
Size
Size
-
-
Dependent Melting Point of Nanoparticles
Dependent Melting Point of Nanoparticles
2 3
2
b m s s l m s s lT
T
T
L
R
ρ
γ
γ
ρ
ρ
−
=
−
Ph.Ph. BuffatBuffat and Jand J--P. P. BorelBorel, , Phys. Phys. Rev. A,
Rev. A, 1313, 1976, 1976, 2287, 2287
Small particle size (in nanometers)
Small particle size (in nanometers)
significantly reduces the melting
significantly reduces the melting
temperature of NPs from the bulk
temperature of NPs from the bulk
melting point, allowing for very low
melting point, allowing for very low
processing temperatures (based on
processing temperatures (based on
surface melting) for sintering NPs
surface melting) for sintering NPs
into conducting films.
Nanoparticle Inks for Printed Electronics
Nanoparticle Inks for Printed Electronics
200 nm
Deposited Ag nanoparticles
Conductive Ag film on PET cured from printed nanoparticle inks
•
•
Nanoparticles can be stabilized in ink solutions by organic
Nanoparticles can be stabilized in ink solutions by organic
ligand
ligand
shells, which can be removed after printing.
shells, which can be removed after printing.
•
•
Nanoparticles can be further cured or sintered to highly conduct
Nanoparticles can be further cured or sintered to highly conduct
ive
ive
films at low temperatures.
films at low temperatures.
100-150°C 70-90°C
NanoMas Proprietary Technology: Producing High Quality
NanoMas Proprietary Technology: Producing High Quality
Nanoparticles
Nanoparticles
with Large
with Large
-
-
Scale and Low
Scale and Low
-
-
Cost Processes
Cost Processes
A 50L pilot production A 50L pilot production reactor at NanoMas reactor at NanoMas NanoMas NanoMas silver silver nanoparticles nanoparticles with 5 with 5--6 nm 6 nm in size (SEM) in size (SEM)
NanoMas Ag nanoparticle powders and inks
NanoMas Proprietary Printable Metal
NanoMas Proprietary Printable Metal
Nanoparticle Conductive Inks Technology
Nanoparticle Conductive Inks Technology
•
•
Unique all solution based nanoparticle synthesis technology
Unique all solution based nanoparticle synthesis technology
(patent pending), widely compatible with the low cost
(patent pending), widely compatible with the low cost
production processes in the chemical industry
production processes in the chemical industry
•
•
Low cost and fully scalable to large scale mass production
Low cost and fully scalable to large scale mass production
–
–
Scaled up to pilot production with a 50 litter reactor
Scaled up to pilot production with a 50 litter reactor
•
•
Ultra
Ultra
-
-
small nanoparticle size (2 to 10 nm) with specially
small nanoparticle size (2 to 10 nm) with specially
designed surface chemistry allows low annealing
designed surface chemistry allows low annealing
temperature, short process time, and high conductivity
temperature, short process time, and high conductivity
•
•
Variety of surface chemistry for different solvent dispersion
Variety of surface chemistry for different solvent dispersion
and applications
and applications
•
•
Low resistivity (as low as ~2.3 µΩ
Low resistivity (as low as ~2.3
µΩ
-
-
c
c
m, 1.5x of pure Ag)
m, 1.5x of pure Ag)
•
•
Low process temperature (as low as ~90
Low process temperature (as low as ~90
°
°
C) compatible with
C) compatible with
most plastic substrates
most plastic substrates
•
Nano-Au (4 nm) nanoparticle solution in cyclohexane Nano-Ag (5 nm) nanoparticle solution in cyclohexane Ag nanoparticles in cyclohexane (λmax~ 416 nm) Au nanoparticles in cyclohexane
UV-Vis Absorption Spectra of Au and Ag Nanoparticle Solutions
UV
UV
-
-
vis
vis
Characterization of NanoMas
Characterization of NanoMas
Gold and Silver Nanoparticles
Gold and Silver Nanoparticles
Nano-Ag
NanoMas Au Nanoparticles (<5 nm)
NanoMas Au Nanoparticles (<5 nm)
TEM
DSC
• DSC: exothermic sintering between 180ºC and 210ºC
• TGA: ~10-15% weight loss between 180ºC and 250ºC due to loss of surface capping agent
• DSC: exothermic sintering between 110ºC and 160ºC
• TGA: ~10% weight loss between 100ºC and 200ºC due to loss of surface capping agent
• Resistivity: 2.4 µΩ-cm (annealed at 150°C, 1.5x of bulk Ag)
ECD Distribution of ZHY-050616 by TEM
-0.05 0.00 0.05 0.10 0.15 0.20 0.25 0.30 1 10 100 ECD [nm] F re q u e n c y
Frequency Data Lognormal Fit
Metric Value Mean ECD [nm] 5.72 Std Dev ECD [nm] 1.79 Count 726 GMD ECD [nm] 5.43 GSD 1.41 Fit GMD [nm] 5.98 Fit GSD [nm] 1.24
TEM
NanoMas Ag Nanoparticles
NanoMas Ag Nanoparticles
Particle size: 6 ±1 nmDSC
sinteringCore radius: 23 ± 1 Ǻ Core radius σ: 5.5 Ǻ Shell thickness: 6 ±1 Ǻ sample
θ
detector Incident neutron Scattered neutronSmall Angle Neutron Scattering (SANS)
Small Angle Neutron Scattering (SANS)
Characterization of NanoMas Nano
Characterization of NanoMas Nano
-
-
Ag
Ag
SANS spectra confirmed that the Nano-Ag has an Ag core diameter of 4.6 ±1.1 nm and a 0.6 ±0.1 nm thick shell in solvent or a 0.3 nm shell in packed (solid) state.
-2.0 -1.5 -1.0 -0.5 -1.0 -0.5 0.0 0.5 1.0 In te n s it y ( c m -1 ) Log (Q) [A] SANS Data
Core-Shell Model Fitting
Core radius: 23 ± 1 Ǻ Core radius σ: 5.5 Ǻ Shell thickness: 6 ±1 Ǻ
SANS on Nano
SANS on Nano--Ag Solutions Ag Solutions (10 wt% in d (10 wt% in d--Toluene)Toluene) 0.05 0.10 0.15 0.20 0.25 0 1 2 3 4 5 In te n s it y ( c m -1 ) Q (A) Qmax= 0.120 Ǻ-1 interparticle distance ~ 5.2 nm
SANS of Packed Nano
Cabot PED (20-30 nm) Cima NanoTech (80-100 nm) NovaCentrix (~20 nm broad distribution) ManoMas (~ 5 nm)
Superior Performance of NanoMas
Superior Performance of NanoMas
NanoSilver
NanoSilver
Inks
Inks
due to the Ultra
due to the Ultra
-
-
Small Nanoparticle Size
Small Nanoparticle Size
25 20 15 10 5 0
R
e
si
st
iv
ity
(
µΩ
-c
m
)
250 200 150 100Annealing Temperature (C)
NanoMas
NanoAg (5 nm)
NanoAg (~25 nm)
from competitors
Ag bulk resistivity PET KaptonPrinted Conductive Patterns on Plastic Substrates
13.56 MHz RFID antenna printed on PET and polyimide
Inkjet Printed
Inkjet Printed
NanoSilver
NanoSilver
Contacts in
Contacts in
Fabricating a
Fabricating a
-
-
Si:H
Si:H
TFTs
TFTs
on Glass
on Glass
Source Drain Ag (~ 30 nm) Cr (~ 5 nm) n+ a-Si:H (~ 50 nm) a-Si:H (~ 200 nm) a-SiNx:H (~ 300 nm) Cr (~ 35 nm) Glass Substrate Probes -10 0 10 20 30 40 10-6 10-5 10-4 I DS ( A ) VGS (V) VDS = 40 V L = 110 um L = 140 um 0 100 200 I D S ( u A ) ~ 1.41 ~ 1.41 ~ 1.68 ~ 1.68 V VTT (V)(V) ~ 0.97 ~ 0.97 ~ 0.91 ~ 0.91 µ µ ((cmcm22/Vs/Vs)) 140 140 110 110 L ( L (µµm)m) * Data curtsey of Dr.
* Data curtsey of Dr. YongtaekYongtaek Hong of Hong of Seoul National University, Korea
Single crystal silicon gate Silicon dioxide gate dielectric
Ag
PQT
AgPrinted
Printed
NanoSilver
NanoSilver
Contacts in
Contacts in
Fabricating Organic
Fabricating Organic
TFTs
TFTs
•
• Organic Semiconductor: poly(3,3 Organic Semiconductor: poly(3,3 - -didodecyl
didodecyl--quaterthiophenequaterthiophene) or PQT) or PQT--1212 •
• Source and drain printed with NanoMas Source and drain printed with NanoMas NanoSilver
NanoSilver inks and annealed at 145inks and annealed at 145ººCC •
• Device channel length of ~43 um and Device channel length of ~43 um and width of ~300 um
width of ~300 um
•
• No obvious contact resistance No obvious contact resistance
* Data curtsey of Dr.
Inkjet Printed
Inkjet Printed
TFTs
TFTs
with
with
ZnO
ZnO
and Ag
and Ag
Nanoparticle Inks
Nanoparticle Inks
• Print or coat with ZnO nanoparticle ink
• Heat step at 200 C to anneal
• Print silver nanoparticles for source/drain,
and annealed at 150C
Mobilities: 0.1-0.15 cm
2/Vs
On/Off: ~10
5 1.0E-10 1.0E-09 1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 -30 -10 10 30 50 Vg L o g (I d ) 0.0E+00 2.0E-03 4.0E-03 6.0E-03 8.0E-03About Cost
About Cost
…
…
•
•
What Printed Electronics should shoot for are high
What Printed Electronics should shoot for are high
productivity, large size and volume, high flexibility, and
productivity, large size and volume, high flexibility, and
ultimately the LOW COST.
ultimately the LOW COST.
•
•
The nanoparticle inks should also be made by LOW COST
The nanoparticle inks should also be made by LOW COST
processes.
processes.
•
•
NanoMas makes sure all the nano
NanoMas makes sure all the nano
-
-
materials it makes can
materials it makes can
be mass produced with LOW COST processes.
be mass produced with LOW COST processes.
Lab
Functional
Functional Nanomaterials
Nanomaterials
•
•
Silver
Silver
nanoparticles
nanoparticles
•
•
Gold
Gold
nanoparticles
nanoparticles
•
•
Carbon
Carbon
nanotubes
nanotubes
•
•
Carbon
Carbon
nanofibers
nanofibers
•
•
Decorated carbon
Decorated carbon
nanotubes
nanotubes
•
•
Magnetic
Magnetic
nanoparticles
nanoparticles
•
•
Novel catalysts for making
Novel catalysts for making
carbon
carbon
nanomaterials
nanomaterials
NanoMas Technology and Product Roadmap
NanoMas Technology and Product Roadmap
•
•
NanoMas current products include
NanoMas current products include
NanoSilver
NanoSilver
™
™
and
and
NanoGold
NanoGold
™
™
conductive inks.
conductive inks.
•
•
Under development with its proprietary technology, NanoMas will
Under development with its proprietary technology, NanoMas will
also
also
provide inorganic nanoparticle and polymer semiconductor inks, a
provide inorganic nanoparticle and polymer semiconductor inks, a
s well
s well
as electroluminescent (EL or LED) inks for PE applications.
as electroluminescent (EL or LED) inks for PE applications.
•
•
NanoMas also has the technologies to mass produce high quality c
NanoMas also has the technologies to mass produce high quality c
arbon
arbon
nanotubes
nanotubes
and carbon
and carbon
nanofibers
nanofibers
.
.
Printable Electronics & Displays
Printable Electronics & Displays
•
•
Silver nanoparticle inks
Silver nanoparticle inks
•
•
Gold nanoparticle inks
Gold nanoparticle inks
•
•
EL
EL
nanoparticle inks
nanoparticle inks
•
•
Semiconductor nanoparticle inks
Semiconductor nanoparticle inks
•
•
Polymer semiconductor inks
Polymer semiconductor inks
•
•
Inorganic dielectric inks
Inorganic dielectric inks
•
•
Polymer dielectric inks
Polymer dielectric inks
Other
Other
Nanomaterials
Nanomaterials
Developed at
Developed at
NanoMas Technologies, Inc.
NanoMas Technologies, Inc
NanoMas Technologies, Inc
NanoMas Technologies, Inc. is an early stage start
NanoMas Technologies, Inc. is an early stage start
-
-
up company,
up company,
located in the Innovative Technologies Complex (ITC) on the camp
located in the Innovative Technologies Complex (ITC) on the camp
us of
us of
Binghamton University (SUNY) in Binghamton, New York, where is a
Binghamton University (SUNY) in Binghamton, New York, where is a
lso
lso
the home of Center for Advanced Microelectronics Manufacturing
the home of Center for Advanced Microelectronics Manufacturing
(CAMM), funded by the USDC to lead the development of next
(CAMM), funded by the USDC to lead the development of next
generation roll
generation roll
-
-
to
to
-
-
roll (R2R) microelectronics manufacturing.
roll (R2R) microelectronics manufacturing.
Innovative Technologies Complex
Innovative Technologies Complex
Suite 2109
Suite 2109
85 Murray Hill Road
85 Murray Hill Road
Vestal, NY 13850
Vestal, NY 13850
Phone: 607
Phone: 607--821821--42084208 Fax: 866
Fax: 866--367367--1128 (toll1128 (toll--free)free) Website: