smd man

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SMD

(SURFACE MOUNTED DEVICES) REPAIR(SURFACE MOUNTED DEVICES) REPAIR 11

SMD

(SURFACE MOUNTED DEVICES)

REPAIR

S. WIERZBINSKI

FEBRUARY 1999 FEBRUARY 1999

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SMD

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9 5.3. SMD CERAMIC MULTILAYER CHIP

5.3. SMD CERAMIC MULTILAYER CHIP

CAPACITORS

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4 5.5.1. DIMENSIONS OF SO - , VSO - , PLCC - AND

5.5.1. DIMENSIONS OF SO - , VSO - , PLCC - AND

QFB - CASES

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SMD

1. INTRODUCTION

At earlier eighties began a trend

At earlier eighties began a trend to replace a traditional through - to replace a traditional through - hole technique with thehole technique with the surface mounted technology (SMT) using surface mounted devices (SMD).

surface mounted technology (SMT) using surface mounted devices (SMD). The SMT, al-The SMT, al-though intended in principle for automatic manufacturing only expand more and more, though intended in principle for automatic manufacturing only expand more and more, eveneven into a hobby world. This trend will continue, because many new components are available in into a hobby world. This trend will continue, because many new components are available in SMD versions only. The

SMD versions only. The SMT technique opens advantages and new SMT technique opens advantages and new applications throughapplications through miniaturising of the compon

miniaturising of the components and increasing ents and increasing of reliability. The industry standof reliability. The industry standard unfortu-ard unfortu-nately allows that most of

nately allows that most of the SMD components does not have a the SMD components does not have a clear description. Since aclear description. Since a tiny size of the

tiny size of the components they are labelled with a code. Therefore a components they are labelled with a code. Therefore a sure identification ofsure identification of the components is impossible without appropriate technical documentation. Moreover the the components is impossible without appropriate technical documentation. Moreover the polarity and pin - outs of different components cou

polarity and pin - outs of different components could ld be not identified withbe not identified without data sheets.out data sheets. Since all of this factors is SMD for beginners a very hard job.

Since all of this factors is SMD for beginners a very hard job. This brochure brings a help and clearance for

This brochure brings a help and clearance for a newcomer and moreover should help aa newcomer and moreover should help a service technician to start a repair of the instruments made with the SMD components. It service technician to start a repair of the instruments made with the SMD components. It presents most of the SMD

presents most of the SMD components availablcomponents available at the e at the 1998 end with pin-outs and encoding1998 end with pin-outs and encoding comparison tables: SMD / classic and classic /

comparison tables: SMD / classic and classic / SMD. The SMD does not SMD. The SMD does not present a “newpresent a “new technique”, it is only a miniaturisation of the components. But this components requires a technique”, it is only a miniaturisation of the components. But this components requires a different processing technology.

different processing technology. Surface mounted devices (SMD) are

Surface mounted devices (SMD) are active and passive electronics components withoutactive and passive electronics components without conventional connecting wires.

conventional connecting wires. In the conventional through - hole

In the conventional through - hole technology (THT) the components are placed on ttechnology (THT) the components are placed on thehe “components side” of the printed circuit board (PCB),

“components side” of the printed circuit board (PCB), wires inserted into holes, and solderedwires inserted into holes, and soldered to the copper pads on the opposite, “solder side” of the PCB.

to the copper pads on the opposite, “solder side” of the PCB. The SMD components will be placed on the

The SMD components will be placed on the “solder side” of the PCB “solder side” of the PCB and their metal capsand their metal caps soldered to the copper pads of the PCB. Therefore both layers of the PCB

soldered to the copper pads of the PCB. Therefore both layers of the PCB could be used ascould be used as active areas. A thickness of PCBs used for SMD is between 0.8 and 1.00 mm. Historically active areas. A thickness of PCBs used for SMD is between 0.8 and 1.00 mm. Historically roots of SMD are hybrid circuits on the ceramic substrates (middle of seventies) but a huge roots of SMD are hybrid circuits on the ceramic substrates (middle of seventies) but a huge industrial a

industrial applications opplications of SMD started f SMD started on a begin eion a begin eighties.ghties. Miniaturisation of the SMD does not stop.

Miniaturisation of the SMD does not stop. Distance between connection pins is reduced toDistance between connection pins is reduced to 0.5 mm (past standard 1.27 mm). The winning standard for capacitors and resistors is

0.5 mm (past standard 1.27 mm). The winning standard for capacitors and resistors is 04020402 (1.0 x 0.5 mm). The

(1.0 x 0.5 mm). The 04020402 standard requires ten times less area standard requires ten times less area then standardthen standard 12081208 and fiveand five times less then standard

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SMD

2. SMD ADVANTAGES

1.

1. PCBs area mPCBs area much smaller uch smaller then by cothen by conventional thnventional through - hrough - hole componenole components.ts. 2.

2. Since the both laySince the both layers of the PCB coulers of the PCB could be used for asd be used for assembling the finasembling the final PCBs area forl PCBs area for the same circuits could be

the same circuits could be decreased by 50 %.decreased by 50 %. 3.

3. Simple asseSimple assembling - mbling - no boundno bounding and ing and cutting of cutting of the wires.the wires. 4.

4. Automatic asseAutomatic assembling vembling very easy. ry easy. Low cost Low cost of the of the assembling.assembling. 5.

5. Small size of compSmall size of components makes very onents makes very high packing high packing density possibledensity possible. For the same cir-. For the same cir-cuits a volume of

cuits a volume of a module assembled with SMD could be reduced to 30 a module assembled with SMD could be reduced to 30 % of the % of the devicedevice assembled with the conventional technique. Therefore a size of

assembled with the conventional technique. Therefore a size of the whole instrument de-the whole instrument de-crease, too.

crease, too. 6.

6. Very high Very high resistance to resistance to mechanical mechanical shock and shock and vibration.vibration. 7.

7. Low store Low store and transand transport cost. port cost. Low store Low store area and area and volume.volume. 8.

8. Lack oLack of holf hole’s de’s drilling rilling and and metallisation.metallisation. 9.

9. Thin Thin pads.pads.

10. For great series low manufacturing cost. 10. For great series low manufacturing cost.

3. SMD LIMITATIONS

The real goal of

The real goal of the SMD applications are a maximal packing density and finally volume re-the SMD applications are a maximal packing density and finally volume re-duction of the modules and instruments. Exactly

duction of the modules and instruments. Exactly this generates for which responsible are notthis generates for which responsible are not the SMD themse

the SMD themselves, but lves, but the miniaturisatiothe miniaturisation in general.n in general. 1.

1. Using ICs wiUsing ICs with a high th a high amount of the amount of the pins (raster 0.5 pins (raster 0.5 to 1.27 mm, mto 1.27 mm, max. 148 pins) ax. 148 pins) makesmakes placing of the paths between IC

placing of the paths between IC pins impossible.pins impossible. 2.

2. Design of SMD Design of SMD layout is very clayout is very complex. Distancomplex. Distances between soles between soldering pads dering pads are fix. Di-are fix. Di-mensions and distances between paths depends from soldering technology used by mensions and distances between paths depends from soldering technology used by manufacturer.

manufacturer. 3.

3. High packing High packing density bringdensity brings thermal pros thermal problems. Power blems. Power dissipation dissipation of the poweof the power compo-r compo-nents is transferred directly through a copper layer of the PCB. The high

nents is transferred directly through a copper layer of the PCB. The high temperature oftemperature of the layer influence a neighbour components.

the layer influence a neighbour components. 4.

4. Lack oLack of the f the general general SMD nSMD normalisation.ormalisation. 5.

5. Not all SMD coNot all SMD components are lmponents are labelled with abelled with a clear text. Mora clear text. Moreover, very often eover, very often the compo-the compo-nents have no labels at all.

nents have no labels at all. 6.

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SMD

4. SMD DIALECT

SMD

SMD SSurfaceurface MMountedounted DDevicesevices (active, passive and

(active, passive and electromechanicelectromechanical components)al components)

SMT

SMT SSurfaceurface MMountedounted TTechnologyechnology (assembling and montage t

(assembling and montage technology)echnology)

SMA

SMA SSurfaceurface MMountedounted TTechnologyechnology (module assembled with SMT) (module assembled with SMT)

SMD / C

SMD / C SSurfaceurface MMountedounted DDevices / evices / CComponentsomponents ((ccomponents omponents for for SMT)SMT)

SMP

SMP SSurfaceurface MMountedounted PPackagesackages (SMD case forms)

(SMD case forms)

SME

SME SSurfaceurface MMountedounted EEquipmentquipment (SMT assembling machines) (SMT assembling machines)

SO

SO SSmallmall OOutlineutline (4 to 28 pins) (4 to 28 pins)

VSO

VSO VVeryery SSmallmall OOutlineutline (40 pins)

(40 pins)

SOP

SOP SSmallmall OOutlineutline PPackageackage (case)

(case)

SOD

SOD SSmallmall OOutlineutline DDiodeiode

SOT

SOT SSmallmall OOutlineutline TTransistorransistor

S

SOOIICC SSmallmall OOutlineutline IIntegratedntegrated CCircuitircuit

CC

CC CChiphip CCarrierarrier

LCC

LCC LLeadlesseadless CChiphip CCarrierarrier

PLCC

PLCC PPlasticlastic LLeadlesseadless CChiphip CCarrierarrier

LCCC

LCCC LLeadlesseadless CCeramiceramic CChiphip CCarrierarrier

MELF

MELF MMetaletal EElectrodelectrode FFaceace BBondingonding

M

MIINNI I MMEELLFF MMiinnii MMetaletal EElectrodelectrode FFaceace BBondingonding

M

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SMD

5. 5. SMD

SMD SIZES AND DIMENSIONS

SIZES AND DIMENSIONS

The coded

The coded description of the any SMD case form consists four digits which represents adescription of the any SMD case form consists four digits which represents a length and a width in 1/100” (2.54 mm).

length and a width in 1/100” (2.54 mm). Length of the chip

Length of the chip

x

x x x x x xx

Width of the chip Width of the chip EXAMPLE: EXAMPLE: Form 0805 Form 0805 L Leennggtthh 2255..4 4 mmm m x x 00..008 8 = = 22..00332 2 mmmm W Wiiddtthh 2255..4 4 mmm m x x 00..005 5 = = 11..227 7 mmmm

5.1. SMD RESISTORS

Table 5.1.1.

Table 5.1.1. Dimensions of the thick film chip resistorsDimensions of the thick film chip resistors F FOORRMM PPOOWWEERR (Watt) (Watt) LENGHT LENGHT (mm) (mm) WIDTH WIDTH (mm) (mm) 0 0440022 00..006633 11..00 00..55 0 0550033 00..006633 11..2277 00..7755 0 0550055 11..2277 11..2255 0 0660033 00..006622 11..6600 00..8800 0 0770055 11..9911 11..2277 0 0880055 00..11 22..0000 11..2255 1 1000055 00..112255 22..5555 11..2255 1 1001100 22..5555 22..5555 1 1220066 00..2255 33..22 11..66 1 1221100 00..2255 33..22 22..66 1 1550055 33..88 11..2255 2 2001100 00..55 55..0088 22..5555 2 2220088 55..7722 11..9900 2 2551122 11..00 66..55 33..2255 M MEELLFF 55..55 22..22 M MIINNIIMMEELLFF 33..66 11..44 M MIICCRROOMMEELLFF 22..00 11..2277

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SMD

SMD resistors are available as a chip (rectangular form), or as a MELF (cylinder form). In SMD resistors are available as a chip (rectangular form), or as a MELF (cylinder form). In SMT instead of the jumpers “zero

SMT instead of the jumpers “zero ΩΩ resistors” are used. They are available in all resistors” are used. They are available in all standardstandard SMD resistors dimensions and coded mostly

SMD resistors dimensions and coded mostly with “000”.with “000”. The most popular resistors case forms are

The most popular resistors case forms are 12061206 (l = 3.2 mm, w = 1.6 mm, h = 0.6 mm,(l = 3.2 mm, w = 1.6 mm, h = 0.6 mm, Pmax =0.25 W by 70

Pmax =0.25 W by 70oo) and) and 08050805 (l = 2 mm, w = 1.25 mm, Pmax = 0.125 W by 70(l = 2 mm, w = 1.25 mm, Pmax = 0.125 W by 70oo).).

The rectangular chip forms are the same as for capacitors and could be processed by layout The rectangular chip forms are the same as for capacitors and could be processed by layout design, assembling and repair with the same rules.

design, assembling and repair with the same rules. The resistance values range is between 1

The resistance values range is between 1 ΩΩ and 10 Mand 10 MΩΩ and “zeroand “zero ΩΩ” jumper.” jumper.

5.1.1. CONSTRUCTION OF THE SMD RESISTORS

Chip resistors are constructed with use of the thick film technique on a ceramic substrate. Chip resistors are constructed with use of the thick film technique on a ceramic substrate. They have metallic areas on the narrow ends

They have metallic areas on the narrow ends of the chip, which allows soldering. The resis-of the chip, which allows soldering. The resis-tive path is covered with a

tive path is covered with a protective glaze. Chip resistors could be soldered with all commonprotective glaze. Chip resistors could be soldered with all common soldering techniques: reflow, wave and solder

soldering techniques: reflow, wave and solder iron.iron.

5.1.2. MARKING OF THE SMD RESISTORS

5% and 2% SMD chip resistors are

5% and 2% SMD chip resistors are available in values accordinavailable in values according to IEC g to IEC E 24 line andE 24 line and marked with the following code:

marked with the following code: Table 5.1.2.1.

Table 5.1.2.1. 5% and 2% resistors code5% and 2% resistors code R

REESSIISSTTOORR IIMMPPRRIINNTT 0 0ΩΩ (bridge)(bridge) 000000 1.0 1.0 ΩΩ to 9.1to 9.1 ΩΩ XRX XRX (i.e. (i.e. 9R1)9R1) 10 10 ΩΩ to 91to 91 ΩΩ XXR XXR (i.e. (i.e. 91R)91R) 100

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SMD

Table 5.1.2.2.

Table 5.1.2.2. ExamplesExamples 4 7 3

4 7 3

A = 1

A = 1stst digit of the resistor’s valuedigit of the resistor’s value B = 2

B = 2ndnddigit of the resistor’s valuedigit of the resistor’s value A

A B B C C C C = = number number of of zeroszeros

IIMMPPRRIINNTT RREESSIISSTTAANNCCE E VVAALLUUEE 101 101 100100ΩΩ 471 471 470470ΩΩ 102 102 1 k1 kΩΩ 122 122 1.2 k1.2 kΩΩ 103 103 10 k10 kΩΩ 123 123 12 k12 kΩΩ 104 104 100 k100 kΩΩ 124 124 120 k120 kΩΩ 474 474 470 k470 kΩΩ

1% SMD chip resistors are coded with 3

1% SMD chip resistors are coded with 3 - or 4 - or 4 - digits. Available values in line E24 (E96).- digits. Available values in line E24 (E96). Table 5.1.2.3.

Table 5.1.2.3. 1% resistor code1% resistor code R

REESSIISSTTOORR IIMMPPRRIINNTT 100

100 ΩΩ to 988to 988 ΩΩ XXXRXXXR

1 k

1 kΩΩ to to 1 1 MMΩΩ XXXXXXXX Table 5.1.2.4.

Table 5.1.2.4. ExamplesExamples 4

4 7 7 3 3 2 2 A A = = 11stst digit of the resistor’s valuedigit of the resistor’s value B = 2

B = 2ndnddigit of the resistor’s valuedigit of the resistor’s value C = 3

C = 3thth digit of the resistor’s valuedigit of the resistor’s value A

A B CB C D D D D = = nunumbmber er of of zezeroross

IIMMPPRRIINNTT RREESSIISSTTAANNCCE E VVAALLUUEE 100R 100R 100100ΩΩ 634R 634R 634634ΩΩ 909R 909R 909909ΩΩ 1001 1001 1k1kΩΩ 4701 4701 4.7 k4.7 kΩΩ 1002 1002 10 k10 kΩΩ 1502 1502 15 k15 kΩΩ 5493 5493 1549 k1549 kΩΩ 1004 1004 1 M1 MΩΩ

MELF resistors are available in the three

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SMD

M

MELELFF foform rm 0202004, 4, l=l=55.9 .9 mmmm, d, d=2=2.2 .2 mmmm M

MININIMIMELELFF foform rm 0202004, 4, l=l=33.5 .5 mmmm, d, d=1=1.5 .5 mmmm M

MICICRROOMEMELLFF foform rm 0202007, 7, l=l=22.2 .2 mmmm, d, d=1=1.1 .1 mmmm

Resistance’s value of the MELF resistors are marked with the standard 4 or 5 rings code Resistance’s value of the MELF resistors are marked with the standard 4 or 5 rings code used by conventional resistors. MELF resistors are available in IEC E24, E96 and E192 used by conventional resistors. MELF resistors are available in IEC E24, E96 and E192 lines, but not

lines, but not all tolerances are available.all tolerances are available. “Zero

“Zero ΩΩ resistors” are available. Maximum load current is 2 A. resistors” are available. Maximum load current is 2 A. The labels are “000” or The labels are “000” or “0R0”.“0R0”. Table 5.1.2.5.

Table 5.1.2.5. International resistors colour codeInternational resistors colour code 4-COLORS CODE 4-COLORS CODE 5-COLORS CODE 5-COLORS CODE 1 RING 1 RING 1 RING 1 RING 2 RING 2 RING 2 - 3 RING 2 - 3 RING 3 RING 3 RING 4 RING 4 RING 4 RING 4 RING 5 RING 5 RING TOLERANCE TOLERANCE b

bllaacckk 00 00 -- viiovolleett 0.1%*1000.1%*100ΩΩ-100k-100kΩΩ

b brroowwnn 11 11 00 bllubuee 0.25%*470.25%*47ΩΩ-100k-100kΩΩ rreedd 22 22 0000 grreg eeenn 0.5%*100.5%*10ΩΩ-330k-330kΩΩ o orraannggee 33 33 000000 bbrroowwnn 1%*11%*1ΩΩ-5.1M-5.1MΩΩ y yeellllooww 44 44 00000000 rreedd 2%*12%*1ΩΩ-10M-10MΩΩ g grreeeenn 55 55 0000000000 ggoolldd 5%*0.22-10M5%*0.22-10MΩΩ b blluuee 66 66 000000000000 v

viioolleett 77 77 g

grreeyy 88 88

5.2. TRIMMPOTS

SMD trimmpots are available in two different mechanical cases: t

SMD trimmpots are available in two different mechanical cases: three and four pins. Thehree and four pins. The fourth pin serves as a

fourth pin serves as a mechanical support only. The power dissipation of the SMD trimmpotmechanical support only. The power dissipation of the SMD trimmpot is 0.2 W.

is 0.2 W. The slide could be The slide could be turned a full angle turned a full angle of 360of 360oo, but active angle is 270, but active angle is 270oo only. Theonly. The rest 90

rest 90oo is a ”dead zone”, where the slide has no contact to a resistance path. The value ofis a ”dead zone”, where the slide has no contact to a resistance path. The value of resistance vary between 100

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SMD

5.3. CERAMIC MULTILAYER CHIP CAPACITORS

Ceramic multilayer chip capacitors are available with a very wide range of values, from 0.47 Ceramic multilayer chip capacitors are available with a very wide range of values, from 0.47 pF to 1

pF to 1 µµF. This values are covered by seven cases forms. The forms depends of tF. This values are covered by seven cases forms. The forms depends of the ca-he ca-pacitors values. The most popular case are

pacitors values. The most popular case are 08050805 andand 12061206. . Unfortunately Unfortunately this this componentscomponents are not marked, either with digital values, or colour code. This fact does not represent any are not marked, either with digital values, or colour code. This fact does not represent any problem for industry, where the components are assembled from the roll, but is very problem for industry, where the components are assembled from the roll, but is very danger-ous for the service

ous for the service technician.technician.

Be very careful with non-marked components! Avoid mixing them! Be very careful with non-marked components! Avoid mixing them! Table 5.3.1.

Table 5.3.1. Ceramic multilayer chip capacitors case forms.Ceramic multilayer chip capacitors case forms. B B LL H H A A C CAASSE E FFOORRMM L L ((mmmm)) B B ((mmmm)) H H ((mmmm)) A A ((mmmm)) 0 0550088 22..00 11..2255 00..551 1 tto o 11..2277 0..2025 5 tto o 00..7755 0 0660033 11..66 00..88 00..8800 1 1220066 33..22 11..66 00..551 1 tto o 11..66 00..225 5 tto o 00..7755 1 1221100 33..22 22..55 00..551 1 tto o 11..99 00..3 3 tto o 11..00 1 1880088 44..55 22..00 00..551 1 tto o 11..99 00..3 3 tto o 11..00 1 1881122 44..55 33..55 00..551 1 tto o 11..99 00..3 3 tto o 11..00 2 2222200 55..77 55..00 00..551 1 tto o 11..99 00..3 3 tto o 11..00

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SMD

5.4. SMD TANTALIUM CAPACITORS

SMD tantalum capacitors are available in different case forms, partly without printed SMD tantalum capacitors are available in different case forms, partly without printed values. The + polarity is marked by white line, or white “M”. The case forms depend values. The + polarity is marked by white line, or white “M”. The case forms depend of capacitance value and nominal voltage.

of capacitance value and nominal voltage. SMD tantalum capacitors standard sizes are: SMD tantalum capacitors standard sizes are:

•• 3.2 x 1.8 mm3.2 x 1.8 mm

•• 3.5 x 2.8 mm3.5 x 2.8 mm

•• 6.0 x 3.2 mm6.0 x 3.2 mm

•• 7.3 x 4.3 mm7.3 x 4.3 mm

The values are coded with digits, or

The values are coded with digits, or with alphanumerical characters.with alphanumerical characters.

CODING WITH DIGITS: CODING WITH DIGITS:

•• first position gives the first digit of the capacitance valuefirst position gives the first digit of the capacitance value

•• second position gives the second digit of second position gives the second digit of the capacitance valuethe capacitance value

•• third position gives the number of zeros for value in pFthird position gives the number of zeros for value in pF EXAMPLE:

EXAMPLE:

Description “224” means 220 000 pF = 220 nF = 0.22 Description “224” means 220 000 pF = 220 nF = 0.22 µµFF CODING WITH ALPHANUMERICAL CHARACTERS: CODING WITH ALPHANUMERICAL CHARACTERS:

CAPACITANCE CODE CAPACITANCE CODE CAPACITANCE CAPACITANCE (pF) (pF) 1 1 11..55 22..22 33..33 44..77 66..88 C COODDEE AA EE JJ NN SS WW M MUULLTTIIPPLLIICCAATTOORR 110055 101066 C COODDEE 55 66

NOMINAL VOLTAGE CODE NOMINAL VOLTAGE CODE V

VOOLLTT 44 66..33 1100 1166 2200 2255 3355 C

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SMD

1 EXAMPLE: 1 EXAMPLE: 1.0 1.0 µµF, 16 V …… CA*F, 16 V …… CA* 0.22 0.22 µµF, 35 V ….. VJ*F, 35 V ….. VJ* 2.2 2.2 µµF, 6.3 V ……JJ*F, 6.3 V ……JJ*

+

C C A A GG

--N NOOMMIINNAALL CCAAPPAACCIITTAANNCCEE VOLTAGE VOLTAGE 2 EXAMPLE: 2 EXAMPLE: A6 …… 1.0 x 10 A6 …… 1.0 x 1066 pF = 1.0pF = 1.0 µµFF J5 ……. 2.2 x 10 J5 ……. 2.2 x 1055 pF pF = = 0.220.22 µµFF J6 ……. 2.2 x 10 J6 ……. 2.2 x 1066 pF = 2.2pF = 2.2 µµFF CAPACITANCE CAPACITANCE A A 66

+

--3 3 5 5 VV NOMINAL NOMINAL VOLTAGE VOLTAGE

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SMD

5.4. SMD DIODES AND TRANSISTORS

Almost all standard diodes and tr

Almost all standard diodes and transistors are available as SMD components inansistors are available as SMD components in SOT - 23, SOT - 89 and SOT - 143 cases. In general electrical parameters of SMD SOT - 23, SOT - 89 and SOT - 143 cases. In general electrical parameters of SMD diodes and transistors are the

diodes and transistors are the same as comparable standard types in same as comparable standard types in conventionalconventional cases. SOT - 23, and SOT - 143 cases are used for components with power cases. SOT - 23, and SOT - 143 cases are used for components with power dissipa-tion 200 to 400 mW. SOT - 89 cases are used for power dissipadissipa-tion 500 mW to 1W. tion 200 to 400 mW. SOT - 89 cases are used for power dissipation 500 mW to 1W. SMD LEDs are available in SOT -

SMD LEDs are available in SOT - 23 cases. All SMD transistors are 23 cases. All SMD transistors are marked withmarked with codes.

codes.

Figure 5.4.1.

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SMD

Table 5.4.1

Table 5.4.1 Examples of SMD transistors coding.Examples of SMD transistors coding. M MAARRKK CCOOMMPPOONNEENNTT CCAASSEE 1 1JJ BBCC884488AA SSOOTT --2233 4 4GG BBCC886600CC SSOOTT --2233 1 1FF** MMMMBBTT55555500 SSOOTT --2233 1 1FF** BBCC884477BB SSOOTT --2233 A AAA** BBCCWW6600AA SSOOTT --2233 A AAA** BBCCXX5511 SSOOTT --8899 * Hint * Hint

The same mark does not means the same component! The same mark does not means the same component!

If SMD transistors with the same marks have different case forms their technical If SMD transistors with the same marks have different case forms their technical specifications are different as well!

specifications are different as well!

5.5. SMD INTEGRATED CIRCUITS

The first SMD ICs

The first SMD ICs were manufactured on begin 70’ for hybrid were manufactured on begin 70’ for hybrid technique. Nowadaystechnique. Nowadays (February 1999) are many of new

(February 1999) are many of new ICs design manufactured in SMD only.ICs design manufactured in SMD only. ICs in SMD cases are electrically f

ICs in SMD cases are electrically fully compatible to types in DIL ully compatible to types in DIL cases thereforecases therefore both of them have the same marking. The different for SMD (SO-xx case )is only the both of them have the same marking. The different for SMD (SO-xx case )is only the last character of the mark; i.e. LM 324 N (DIL) = LM 324 D (SO).

last character of the mark; i.e. LM 324 N (DIL) = LM 324 D (SO). SO cases are produced with two different pin forms:

SO cases are produced with two different pin forms: 1. pins bent outside of the case

1. pins bent outside of the case 2. pins bent under the case 2. pins bent under the case

Fig. 5.5.1.

Fig. 5.5.1. SO case forms.SO case forms.

Pin 1 is marked by a white line on a top of the case or a cut on a front of the case Pin 1 is marked by a white line on a top of the case or a cut on a front of the case (see Fig. 6.5.2).

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Fig. 5.5.2.

Fig. 5.5.2. Pin 1 marking.Pin 1 marking.

Different case types have different pin forms and pinout. Different case types have different pin forms and pinout. SO (Small Outline)

SO (Small Outline) is used for Ics with 8 to 28 pins. Pins raster is 1.27 mm. Caseis used for Ics with 8 to 28 pins. Pins raster is 1.27 mm. Case width is 4 mm for 8, 14 and 16 pins cases and 7.6 mm for 8, 16, 20, 24 and 28 pins width is 4 mm for 8, 14 and 16 pins cases and 7.6 mm for 8, 16, 20, 24 and 28 pins cases.

cases.

VSO (Very Small Outline)

VSO (Very Small Outline) is used for ICs with more than 28 pins. Pins raster is 0.76is used for ICs with more than 28 pins. Pins raster is 0.76 mm or 0.75 mm (check data sheets of the particular IC).

mm or 0.75 mm (check data sheets of the particular IC).

PLCC (Plastic Leaded Chip Carrier)

PLCC (Plastic Leaded Chip Carrier) cases are used for ICs with more than 28 pinscases are used for ICs with more than 28 pins (i.e. 44 pins). Pins are placed on the all four sides on the case and bent under it. The (i.e. 44 pins). Pins are placed on the all four sides on the case and bent under it. The form of pins gives relati

form of pins gives relative high resistance of the PLCC case against ve high resistance of the PLCC case against mechanical in-mechanical in-fluence. Negative is relative high case (4.57 mm standard) and localisation of the fluence. Negative is relative high case (4.57 mm standard) and localisation of the solder paths with pins raster 1.27 mm under the case. The soldering and following solder paths with pins raster 1.27 mm under the case. The soldering and following optical quality control of the connections are difficult.

optical quality control of the connections are difficult.

Number of pins is given in description of the case, i.e. PLCC - 20 means that the IC Number of pins is given in description of the case, i.e. PLCC - 20 means that the IC has 20 pins.

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Pin 1 mark Pin 1 mark

Table 5.5.3.

Table 5.5.3. PLCC - 44 case.PLCC - 44 case.

QFP (Quad Flat Pack Case)

QFP (Quad Flat Pack Case). In opposite to PLCC case the pins are bent outside of. In opposite to PLCC case the pins are bent outside of the case. Since it could have a very small raster (1 mm, 0.85 mm, 0.75 mm and 0.65 the case. Since it could have a very small raster (1 mm, 0.85 mm, 0.75 mm and 0.65 mm) it represents a very compact case with

mm) it represents a very compact case with very high count of pins (over 100).very high count of pins (over 100).

Table 5.5.4.

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5.5.1. DIMENSIONS OF SO , VSO , PLCC AND QFB

-CASES

CASES

Table 5.5.1.1 Table 5.5.1.1 C CAASSEE NNUUMMBBEER R OOFF PINS PINS WIDTH WIDTH (mm) (mm) LENGHT LENGHT (mm) (mm) RASTER RASTER (mm) (mm) S SOO -- 88 88 4..04 0 55..00 11..2277 S SOO -- 88LL 88 77..66 77..66 11..2277 S SOO -- 1144 1144 44..00 88..7755 11..2277 S SOO -- 1166 1166 44..00 1100..00 11..2277 S SOO -- 1166LL 1166 77..66 1100..55 11..2277 S SOO -- 2200LL 2200 77..66 1133..00 11..2277 S SOO -- 2244LL 2244 77..66 1155..66 11..2277 S SOO -- 2288LL 2288 77..66 1188..11 11..2277 V VSSOO -- 4400 4400 77..66 1155..55 00..7766 V VSSOO -- 5566 5566 1111..11 2211..66 00..7755 P PLLCCC C - - 2200 2200 99..0044 99..0044 11..2277 P PLLCCC C - - 2288 2288 1111..5588 1111..5588 11..2277 P PLLCCC C - - 4444 4444 1616..6666 1166..6666 11..2277 P PLLCCC C - - 5522 5522 1199..22 1199..22 11..2277 P PLLCCC C - - 6666 6666 2424..3333 2244..3333 11..2277 P PLLCCC C - - 8844 8844 2929..4411 2299..4411 11..2277 Q QFFBB -- 4444 4444 1144 1144 11..00 Q QFFBB -- 4488 4488 1100 1100 00..7755

“L” cases are around 4 mm wider than normal SO cases. The dimensions of plastic “L” cases are around 4 mm wider than normal SO cases. The dimensions of plastic cases could vary, but raster and connection width

smd man

SMD

SMD

SMD

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(SURFACE MOUNTED DEVICES)

(SURFACE MOUNTED DEVICES)

REPAIR

REPAIR

S. WIERZBINSKI

S. WIERZBINSKI

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SMD

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