UniRAN 14/GUL Multi-Mode
UniRAN 14/GUL Multi-Mode
ZXSDR B8200 Product Description
ZXSDR B8200 Product Description
Version
Version DateDate Author Author Reviewer Reviewer NotesNotes
V1.00 2015-12-25
V1.00 2015-12-25 DongDong
Chuanghong Chuanghong
Chen Yong, Yang Chen Yong, Yang Xu, Xin Shengli Xu, Xin Shengli
First release. It supports 3GPP R11, BPN2 First release. It supports 3GPP R11, BPN2 are introduced, CCE1/SA/SE support GUL are introduced, CCE1/SA/SE support GUL multi-mode, 32 dry contacts are available, multi-mode, 32 dry contacts are available, CCE1 UMTS CNBAP processing CCE1 UMTS CNBAP processing capability=3000/s. capability=3000/s. V1.10 2016-03-30 V1.10 2016-03-30 DongDong Chuanghong Chuanghong
Chen Yong, Yang Chen Yong, Yang Xu, Xin Shengli
Xu, Xin Shengli Add FS5A/PM5. Add FS5A/PM5.
© 2016 ZTE Corporation. All rights reserved. © 2016 ZTE Corporation. All rights reserved.
ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used without the prior written
without the prior written permission of ZTE.permission of ZTE.
Due to update and improvement of ZTE products and technologies, information in this document is subjected to Due to update and improvement of ZTE products and technologies, information in this document is subjected to change without notice.
TABLE OF CONTENTS
TABLE OF CONTENTS
1
1
Over
Overview
view ...
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... 5
5
1.1
1.1
Intro
Introducti
duction
on ...
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... 5
5
1.2
1.2
Bene
Benefits
fits ...
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... 5
5
1.3
1.3
Application
Application Scenarios ...
Scenarios ... ...
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... 6
... 6
2
2
Product Architecture ... 8
Product Architecture ... 8
2.1
2.1
Physical Structure ... 8
Physical Structure ... 8
2.2
2.2
Hardware Structure ... 9
Hardware Structure ... 9
2.2.1
2.2.1
Control & Clock Board (CC) ... 9
Control & Clock Board (CC) ... 9
2.2.2
2.2.2
Baseband Processing Board ... 13
Baseband Processing Board ... 13
2.2.3
2.2.3
Fabric Switch Board (FS) ... 18
Fabric Switch Board (FS) ... 18
2.2.4
2.2.4
Site Alarm Board (SA/SE) ... 20
Site Alarm Board (SA/SE) ... 20
2.2.5
2.2.5
Universal Ethernet Switch Board (UES) ... 22
Universal Ethernet Switch Board (UES) ... 22
2.2.6
2.2.6
Universal Clo
Universal Clock Interface Board (UCI/UCI-C)
ck Interface Board (UCI/UCI-C) ...
...
...
...
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... 23
... 23
2.2.7
2.2.7
Tower mounted Amplifier control Module (TAM) ... 24
Tower mounted Amplifier control Module (TAM) ... 24
2.2.8
2.2.8
Power Module (PM) ... 25
Power Module (PM) ... 25
2.2.9
2.2.9
Fan A
Fan Array M
rray Module
odule (FAM)
(FAM) ...
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...
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... 26
... 26
2.3
2.3
Software Architecture ... 27
Software Architecture ... 27
2.4
2.4
Func
Functiona
tionality
lity ...
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... 28
28
3
3
Technical Specifications ... 30
Technical Specifications ... 30
3.1
3.1
Physical Indices ... 30
Physical Indices ... 30
3.2
3.2
Capacity Indices ... 30
Capacity Indices ... 30
3.3
3.3
Pow
Power
er Indi
Indices
ces ...
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. 31
31
3.3.1
3.3.1
Pow
Power
er Supp
Supply ...
ly ...
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... 31
31
3.3.2
3.3.2
Power Consumption ... 31
Power Consumption ... 31
3.4
3.4
Interface Indices ... 31
Interface Indices ... 31
3.5
3.5
Environment Indices ... 33
Environment Indices ... 33
3.6
3.6
Electromagnetic Compatibility Indices ... 33
Electromagnetic Compatibility Indices ... 33
3.7
3.7
Reliability Indices ... 33
Reliability Indices ... 33
4
4
Configurations Principles ... 35
Configurations Principles ... 35
5
FIGURES
Figure 1-1 B8200 in the GSM/UMTS/LTE Network ... 5
Figure 1-2 B8200 Application Scenario ... 7
Figure 2-1 Baseband Unit -- ZXSDR B8200 ... 8
Figure 2-2 B8200 Hardware Structure ... 9
Figure 2-3 CC Panel ... 9
Figure 2-4 UBPG/UBPG3 Panel ...13
Figure 2-5 BPK_e1/BPK_e/BPK_d Panel ...14
Figure 2-6 BPL1A/BPL1/BPN0A/BPN0 Panel ...15
Figure 2-7 BPN2 Panel ...17
Figure 2-8 FS Panel ...18
Figure 2-9 SA Panel...20
Figure 2-10 SE Panel...21
Figure 2-11 UES Panel ...22
Figure 2-12 UCI/UCI-C Panel ...23
Figure 2-13 TAM Panel ...24
Figure 2-14 PM Panel ...25
Figure 2-16 FAM Panel ...26
Figure 2-17 B8200 Software Structure ...27
TABLES
Table 2-1 Board List of ZXSDR B8200... 8
Table 2-2 Key Indices of CC Boards ...10
Table 2-3 CC2/CC16B Panel Interfaces ...11
Table 2-6 Key Indices of BPL1A/BPL1/BPN0A/BPN0 ...16
Table 2-7 BPL1A/BPL1/BPN0A/BPN0 Panel interfaces ...16
Table 2-8 Key Indices of BPN2 ...17
Table 2-9 BPN2 Panel interfaces ...18
Table 2-10 Key Indices of FS boards ...19
Table 2-11 FS Panel Interfaces ...20
Table 2-12 SA Panel Interfaces ...21
Table 2-13 SE Panel Interfaces ...22
Table 2-14 UES Panel Interfaces ...22
Table 2-15 UCI/UCI-C Panel Interface ...23
Table 2-16 TAM Panel Interfaces...24
Table 2-17 PM Panel Interfaces ...26
Table 3-1 Physical Indices ...30
Table 3-2 BS8200 Capacity ...30
Table 3-3 B8200 Power Supply ...31
Table 3-4 ZXSDR B8200 Power consumption ...31
Table 3-5 ZXSDR BS8200 Interface Indices ...31
Table 3-6 B8200 Working Environment Characteristics ...33
Table 3-7 ZXSDR B8200 Electromagnetic Compatibility Characteristics ...33
Table 3-8 B8200 Reliability Characteristics ...34
1
Overview
1.1
Introduction
This document provides a high level description of the distributed baseband processing Unit (BBU) ZXSDR B8200 (hereinafter B8200) that used in ZTE multi-mode wireless solutions.
The baseband unit B8200, can be inserted into the integrated macro base station, or connected to RRU in distributed base station. It is responsible for processing the baseband signals. Based on ZTE SDR platform, it supports GSM, UMTS and FDD LTE single-mode or multi-mode by software configuration. It enables operators to deploy one unified radio access network rather than independent GSM, UMTS or LTE network, which brings simplicity and convenience with low CAPEX and OPEX. Figure 1 sho ws the position of the ZXSDR B8200 in the typical multi-mode network.
Figure 1-1 B8200 in the GSM/UMTS/LTE Network
This document is structured as follows. Chapter 1 provides an overview of the characteristics of B8200, its key benefits and application scenarios. Chapter 2 gives the architecture, functionality, services and multi-system cooperation. Chapter 3 covers system capabilities, and chapter 4 introduces configuration principles of each kind of boards used in B8200.
1.2
Benefits
B8200 supports all kinds of wireless access technologies simultaneously, including GSM, UMTS and LTE, which share the common control function and transmission totally. It fully satisfies operators’ need with the minimum hardware change .
Large Capacity
To adapt to the rapid expansion of network development and the prosperity of multi-mode network, the latest BBU boards are released with higher processing capacity. The capacity indices of new boards surpass legacy ones, including RRC connected user number, cell number and data throughput. The increase in the board capacity improves the overall capacity of BBU. In addition, the new boards can be used together with the legacy ones, which provide flexibility during upgrade.
Plug-in Design for Shelf, Zero Footprint, Convenient Deployment
B8200 adopts Plug-in design with 19-inch, 2U in height and 8.75 kg (with full configuration) in weight. It can be conveniently mounted on the wall, ground, or in the 19-inch rack, etc.
Flexible Networking
B8200 provides GE/FE interfaces and IP networking. It supports RRU in different networking modes, like star and chain networking to satisfy the requirements of operators in different environments and under different transmission conditions.
1.3
Application Scenarios
As the baseband processing unit, B8200 is widely used in ZTE series of base stations, including indoor macro BS of ZXSDR BS8800, outdoor macro BS of ZXSDR BS8900A/BS8900B, distributed BS of ZXSDR BS8700 and outdoor compact BS of ZXSDR BS8906.
Figure 1-2 B8200 Application Scenario
B8200 Accommodation RRU Installation
B8200 RRU
2
Product Architecture
2.1
Physical Structure
The following figure shows the hardware appearance of B8200.
Figure 2-1 Baseband Unit -- ZXSDR B8200
The baseband unit consists of control & clock board, fabric switch board, baseband processing board, site alarm board, site alarm extension board (optional), universal Ethernet switch (optional), tower mounted amplifier control module (optional), power module, and fan module.
Table 2-1 Board List of ZXSDR B8200
Board Name Function Description CC2/CC16B/CCE1 Control & Clock Board
FS3/FS3A/FS5/CR0 Fabric Switch Board
UBPG/UBPG3 Universal Baseband Processing board for GSM BPK_e1/BPK_e/BPK_d Base band Processing board for UMTS
BPL1A/BPL1/BPN0A/BPN0 Base band Processing board for LTE
BPN2 Baseband Processing board for GUL multi-mode SA Site Alarm Board
SE Site alarm Extension Board UES Universal Ethernet Switch Board
4 3
1
5
6
1. Power module (PM) 2. Site alarm board (SA) 3. Fabric switch board (FS) 4. Baseband processing board (BP) 5. Fan array module (FAM) 6. Control & clock board (CC)
UCI Universal Clock Interface
TAM Tower mounted Amplifier control Module PM Power Module
FAM Fan Array Module
2.2
Hardware Structure
B8200 hardware architecture is shown in Figure 2-2.
Figure 2-2 B8200 Hardware Structure
B8200 can be configured in GSM/UMTS/LTE single mode or multi-mode.
2.2.1
Control & Clock Board (CC)
CC is the control & clock board, used for control and management of baseband unit, providing Ethernet and system clock. There are mainly 3 types of CC boards in order to meet different application requirements, illustrated in the following figures.
Figure 2-3 CC Panel CC2: Baseband Unit SA/ SE CC Baseband Processing FS (Optional for LTE) RRU/RSU E1 GE/FE Clock Data Control Signaling CPRI Antenna Radio Unit
CC16B:
CCE1:
Note: The boards are differentiated by the label attached on the panel, not included in the above figures. The product you receive is subject to the actual object.
Their key indices are specified in the following table.
Table 2-2 Key Indices of CC Boards
CC Type CC2 CC16B CCE1 Mode G/U single mode
or dual-mode
G/U/L single mode or multi-mode
GUL multi-mode or LTE single mode UMTS CNBAP Processing Capability 400/s 1500/s 3000/s LTE Processing Capability N/A 10800 RRC_connected users UL: 900Mbps/ DL: 900Mbps 10800 RRC_connected users UL: 1.8Gbps/ DL: 3.6Gbps
Note: 1. The above table describes the maximum hardware capability. The actual capability is up to the licenses configured. 2. There is the GPS module embedded in CC16B/CCE1 but not i n CC2.
Table 2-3 CC2/CC16B Panel Interfaces
Interface Name Description
EXT External communication port, connected to external receiver for clock synchronization or cascading.
REF Connected to GPS signal interface, or 2 MHz BITS signal interface.
USB (CC16B only) Used for software upgrade
TX RX Ethernet interface for Abis/Iub/S1/X2, self-adaptive 100M/1000M optical interface.
ETH0 Ethernet interface for Abis/Iub/S1/X2, self-adaptive 10M/100M/1000M electrical interface.
DEBUG/CAS/LMT Ethernet interface used for cascading, debugging or local maintenance, adapting interface of 10M/100M/1000M.
Note: Interfaces of ETH0 and TX RX are mutually exclusive.
Table 2-4 CCE1 Panel Interfaces
Interface Name Description
ETH0 Ethernet interface for Abis/Iub/S1/X2, self-adaptive 10M/100M/1000M electrical interface.
ETH1 Ethernet interface used for cascading, adapting interface of 10M/100M/1000M electrical interface.
DEBUG/LMT Ethernet interface used for debugging or local
maintenance, adapting interface of 10M/100M/1000M.
TX ETH2 RX Ethernet interface for Abis/Iub/S1/X2, self-adaptive 1000M/10000M optical interface.
TX ETH3 RX Ethernet interface for Abis/Iub/S1/X2, self-adaptive 1000M/10000M optical interface.
REF Connected to GPS signal interface, or 2 MHz BITS signal interface.
USB Used for software upgrade
EXT External communication port, connected to external receiver for clock synchronization or cascading.
Accomplishes LTE control plane protocol processing, including S1AP, X2AP, RRC,
etc.
Supports Ethernet switching function and implements data switching for service and control flow within the system
Processes Abis/Iub/S1/X2 interface protocol
Manages software versions of boards and programmable components, and
supports local and remote software upgrade
Reads various hardware management marks in the system, including the rack number, backplane type number, slot number, board function type, board version, and board function configuration mark
Monitors, controls and maintains the base station system with LMT interface
Supervises the running status of each board within the system
Supports primary/slave switchover
Synchronizes with various external reference clocks, including IEEE1588, GPS
clock and the clock provided by BITS(2MHz、2Mbits). The CC can select one
according to the actual configuration
Generates and delivers the clock signal demanded by each part
Provides GPS receiver interface and manages the GPS receiver
Provides a real-time clock for system operation and maintenance and calibrates the
real-time clock
Supports MicroTCA protocol based module management function
Supports 2 CC boards for different modes: one for GU dual-mode and the other for
LTE mode
In addition, CC16B/CCE1 has the following functions:
Providing USB interface for software upgrade
2.2.2
Baseband Processing Board
There are 3 categories of baseband processing boards in order to meet different application requirements:
1. UBPG /UBPG3
Both UBPG and UBPG3 are GSM baseband processing boards, processing the physical layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.
Figure 2-4 UBPG/UBPG3 Panel
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
UBPG supports 12 TRXs and UBPG3 supports 24 TRXs. Their main functions are listed as follows:
Supports rate adaptation, channel coding, interleaving, encryption, TDMA shock
burst generation, GMSK/8PSK modulation, and IQ baseband digital signals output
Supports uplink IQ data receiving, receiver diversity combination, digital
demodulation (GMSK&8PSK, equilibrium), decryption, deinterleaving, demodulator, rate adaptation, and transmits signals from GE Ethernet interfaces to CC board for processing
Synchronizes radio link and processes transmission frame
Measures parameters required in power control and handover
Reads all the hardware management identifiers, including the backplane type
number, slot number, board function type, board version, board function configuration identifier, and the CPU serial number
2. BPK_e1/BPK_e/BPK_d
BPK_e1, BPK_e and BPK_d are all UMTS baseband processing boards, processing the physical layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.
Figure 2-5 BPK_e1/BPK_e/BPK_d Panel
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
They provide the same functions but with different CE, cell processing capability and data throughput. The key indices are specified in the following table.
Table 2-5 Key Indices ofBPK_e1/BPK_e /BPK_d
Board BPK_e1 BPK_e BPK_d
CSs 6 6 12 CE No. DL192CE/UL19 2CE DL384CE/UL384CE DL768CE/UL768CE Data Throughput DL129.6Mbps/ UL34.5Mbps DL259.2Mbps/ UL69Mbps DL518.4Mbps/ UL138Mbps
Note: The above table describes the maximum hardware capability. The actual capability is up to the licenses configured.
Achieves downlink baseband signal processing, including downlink data coding,
multiplexing, rate adaptation, channel mapping, spread spectrum and scrambling power regulation and channel compositing
Achieves uplink baseband signal processing, including uplink data RAKE receiving, demodulator, and transmits data to lub interface for processing
Supports A-RAKE receiving and UL interface cancellation
Supports radio link synchronization and frame processing
Measures parameters required in power control and handover
Supports softer handover and carrier diversity
Communicates with the CC via the Ethernet interface
Reads all the hardware management identifiers, including the backplane type number, slot number, board function type, board version, board function configuration identifier, and the CPU serial number
3. BPL1A/BPL1/BPN0A/BPN0
BPL1A/BPL1/BPN0A/BPN0 are all LTE baseband processing boards, processing the physical layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.
Figure 2-6 BPL1A/BPL1/BPN0A/BPN0 Panel
BPL1A/BPL1:
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
They provide the same functions but with different CPRI interfaces, cell processing capability and data throughput. The key indices are specified in the following table.
Table 2-6 Key Indices of BPL1A/BPL1/BPN0A/BPN0
Board BPL1A BPL1 BPN0A BPN0 CPRI Interfaces 3 pairs 3 pairs 6 pairs 6 pairs RRC_connected Users 3600 3600 3600 3600 Cells (20MHz, 2T2R/2T4R) 3 6 3 6
Cells (20MHz, 4T4R) N/A 3 N/A 3 Data Throughput DL450Mbps/ UL225Mbps DL600Mbps/ UL300Mbps DL450Mbps/ UL225Mbps DL600Mbps/ UL300Mbps
Note: The above table describes the maximum hardware capability. The actual capability is up to the licenses configured.
The panel interfaces are specified in the following table.
Table 2-7 BPL1A/BPL1/BPN0A/BPN0 Panel interfaces
Board Type Interface Description
BPL1A/BPL1 TX0 RX0 ~ TX2 RX2 3 pairs of CPRI optical/electrical interfaces, connected to RRU/RSU
BPN0A/BPN0 TX0 RX0 ~ TX5 RX5 6 pairs of CPRI optical/electrical interfaces, connected to RRU/RSU
Their main functions are listed as follows:
Provides uplink/downlink I/Q signal
Supports MAC, RLC and PDCP protocol
4. BPN2
BPN2 is a GSM/UMTS/LTE multi-mode baseband processing board, integrating all the functions provided by the G/U/L single mode BP boards. It can be configured as G/U/L single mode or multi-mode, illustrated in the following figure.
Figure 2-7 BPN2 Panel
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
They provide the same functions but with different processing capabilities. The key indices are specified in the following table.
Table 2-8 Key Indices of BPN2
Board BPN2
CPRI Interfaces 6 pairs GSM 72 TRXs UMTS 12 CSs(1024CEs) DL 518.4Mbps/UL 138Mbps LTE 12 2T2R/2T4R Cells or 6 4T4R Cells 7200 RRC_connected Users DL 1200Mbps/UL 600Mbps GU dual-mode 12 TRXs + 12 CSs(768CEs) 24 TRXs + 9 CSs(640CEs) 36 TRXs + 6 CSs(512CEs) 48 TRXs + 6 CSs(256CEs) GL dual-mode 36 TRXs + 6 Cells
Board BPN2 UL dual-mode 6 CSs(512CEs) + 6 Cells
GUL multi-mode 12 TRXs + 6 CSs(256CEs) + 6 Cells 24 TRXs + 3 CSs(128CEs) + 6 Cells
Note: The above table describes the maximum hardware capability. The actual capability is up to the licenses configured.
The panel interfaces are specified in the following table.
Table 2-9 BPN2 Panel interfaces
Board Type Interface Description
BPN2 TX0 RX0 ~ TX5 RX5 6 pairs of CPRI optical/electrical interfaces, connected to RRU/RSU
2.2.3
Fabric Switch Board (FS)
FS is fabric switch board which provides the optical interface between BBU and RRU and processes the IQ signal. There are 5 types of FS boards, illustrated in the following figure.
Figure 2-8 FS Panel
FS3:
FS3A:
FS5A:
CR0:
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
Their key indices are specified in the following table.
Table 2-10 Key Indices of FS boards
FS Type FS3 FS3 A FS5 FS5A CR0 Mode G/U single mode or dual-mod e G/U single mode or dual-mod e G/U/L single mode or multi-mode G/U/L single mode or multi-mode When LTE is included and Cloud Radio (CR) is required Max. CSs,
working with one UMTS BP board
6 12 12 12 12
Max. CSs, working with UMTS BP boards per BBU
CPRI Interface Data Rate (Gbps) 1.2288/2. 4576 1.2288/2. 4576 1.2288/2.45 76/3.072/6. 144 1.2288/2.45 76/3.072/6. 144/9.8304 1.2288/2.45 76/3.072/6. 144/9.8304
The panel interfaces are specified in the following table.
Table 2-11 FS Panel Interfaces
Interface Name Description
TX0 RX0 to TX5 RX5 6 pairs of optical/electrical interfaces, connected to RRU/RSU ETH (CR0 only) 10GE Ethernet interface, connected to BBU
Their main functions are listed as follows:
Receives the signal from the rear board in the downlink and retrieves the data and
timing.
Multiplexes the received data and retrieves I/Q signal
Supports I/Q mapping in the downlink and multiplexes I/Q signal to the optical
signals
Receives the I/Q in uplink and de-multiplexes/maps into I/Q signal
Transmits the multiplexed I/Q signal to baseband processing board
Exchanges the CPU interface signaling through HDLC interface with RU module
2.2.4
Site Alarm Board (SA/SE)
1. Site Alarm Board (SA)
SA is a site alarm board, illustrated in the following figure.
Note: The product you receive is subject to the actual object.
There are two types of SA boards with different number of interfaces, as specified in the following table.
Table 2-12 SA Panel Interfaces
Interface Name SA0 SA3 - 8 E1/T1 interfaces 4 E1/T1 interfaces
6+2 dry contacts (6 input, 2 bidirectional)
14+2 dry contacts (14 input, 2 bidirectional)
1 RS485 interface 1 RS485 interface 1 RS232 interface 1 RS232 interface
The SA has the following functions:
Provides E1/T1 transmission interfaces
Provides site alarm monitoring interfaces
Provides FAM's alarm and rate control
Supports signal monitoring and interface lightning protection
The last E1 used for E1 transmission or BITS-2MHz/BITS-2Mbps clock input
2. Site alarm Extension Board (SE)
SE is site alarm extension board, and shares the bottom-right slot with baseband processing board. It is used to extend the interface number if SA cannot fulfill the requirements. The SE panel is illustrated in the following figure.
There are two types of SE boards with different number of interfaces, as specified in the following table.
Table 2-13 SE Panel Interfaces
Interface Name SE0 SE2 - 8 E1/T1 interfaces 4 E1/T1 interfaces
6+2 dry contacts (6 input, 2 bidirectional)
14+2 dry contacts (14 input, 2 bidirectional)
1 RS485 interface 1 RS485 interface 1 RS232 interface 1 RS232 interface
The SE board provides the following functions:
E1/T1 transmission interfaces
Site alarm monitoring interfaces
2.2.5
Universal Ethernet Switch Board (UES)
UES is used for synchronized Ethernet and the panel is illustrated in the following figure.
Figure 2-11 UES Panel
Note: The product you receive is subject to the actual object.
Description of UES panel interfaces is specified in the table below:
Table 2-14 UES Panel Interfaces
Interface Name Description
X1 ~ X2 The electrical interfaces for cascaded connection.
X3/UPLINK A compatible electrical interface for both cascaded connection and uplink connection for link aggregation.
Interface Name Description
UPLINK An electrical or optical interface.
X4/UPLINK A compatible optical interface for both cascaded connection and uplink connection for link aggregation.
UES has the following functions:
Supports L2 Ethernet switch
Supports synchronous Ethernet clock
2.2.6
Universal Clock Interface Board (UCI/UCI-C)
UCI is the RGPS clock interface board. There are two types of UCI boards: UCI and UCI-C. UCI/UCI-C panel is illustrated in Figure 2-12.
Figure 2-12 UCI/UCI-C Panel
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
Description of UCI/UCI-C panel interfaces is shown in the following table:
Table 2-15 UCI/UCI-C Panel Interface
Interface Name Description
TX RX 125Mbps optical interface, connected to RGPS equipment for signal import. TX RX is only available on UCI.
EXT HDMI interface, providing 1PPS+TOD clock signal for the CC board in the same BBU.
REF GLONASS/GPS antenna interface, only available on UCI-C. Reserved on UCI.
DLINK0 HDMI interface, providing 2 outputs of 1PPS+TOD signals for CC boards in other BBUs.
Interface Name Description
DLINK1 HDMI interface, providing 2 outputs of 1PPS+TOD signals for CC boards in other BBUs.
2.2.7
Tower mounted Amplifier control Module (TAM)
TAM is used for tower mounted amplifier control when TMA is needed. Panel of TAM is shown as following figure.
Figure 2-13 TAM Panel
Note: The product you receive is subject to the actual object.
The panel interfaces are specified in the table below.
Table 2-16 TAM Panel Interfaces
Interface Name Description TA0 DC output voltage channel 0
TA1 DC output voltage channel 1 TA2 DC output voltage channel 2 TA3 DC output voltage channel 3 TA4 DC output voltage channel 4 TA5 DC output voltage channel 5
The TAM has the following functions:
Supports working status detection of tower amplifier and reports alarm signals to CC board
Provides power on and off for tower amplifier with +28V, +12V or +13V power
supply
Realizes the communication with CC board
Implements conversion, protection and filtering of power supply
Provides anti-lightning for power supply circuit
Implements software remote downloading and current threshold setting
2.2.8
Power Module (PM)
PM is the power module, including PM3 and PM5. PM5 has 50% more power supply than PM3 for full configuration of new high power consumption boards, shown in the following figure.
Figure 2-14 PM Panel
PM3:
PM5:
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
Table 2-17 PM Panel Interfaces
Interface Name Description MON Debugging interface, RS232 interface -48V/-48VRTN -48V input
ON/OFF (PM3 only) Power switch, turning on/off 12V power to/from BBU
The PM has the following functions:
Provides 16 internal interfaces for +12 V, +13V or +28V load power;
Provides 16 internal interfaces for +3.3 V management power;
Supports EMMC management;
Supports measurement and protection of input over-voltage/under-voltage;
Supports output over-current protection and load power management.
2.2.9
Fan Array Module (FAM)
FAM is fan array module. Its panel is illustrated in the following figure.
Figure 2-15 FAM Panel
The FAM has the follows functions:
Monitors and controls system temperature;
Monitors, controls, and reports the fan state.
2.3
Software Architecture
The software architecture of the ZXSDR B8200 can be divided into three layers:
Application software layer
Platform software layer
Hardware layer
Figure 2-16 B8200 Software Structure
The application software layer provides functions as follows:
RNLC (radio network layer control) provides common and dedicated radio resource management and control functions for control plane
RNLU (radio network layer user) provides user plane function
GSM/UMTS/LTE A lication Software
OMC-B SCS OAM DBS BRS Hardware (BSP) Linux LMT OSS
SCHEDULER (scheduler sub-system) provides uplink/downlink MAC scheduling
PHY (physical layer) provides PHY function
The SDR platform software provides the functions of Operation Support Sub-system (OSS), Operating And Maintenance (OAM), Data Base Sub-system (DBS), Bearer Sub-system (BRS) and System Control Sub-system (SCS):
OSS is the support layer in this entire framework, which is a hardware independent
platform for running software and provides basic functions like scheduling, timer, memory management, communication, sequencing control, monitoring, alarming and logging.
OAM provides the configuration, alarm and performance measurement function for
base station.
DBS is the database system.
BRS provides the IP communication function for inter-board and inter-network
elements.
SCS provides the power control and system management function.
Board Support Package (BSP) is the software closely connected with the board hardware and supports Real Time Operation Support Sub-system (RT OSS) to work on the board.
2.4
Functionality
B8200 implements the following basic functions on Abis/Um/Uu/S1/X2 and O&M interfaces:
Channel coding and decoding
Channel multiplexing and de-multiplexing
Baseband resource pooling function
Power control
Spatial multiplexing, transmit diversity and receive diversity
Synchronization
Operation and Maintenance
3
Technical Specifications
3.1
Physical Indices
Table 3-1 Physical Indices
Item Indices
Size (H*W*D) (mm) 88.4*482.6*197
Weight (kg) 8.75 (full configuration)
3.2
Capacity Indices
Table 3-2 BS8200 Capacity
Mode Capacity BBU Configuration
GSM 312 TRXs 1CC16B+4BPN2+1UBPG3+1FS+2PM+ 1SA UMTS 54 CSs 1CC16B+4BPN2+1BPK_e+1FS+2PM+1 SA
4480 CEs UL/4480 CEs DL 621 Mbps UL /1000 Mbps DL LTE 36x20MHz cells (2T2R/2T4R) 1CCE1+3BPN2+2PM+1SA 10800 RRC_connnected users 1.8Gbps UL/3.6Gbps DL
Note: 1. CC16B board supports GE/FE interface and thus limits the total data throughput to 1000Mbps in the physical layer (900Mbps in application layer for LTE single mode). 2. The above table describes the maximum hardware capacity. The actual capacity is up to the licenses configured.3. GUL multi-mode capacity can be calculated according the capacity of the configured CC boards and BP boards.
3.3
Power Indices
3.3.1
Power Supply
B8200 power supply is shown in the following Table.
Table 3-3 B8200 Power Supply
Power Options Description DC: -48 V (-57 V – -40 V DC) Supported by integrated PM modules
The power supply is already certified for the following markets.
3.3.2
Power Consumption
The power consumption depends on traffic load, configuration and environment temperature. The following table provides power consumption of typical configuration.
Table 3-4 ZXSDR B8200 Power consumption
Items Power Consumption (W) 12 TRXs/1 UBPG 70 24 TRXs/1 UBPG3 75 6CS/3 BPK_e/BPK_e1 85 12CS/1 BPK_d 105 3 cells/1 BPL1 120 6 cells/1 BPN0 90 24 TRXs + 3 CSs(128CEs) + 6 Cells /1 BPN2 125 12 TRXs + 6 CSs(256CEs) + 6 Cells/1 BPN2 125
3.4
Interface Indices
Table 3-5 ZXSDR BS8200 Interface Indices
Abis/Iub (CC2/CC16B) E1/T1 8 pairs DB44 ITU G.703/G.704 ANSI T1.403 Abis/Iub/S1/X2 (CC2/CC16B) Ethernet (either or) 1 10M/100M/1000M electrical Auto-Negotiation. Auto-MDI/MDIX RJ45 10/100/1000BASE-T IEEE 802.3 compatible 1 1000M optical Or 1 100M optical SFP (LC) 1000BASE-LX IEEE 802.3 compatible, 100BASE-FX IEEE 802.3 compatible Abis/Iub/S1/X2 (CCE1) Ethernet 2 10M/100M/1000M electrical Auto-Negotiation. Auto-MDI/MDIX RJ45 10/100/1000BASE-T IEEE 802.3 compatible 2 10G optical Or 2 1000M optical SFP (LC) 10GBASE-SR,10G BASE-SW,10GBAS E-LR,10GBASE-L W IEEE 802.3 compatible, 1000BASE-LX IEEE 802.3 compatible Cascading, Debugging or Local Maintenance Ethernet 1 10M/100M/1000M electrical Auto-Negotiation. Auto-MDI/MDIX RJ45 10/100/1000BASE-T IEEE 802.3 compatible Baseband /Radio Electrical /Optical 6 pairs /FS/BPN0A/BPN0 /BPN2 3 pairs /BPL1A/BPL1 SFP (LC) CPRI
Clock GPS 1 SMA GPS TX/RX Port NMEA 0183 V3.0
Monitor Dry contacts
32 pairs (8,16 or
24 pairs optional) DB44 N/A External EXT 1 RS485/RS2
32 N/A
3.5
Environment Indices
Table 3-6 B8200 Working Environment Characteristics
Item Requirement
Temperature -20 to +55°C Relative Humidity 5% to 95%
Protection classification Compliant with IP20
Emission and Immunity
ETSI EN 300 386 ETSI TS 125 113
Ground
≤5 Ω; earth resistance can be less than 10 Ω in
lightning-less area with less than 20 lightning storms a year.
Mechanical vibration ETSI 300019-1-4 ClassM4.1
3.6
Electromagnetic Compatibility Indices
Table 3-7 ZXSDR B8200 Electromagnetic Compatibility Characteristics
Item Requirement
Anti-static protection Capable of protecting against a contact discharge of ±6000V, Air discharge of ±8000V.
Surge anti-interference ±2000V between lines and ground.
3.7
Reliability Indices
The Reliability characteristics vary at different configurations. The reliability indices are calculated based on typical configuration supporting GUL multi-mode, listed in table 3-8.
Table 3-8 B8200 Reliability Characteristics
Item Value
MTBF ≥240,000 hours MTTR 0.5 hour
Availability index ≥99.999792% Down duration ≤1.095 min/year
4
Configurations Principles
B8200 is the baseband unit of macro base station, which is composed of the following boards: CC, BP, FS, SA/SE, UES, TAM, PM, FAM, etc. Configuration principles of these boards are described in the following table:
Table 4-1 B8200 Configuration
Board Configuration Principles
CC
Refer to table 2-2 for the key indices of CC boards. At least 1 board is configured by default.
Maximally 2 boards can be configured for GU and LTE respectively or 1+1 backup.
BP
UBPG 12 GSM TRXs/board. Maximally 5 boards can be configured. UBPG3 24 GSM TRXs/board. Maximally 5 boards can be configured.
BPK_e1 Refer to table 2-5 for the key indices. Maximally 5 boards can be configured.
BPK_e Refer to table 2-5 for the key indices. Maximally 5 boards can be configured.
BPK_d Refer to table 2-5 for the key indices. Maximally 4 boards can be configured.
BPL1A Refer to table 2-6 for the key indices. Maximally 3 boards can be configured.
BPL1 Refer to table 2-6 for the key indices. Maximally 3 boards can be configured.
BPN0A Refer to table 2-6 for the key indices. Maximally 6 boards can be configured.
BPN0 Refer to table 2-6 for the key indices. Maximally 6 boards can be configured.
BPN2 Refer to table 2-8 for the key indices. Maximally 4 boards can be configured.
FS
Refer to table 2-10 for the key indices of FS boards. At least 1 board is configured by default for G/U mode. FS is optional in LTE single mode configuration. Maximally 2 boards can be configured.
SA Refer to table 2-12 for the interfaces of the 2 types of SA boards. It is configured by default.
SE
Refer to table 2-13 for the interfaces of the 2 types of SE boards. It is configured only when the requirements of dry contacts or E1/T1 exceed SA capacity.
UES 4 electrical and 2 optical Ethernet interfaces per board. It is configured when L2 Ethernet switch is required.
UCI
1 optical interface and 3 HDMI interfaces per board.
UCI is configured for connecting to the remote device when remote transportation of GPS signal is required and the optical RGPS solution is adopted.
UCI-C is configured in the GLONASS system.
TAM 6 DC outputs with customized voltage per board.
It is configured for tower amplifier control when TMA is needed.
PM At least 1 board is configured by default.
Maximally 2 boards can be configured for 1+1 backup. FAM It is configured by default.
Note: The above table describes the maximum hardware capacity. The actual capacity is up to the licenses configured.
5
Glossary
Abbreviations Full Characteristics
3GPP 3rd Generation Partnership Project
BP Baseband Processing
BBU Base Band processing Unit
BITS Building Integrated Timing Supply
BPL Baseband Processing Board for LTE
BPL1 Baseband Processing Board for LTE type1
BSP Board Support Package
CAPEX Capital Expenditure
CC Control & Clock module
CPRI Common Public Radio Interface
DBS Data Base Sub-system
DL Downlink
DTX Discontinuous transmission
EUTRAN Evolved Universal Mobile Telecommunications System
FAM Fan Module
FE Fast Ethernet
FS Fabric Switch board
GE Gigabit Ethernet
GPS Global Positioning System
GSM Global System for Mobile communications
HSPA+ HSPA Evolution
LMT Local Maintenance Terminal
LTE Long Term Evolution
MDLSD MAC Downlink Schedule
MicroTCA Micro Telecommunications Computing Architecture
MIMO Multi Input Multi Output
MTBF Mean Time Between Failures
MTTR Mean Time To Recovery
MULSD MAC Uplink Schedule