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Microstructure And Resistivity Of Cu/Ni Thin Film Prepared By Magnetized Electroplating On Various Electrolyte Temperature

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Figure

Figure 4, it is known that the Cu/Ni layer is in the form of crystals with two dominant peaks (preferred orientation) that occur at around angles 2-theta 43 and 44
Fig. 5. The peak intensity of diffraction from Cu and Ni crystals in the various of the electrolyte temperature
Fig. 8. Relationship bertween sheet resistivity of Cu and Ni to electrolyte temperature

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