Micro-extrusion process parameter modeling
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![Figure 3: (a) Laser activated electroplating; (b) Laser induced forward transfer (LIFT) [9]](https://thumb-us.123doks.com/thumbv2/123dok_us/109590.10168/15.612.74.536.179.443/figure-laser-activated-electroplating-laser-induced-forward-transfer.webp)
![Figure 4: A laser based DW system used in both additive (right) and subtractive (left) modes [12]](https://thumb-us.123doks.com/thumbv2/123dok_us/109590.10168/16.612.167.449.72.339/figure-laser-based-used-additive-right-subtractive-modes.webp)
![Figure 5: Material deposition using DPN [11]](https://thumb-us.123doks.com/thumbv2/123dok_us/109590.10168/17.612.152.464.504.691/figure-material-deposition-using-dpn.webp)
![Figure 6: Material deposition using NFP [9]](https://thumb-us.123doks.com/thumbv2/123dok_us/109590.10168/18.612.188.429.73.222/figure-material-deposition-using-nfp.webp)
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![Figure 9: Flowrate vs. dispensing height [15]](https://thumb-us.123doks.com/thumbv2/123dok_us/109590.10168/22.612.125.491.70.292/figure-flowrate-vs-dispensing-height.webp)
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