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Highly-efficient low cost anisotropic wet etching of silicon wafers for solar cells application

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Figure

TABLE I. Surface reflectance of silicon substrates etched by different etching solutions for 25 minutes.
FIG. 1. Comparison of optical reflectance curves of silicon substrates textured by different etching solutions.
FIG. 3. Cross-sectional SEM images of etched silicon substrates (a) KOH + NaOH + Na2SiO3 (b) KOH.
FIG. 5. Reflectance curves of silicon substrates textured by KOH + NaOH + Na2SiO3 etching solution at temperature,T = 80 ◦C and time, t = 10, 15, 20, 25 minutes.
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