Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche REVERSE ENGINEERING REVERSE ENGINEERING PER LA RIPARAZIONE DI PER LA RIPARAZIONE DI SCHEDE ELETTRONICHE SCHEDE ELETTRONICHE Luca Corli
Key Account Manager Seica S.p.A.
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Nell'industria elettronica si definisce normalmente con reverse engineering "il processo di ricostruzione dei principi di funzionamento di un dispositivo o apparato attraverso l'analisi della struttura e del suo funzionamento".
Nel campo del collaudo automatico di schede elettroniche, dove per la generazione di un programma di test vengono normalmente richiesti schemi e dati CAD relativi, ove questi non siano disponibili un processo di reverse engineering può risultare utile per estrarre informazioni (netlist) da una scheda campione, sufficienti per realizzare un programma di collaudo esaustivo con tasso di copertura accettabile.
Tale programma, che può essere preparato in tempi molto brevi e senza richiedere una conoscenza approfondita della scheda, potrebbe risultare estremamente utile per riparare schede guaste provenienti dal campo o "filtrare" le schede funzionanti di un lotto di
produzione. Lo strumento migliore agli scopi suddetti è un ATE a sonde mobili di tipo "double side", equipaggiato con opportuni strumenti hardware/software ,che combinando ispezione ottica e tecniche di test orientate alle net, consente di eseguire sia le operazioni di reverse engineering che il collaudo vero e proprio delle schede.
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Reverse engineering for board test
Why reverse engineering for test“Net oriented” flying probe testing methods How to do reverse engineering for test
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Reverse engineering for board test
Why reverse engineering for test“Net oriented” flying probe testing methods How to do reverse engineering for test
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
How to use a flying probe tester to rebuild the netlist (and the partslist) and allow the test of an electronic board
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
To prepare a flying probe test program, CAD data are normally mandatory and a reasonable set of
documentation (golden sample, BOM, schematics) of the UUT is normally requested
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
CAD data, BOM, schematics are easily available for new boards coming from production today, but some or all of them could be missing for aged boards coming from
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
If CAD data are not available the flying
probe tester misses mandatory information to generate a standard test program like:
• TPs XY coordinates
• netlist (UUT electrical network)
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
If CAD data are not available:
• targets XY coordinates can be learned
directly on the flying prober
• netlist can be extracted directly by the
flying prober
• partslist is not necessary to run “net oriented” test methods
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Can we make a flying prober test program without CAD data, schematics, BOM and just using a golden sample?
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Reverse engineering for board test
Why reverse engineering for test
“Net oriented” flying probe testing methods
How to do reverse engineering for test
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
FNODE is a powerful testing method to learn dynamic
impedance of an unkown
bipole, where pin 1 is a single net of the UUT and pin 2 is a reference net (typically GND) P1
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
• Since every bipole on the UUT is unknown, an autolearn process on a
golden sample UUT is mandatory to understand each bipole behaviour on a wide frequency range
• During learning process a sine waveform sweep is injected on P1 while P2 is connected to ground of the waveform generator
• Typical input signal amplitude is 0.2 V to work under p-n junctions threshold, avoid non-linear distorsion and skip guarding need
• FNODE output is the current flowing into the bipole: current module and current phase angle are the measurements stored in the test program for each net
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
• Can be generated without CAD data
• There is no need of manual debug (fully automatic)
• Can do a FULL shorts test (better coverage than traditional
adjacency test)
• In case of CAD data available FNODE is useful to skip many ICT
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
PWMON measures the current needed to
force 0 logic and 1 logic on each net
when the UUT is powered UP: over the
threshold the system indicates a possible
faults on the net MODE 1:
EN_FORCE_TEST (default)
IC
VCC GND
Force Low and High (possible overdrive)
A
Current limit: 250 mA Threshold typ.: 120 mA
No need of autolearn
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
• Vectorless method for IC testing with UUT powered up
• Can be generated without CAD data
• There is no need of manual debug (fully automatic)
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Reverse engineering for board test
Why reverse engineering for test
“Net oriented” flying probe testing methods
How to do reverse engineering for test
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Put the golden sample UUT on the prober and learn the
entire image of the board by using a
digitizer option based on integrated
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Working online (with ATE CCD camera) or offline
(remote PC with saved images) learn
all XY coordinates of all TPs (pads,
pins, vias, etc..) present on the UUT
images 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
If our main goal is to test the board only, we could learn
targets on one side only (assuming the UUT is fully
accessible on that side) If our main goal is to rebuild schematics, we must learn all
TPs, vias, pads, pins XY coordinates on both sides of
the UUT
UUT bottom side
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
GND TP must be manually declared
into the test
program before to proceed to the next
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Run the “netlist learning” process to
assign a unique net name to all targets
belonging to the same net and obtain
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
During “netlist learning” the tester will perform the following operations:
• “Autodebug” and then “Run” FNODE algorithm on every single target learned
• Create different groups containing all targets with identical signature
• Run single continuity measurement on all pairs of
targets within each group, to check if they really belong to the same net or not
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche 1 1 2 3 4 5 5 6 7 8 9 10 11 11
After the “netlist learning” process,
the targets
belongings to the same net have finally the same net
name and a unique TP for each net will be selected for next
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
After the “netlist learning” process we are ready to go with net oriented testing
methods like FNODE and PWMON, because we have XY coordinates for our targets and
a netlist of the UUT (we only miss component information at this stage)
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Learn analog
signature on all TPs (one for each net) with FNODE method
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
RUN FNODE to detect possible shorts and analog failures on boards
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Connect a cable to power up the UUT after
identifying VCC and GND inputs
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Run PWMON
algorithm to detect possible digital
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche Manually insert components in the test program to create a partslist and allow to rebuild schematics
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Once the partslist has been introduced, the tester can export CAD
data in EDIF 200 format, readable by a
specific software to print schematics
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche Print schematics by using a suitable software able to accept EDIF 200 format in input
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
• A typical board repair operation consists on replacing one or more components
• An ATE system often indicates test results as “PASS” or “FAIL” and in this case it shows many errors even if there is a single fault on the board.
• The DES module of Seica suggests which component to replace first, by merging information of all
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Components are sorted from the most
probable defective to the least one
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
• Need component information to address the user toward the component to replace
• Can be used also with FNODE and PWMON (they are not component oriented methods) if component
descriptions have been entered into the test program
• Mostly useful when many testing methods are combined in a single test program
• Very powerful also for user “smart” analysis of the faults (guided diagnostic offline)
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Reverse engineering for board test
Why reverse engineering for test
“Net oriented” flying probe testing methods How to do reverse engineering for test
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
A flying probe vertical architecture ensures a double side probing with UUT flat: no vibrations and no
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
The probers with horizontal architecture and mobile probes on both sides can’t keep the UUT flat because of the force of gravity and they have many problems of measurement stability/accuracy due to the UUT vibrations!
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
Vibrations are larger on horizontal UUT than vertical UUT when probed on both sides at the same time!
Rework & Repair Forum 2009 - Reverse Engineering per la riparazione di schede elettroniche
• Flying probers can be a nice tool not only for test but also for reverse engineering
• Flying probers need specific features and measurement algorithms to perform reverse engineering on electronic boards
• Flying probers need “net oriented” testing methods to allow UUT test without partslist, and only using XY coordinates and netlist coming from reverse engineering first step operations