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Impact of Crosstalk on Signal Integrity of TSVs in 3D Integrated Circuits

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Figure

Figure 2. Evaluated S21 magnitude (a) and S11 magnitude (b) of 3D via using HFSS
Figure 5.  Comparison of five locations of 3D Vias. The distances 4 µm, 8 µm, 16 µm, and 32 µm between two signal Vias are associated to the graphs from top to bottom respectively
Figure 12.  3D Interconnect crosstalk induced-delay test
Figure 16: 3D Crosstalk Detection Scheme
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