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Failure and reliability analysis of a SiC power module based on stress comparison to a Si device

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Figure

TABLE SI DEVICE AND PACKAGING MATERIAL PARAMETERSI
Fig. 3. Finer mesh on the edge area of die-attach solder layer
Fig. 4. Power cycling aging test circuit
Fig. 7. The lifetime results of Si modules in  Tj,mean=90˚C power cycling tests and simulation
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