The Heatmanagement Company Power Forum Milano

Kunze Folien GmbH

Kunze Folien GmbH

The Heatmanagement Company Power Forum

Milano 18.03.2008

Kunze Folien sales Italy

Rep. ENRICO FALLONI ELECTRONICS

info@enricofalloni.it

www.enricofalloni.it

Distri COMPREL Srl

info@comprel.it

www.comprel.it

Content

Content

1.

Kunze Folien GmbH –

Company Overview

2.

Semiconductor Mounting

and Clip Design

3.

Key Factors for

 _{Company founded in 1985}

 _{Business: All-in-One supplier of heat management}

products and solutions worldwide

 _{Privately owned by Mr. Kunze}

 _{Head office and production based in the Munich area}  _{Personnel: 35 increasing}

 _{Certification according to DIN EN ISO 9001:2000}

and DIN EN ISO 14001:2004

Company Profile

Company Profile

Product Portfolio

Product Portfolio

 _{Thermally conductive interface materials}  _{Films, caps, tubes, greases, adhesives}  _{Heat sinks}

 _{Transistor clips and springs}  _{Insulating bushings}

 _{Insulating films}

⇒

⇒ Integrated customer solutions as All-in-One supplierIntegrated customer solutions as All-in-One supplier

Product Portfolio

Product Portfolio

 _{Broad product portfolio}

 _{Strong and efficient Key Account Management}  _{Focusing integrated solutions}

 _{Intensifying co-operations with partners}

 _{Tightening worldwide distributor businesses}  _{Driving innovation}

 _{Strict quality management}

 _{Committed to customer satisfaction}

Strong Market Position

Strong Market Position

 _{Automotive Siemens VDO}  _{Telecommunication Siemens}

 _{Drives SEW}

 _{Industrial Electronics Haidenhein}  _{Power Supplies Delta Energy}  _{Embedded Kontron}

 _{Consumer Electronic Philips}  _{Home Appliances Miele}

 _{Medical GE Medical Systems}  _{Space and Defense EADS}

 _{Research Technical University of Munich et al.}

Shortlist of References

Shortlist of References

1996 199 7

1998 1999 2000 2001 2002 200 3

Organic growth as Kunze’s pillar for long-term success Organic growth as Kunze’s pillar for long-term success

Story of Success

Story of Success

Silcone based foils Phase Change interface materials Heat Sinks PowerClips®

Product Turnover

Product Turnover

 _{Tightening distribution network: IXYS Partners}  _{Future focus: USA, Canada, Latin America}

 _{Complementing product portfolios}  _{Joint design activities}

 _{Creating customer value}

 _{Strengthening mutual competitiveness}  _{Common growth}

International Sales Activities – Primary Targets

Semiconductor Mounting

Semiconductor Mounting

and Clip Design

and Clip Design

Milestones of a Clip Design Process

Milestones of a Clip Design Process

 Feasibility, parameter and periphery analysisFeasibility, parameter and periphery analysis

 CAD-design of first concept_{CAD-design of first concept}

 Modelling and simulation_{Modelling and simulation}

 Iterative adjustments Iterative adjustments

 Final CAD DesignFinal CAD Design

 Prototyping_Prototyping

 ToolTool

 ISOPLUS DIL™ Package

 Pressure distribution on the module base plate to obtain flatness at nominal power loss

 Compensation of cumulative tolerances

 Homogeneous stress distribution and observance of stress limits

 Producibility

 Screw mounting

Main requirements:

Clip Design for IXYS GWM – 120 (1)

Clip Design for IXYS GWM – 120 (1)

Heat sink (rigid) Module Clip

Total system approach:

Models for the module and the clip

Clip Design for IXYS GWM – 120 (2)

Clip Design for IXYS GWM – 120 (2)

Flatness of the base plate at nominal power loss is reached ...

Flatness of the base plate at nominal power loss is reached ...

...

... without exceeding max. load on the housingwithout exceeding max. load on the housing

Clip Design for IXYS GWM – 120 (3)

Clip Design for IXYS GWM – 120 (3)

After clip mounting At nominal load

Stress distribution after mounting (a) - at nominal loss power (b)

Stress distribution after mounting (a) - at nominal loss power (b)

Clip Design for IXYS GWM – 120 (4)

Clip Design for IXYS GWM – 120 (4)

KU 4-501

KU 4-501

Clip Design for IXYS GWM – 120 (5)

Clip Design for IXYS GWM – 120 (5)

“

“Trial and Error” Trial and Error” vs. vs. “Structured Design-In” :“Structured Design-In” :

 Loosing time Loosing time

 Increasing number of design steps_{Increasing number of design steps}

 Causing avoidable costs Causing avoidable costs

 High risk of failure_{High risk of failure}

 Improving quality_{Improving quality}

 Optimizing total costsOptimizing total costs

 Reducing Time to Market _{Reducing Time to Market}

 Boosting company image_{Boosting company image}

Isko Engineers AG

Minimizing Costs

Minimizing Costs

Key Factors for

Key Factors for

Common Success

Common Success

Living Active Partnership

Living Active Partnership

Commu-nication

Price

Open Communication...

Open Communication...



_{Regular and open exchange of thoughts}

on all issues as well as on current projects



_{Feedback on market development and competition}

_{Regular meetings and mutual visits}



_{Quick answers to all customers‘ related questions}

 _{Technical issues and data}

 _{Availability of information and products}  _{Delivery time of products}

Competitive Products and Services...

Competitive Products and Services...



Customer specific solutions



Product documentation and data



User and assembly instructions



_{Advanced product management}



_{Reliable logistics}

Competitive Prices...

Competitive Prices...



_{Quick response time}



_{Mutual discussion on specific}

projects and customer target prices



Joint discussion on price trends



_{Adjusted tool selection and}

A strong partnership is the basis for

A strong partnership is the basis for

increasing market shares and mutual growth

A strong partnership is the basis for

A strong partnership is the basis for

increasing market shares and mutual growth

increasing market shares and mutual growth