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Effects of Cu Self Capping and Ta Capping on Nanometer Sized Cu Films Sputter Deposited on β Ta

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Figure

Fig. 1X-ray diffraction patterns for Ta/Cu (dashed lines) and Ta/Cu/Ta(solid lines) for Cu film thicknesses of (a) 17 nm, (b) 33 nm, and (c)500 nm
Fig. 3(a) tCu dependencies of I111 normalized by tCu (open symbols) andthose revised by accounting for differences in the preferred texture (filledsymbols, see text for details)
Fig. 3(a), the filled symbols for tCu < 33 nm are the I111=tCu
Figure 5(b) shows the tCu dependence of the interlayer

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