Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn Ag Cu Solder Joint

However, it is believed that the adhesive properties of Sn- Ag-Sb-Cu solders have received only little attention in the literature thus far. In general, the mechanical strength

In the SACNG solder, the formation phases in the solder grow up to several-micron meters after heat exposure treatment. Figure 6 shows EPMA mapping analysis results for the

The interfacial reactions and the interface microstructures between Sn-3.5Ag-(0.7Cu) lead-free solders and Fe-42Ni substrate were investigated at the reaction temperature of 250

In this paper, surface tension of liquid Sn-X (X=Ag, Cu) alloys was measured by the constrained drop method and compared with the calculated results by Butler’s model

The interfacial reaction between Sn–36Pb–2Ag (numbers are all in mass% unless specified otherwise) solder balls and Ni, Ag and Ni/Ag electroplated on a Cu substrate was investigated

The ball shear strength of BGA solder joints during isothermal aging was studied with Sn–3.5Ag–0.75Cu solder on three different pads Cu, electroless Ni–P/Cu, immersion Au/Ni–P/Cu

To explain the microstructures generated in the reactions between the amorphous Ni 共 P 兲 coating and liquid near-eutectic Sn– Ag– Cu solder we utilize primarily the binary

Based on the results from previously published studies [1-25], the iNEMI Board Assembly Technology Integration Group launched the “Pb-free BGAs in Sn-Pb Assemblies Project” in order