Connected Intelligence

(1)

External Use

TM

Connected Intelligence

Bringing the IoT to Life

J u l . 0 1 . 2 0 1 4

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(1) The “PowerPC” name is a trademark of IBM Corp. and is used under license.

The Next Big Thing:

# Connected

Devices

25 BILLION

World

Population

2003

2008

2010

2015

2020

<1x

1x

2x

3.5x

6.5x

_{Devices/Person}

# Connected

50 BILLION

12.5 BILLION

7.2B

6.8B

6.5B

6.3B

7.6B

(3)

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The Internet of Things

Advanced

Safety

Radar +

Vision

Infotainment

Traffic Monitoring

Security

Energy

Meters

Home Hubs

Telehealth

Home Health

Monitors + Fitness

Connected

Appliances

Smart Energy

Grid

Digital Power

Conversion

Energy Management,

Wind + Solar

Human – Machine

Interface

Machine – Machine

Industrial

Networking

Cloud

Computing

Metro Cells

Small Cells

Enterprise Gateways, Switchers,

Routers

Base Stations

Security

Networked Printers

Data

Center

Connected

Farms

(4)

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Innovations

Connected

Intelligence

Technology

Software

Applications

Embedded

Processing

Sensing

Connectivity

Connected

Intelligence

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(6)

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(7)

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• The vehicle will be one of the

biggest “things” in the IoT

• Building block for the autonomous

vehicle

V2Cloud

V2V/V2I

Vision

Radar

Automotive IoT Use Case

(Semi) Autonomous Vehicle

Reducing collisions

Multi-media

(9)

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Wearables IoT Use Case

• At the Austin marathon

−

74% use wearables to train

−

88% of people surveyed said they rely on wearables for

motivation similar to a coach

−

78% believe wearables give them a competitive edge

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Connected Intelligence – Entry Requirements

Secure Data

Energy Efficient

Robust

Easy to Use

• Product Longevity

• Balanced

Performance/Power

• Shrinking Power

Envelopes

• Diverse Data

Sources

• Optimized Networks

• Security, Security,

Security

• Authentication & trust

• Reliable

• Product Longevity

• Functional safety

• Integrated,

Compatible, Modular,

Scalable

• Global Partners

• Faster Time to

Market

(11)

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500,000X TEM

Nanocrystal storage layer

Select

Gate

Nanocrystal

diameter =

~10 nm

Diameter of

an atom =

0.1-0.5 nm

Control Gate

Connected Intelligence Innovations

Advances in Flash

Miniaturisation & Advances in

(12)

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WaRPboard.org

Wearable Reference Platform

• Open source development board / reference platform, with community support

• Speeds and eases development for creating wearable devices by addressing key technology

challenges which frees developers to focus on creating differentiated features:

−

Connectivity

−

Usability

−

Maximizing battery life

(13)

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Great Ideas That Were Mocked

This telephone has too many

shortcomings to be considered as a

means of communication. The device

is of inherently no value to us.

“

”

Western Union

(14)

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Great Ideas That Were Mocked

The horse is here to

stay, the automobile

is only a fad.

“

”

Bankers advice to Horace Rackham,

lawyer for Henry Ford, 1903

(15)

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Great Ideas That Were Mocked

Television won’t last

because people will soon

get tired of staring at a

plywood box every night.

“

”

Darryl Zanuck

Movie Producer,

(16)

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Great Ideas That Were Mocked

[Apple's iPhone] is the most expensive

phone in the world and it doesn't appeal

to business customers because it doesn't

have a keyboard which makes it not a

very good email machine…

So, I kinda look at that and I say, well, I

like our strategy. I like it a lot.

“

”

Steve Ballmer

Microsoft CEO,

January 17, 2007

(17)

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Kitty Wig

The Dog Sack

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Innovation that

was mocked

iPhone

Kitty Wig

Innovation that

was also mocked

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Successful Companies

Innovate and Take Risk.

Freescale is

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As a Leader in Connected Intelligence Technology,

Freescale is Making the World a Smarter Place.

(21)

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Freescale, Global Leader in

Embedded Processing Solutions

25%

8%

44%

7%

16%

Freescale 2013 Revenue

Other

• Cellular

• IP

• Foundry

i.MX 6-series applications processors

Xtrinsic sensors software

Xtrinsic eCompass

sensor software

16-bit MCU

reference design

Kinetis K70 MCUs

Vybrid controllers

QorIQ 64-bit

communications processors

i.MX 6 DualLite applications processors

Xtrinsic smart pressure sensor

Kinetis L-series MCUs

i.MX 6-series

applications processors

QorIQ Qonverge basestation-on-a-chip

Home Health Hub

reference design

Xtrinsic capacitive & resistive

touch sensor solution

Xtrinsic pressure sensors

Digital Signal

Controllers

Analog system

basis chips

Solar inverter

reference design

Kinetis K60 MCUs

Vybrid controllers

Xtrinsic

6-axis sensor

Analog engine

control IC

Sources: (1) ABI Research, December 2012; (2) Gartner, Apr 2013, Market Share: Semiconductor Applications, Worldwide, 2012, ranking based on market share; (3) Embedded Processing Unit – excluding compute applications. Ranking based market share. “Market Share: Semiconductor Applications, Worldwide, 2012,” Gartner Dataquest, March 2013. The Gartner Report(s) described herein, (the “Gartner Report(s)”) represent(s) data, research opinion or viewpoints published as part of a syndicated subscription service by Gartner, Inc. (“Gartner”). Each Gartner Report speaks as of its original publication date (and not as of the date hereof); Gartner Report speaks as of its original publication date (and not as of the date of this Filing) and the opinions expressed in the Gartner Report(s) are subject to change without notice; (4) IHS, April 2013; excludes internally supplied sub-system businesses; (5) Strategy Analytics, April 2013; (6) IDC, Tablet and eReader Application Processor Market Share Q2 2013, doc # #244035; (7)+(8) IHS, March 2013, Competitive Landscape Tool – Annual - 2012; (9) Strategy Analytics, April 2013; (10) IHS, April 2013; excludes internally supplied sub-system businesses.