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Effect of solder volume on interfacial reaction between SAC405 solders and EN(B)EPIG surface finish

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Figure

Fig. 1. SEM top surface and cross-sectional view of EN(B)EPIG reflowed with Sn-4Ag-O.5Cu solder (a, b) 0300pm, (c, d) 0700pm
Fig. 3 IMC thiclcness of SAC405/EN(B)EPIG after reflow soldering and aging at 125OC with solder size 0300pm and 0700pm

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