• No results found

Power Delivery Network (PDN) Analysis

N/A
N/A
Protected

Academic year: 2021

Share "Power Delivery Network (PDN) Analysis"

Copied!
26
0
0

Loading.... (view fulltext now)

Full text

(1)

Power Delivery Network (PDN)

Analysis

(2)

Importance of PDN Design

Power

Deliver

Network

(PDN)

Ensure clean power

EMC Limit

Signal Integrity

(3)

Power Delivery Network (PDN)

Power net

Ref. net

PDN consists:

1. VRM (voltage regulator module)

2. Capacitors (Decoupling/Bypass)

3. PCB parasitic impedance

Bulk

caps

VRM

MB

caps

Active

device

(4)

IR-Drop

AC PI Analysis

Decap Analysis Tool

SSO from DDR2 Module

PCB+Pckg+Chip

(5)

Board Description

130mm

70mm

 8 metal layers board with

total thickness 1.696mm

 1.8V power plane to be

analyzed located in 4th

layer

 1 memory controller and

2 DDR2 memory modules

(6)

IR-Drop Simulation

19 CPU pins, 16 Mem I pins & 16 Mem II pins @ 20mA

1.8V

Component Voltage (V) VDD Drop (V) GND Drop (V) Resistance DC Memory controller Group 1.78849 10.507m 1.007m 575mOhm Memory Module I Group 1.7889 10m 0.969m 498mOhm Memory Module II Group 1.789 9.409m 0.929m 469mOhm Mem. Ctrl II I

(7)

PDN Impedance of 1.8V Net

 3 PDN Impedances are plotted

from three different components:

 D1 the memory controller

(8)

Spatial Impedance Plot

Impedance plot on P1V8 plane

seen from memory controller

@2.6GHz

Impedance plot on P1V8 plane

seen from memory module I

Impedance plot on P1V8 plane

seen from memory module II

(9)

220pF

Decap Placement

Decaps shifts the high impedance

at its placement area

(10)

SSO Analysis for 2 DQ lines

VRM 2 I/O Buffer: Driver 2 I/O Buffer: Input

 DDR2-400 I/O Buffer IBIS

 PRBS N=7

(11)

Transient Response

No Decaps

(12)

Over designing the PCB  Additional BOM cost

 slightly or without performance improvement

Decap Analysis Tool

Define the target impedance

Define the list of parts for

optimization

Start the optimization

Multiple goals:

 Optimizing the BOM cost

(13)

Decap Analysis Tool Optimization (Step 1)

Target Impedance

Part lib. of current

Decaps mounted on PCB

(14)

Decap Analysis Tool Optimization (Step 2)

Removing the decaps

from PCB (Bare board)

(15)

Decap Analysis Tool - Results

Locate the marker to impedance curve manually and

optimizing the impedance

Initial config. with

23 decaps

Impedance curve

with 10 decaps

Before: 76¢

After : 52¢

(16)

Decap Analysis Tool – Results (II)

Run the automatic impedance optimization

Impedance curve

after optimization

Before: 76¢

After : 33¢

(17)

PDN Impedance: PCB + I/O Buffer Pckg

PCB PACKAGE

VDD Line

VSS Line

+

-

PDN Impedance Z

VRM

(18)

PDN Impedance Comparison

Series resistive

and inductance

(19)

PDN Impedance: PCB + Package + Chip

PCB PACKAGE

VDD Line

VSS Line

+

-

Total PDN

VRM

CHIP

SPICE

model

from Vendor

or

using “c_comp”

(20)

PDN Impedance Comparison

Lumped RC DIE or

better SPICE

improve the high

frequency PDN Imp.

(21)

SSO Analysis Setup

CHIP SPICE

model

(22)

Transient Response

Max Noise: 1.89V

Max Noise: 1.84V

(23)

Impedance Measurement Method

Two port shunt-through measurement:

connection

Z

Z

connection

DUT

Z

connection

Z

One port measurement:

DUT DUT conn DUT I DUT conn I

Z

Z

Z

Z

I

V

I

V

Z

Z

Z

I

V

Z

  . 2 2 0 2 1 12 . 0 1 1 11 1 2

(24)

Probing Position

GND pins

PWR pins

Goals:

 Very small layout area

for probing (2mm²)

 High frequency

(25)

Comparison

(26)

Conclusions

Frequency Domain Analysis

• Quick and less computational effort

• Optimization via Decap Tool analysis

• No charging effect

Time Domain Analysis

• Provides more realistic I/O behavior (using IBIS buffer)

• Higher simulation time for complex board  HPC

Impedance Measurement

• One Port measurement

• Two port measurement

References

Related documents