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DUPONT 17G-SERIES SERIES RESISTORS SYSTEM HR COMPOSITIONS

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All values reported here are results of experiments in our laboratories intended to illustrate product performance potential with a given experimental design. They are not intended to represent the product’s specifications, details of which are available upon demand. PRODUCT DESCRIPTION

DuPont 17G-Series screen printable resistor compositions are specially formulated and tested for use on gold conductor terminations. These compositions range from 3 Ω/sq to 1 MΩ/sq. Each member is blendable with the adjacent members. There are no blend breaks. The length effects have been characterized for very small resistors.

PRODUCT BENEFITS

• Qualified and tested on Au conductor

• Excellent encapsulated and unencapsulated post laser trim stability after laser trimming and long term storage • Optimised for 60 minute 850°C firing profile • Fully blendable resistor series

• Phthalate, Cadmium, Nickel oxide free*

* Phthalate, Cadmium and Nickel oxide ‘free’ as used herein means that cadmium, phthalate and nickel oxide are not intentional ingredients in and are not intentionally added to the referenced product. Trace amounts however may be present. PROCESSING SUMMARY

Screen Type

• 200 mesh stainless steel screen with a 12-18 µm emulsion build up. Nylon or polyester screens my be used in some applications. A 150-175 mesh screen will usually be required to achieve equivalent print thickness.

• Recommended dried thickness 25+/-3 µm.

Drying

• Allow prints to level for over 10 minutes at room temperature, then dry for ≥ 10 -15 minutes at 150°C

Firing

• 850°C peak held for 10 minutes on 60 minute cycle in an air atmosphere. DuPont 17G-Series resistivity and TCR

specifications are based on a 60-min firing cycle with a 10 min peak at 850°C, 20 min above 800°C and 30 min above 600°C (see Chart 1).

COMPATIBILITY

Whilst DuPont has tested this composition with the materials specified above and the recommended processing conditions, it is impossible or impractical to cover every combination of materials, customer processing conditions and circuit layouts. It is therefore essential that customers thoroughly evaluate the material in their specific situations in order to completely satisfy themselves with the overall quality and suitability of the composition for its intended application (s).

Table 1-Typical Physical Properties

Test Properties

Viscosity (Pa.s.) Brookfield HBT, utility cup and

spindle, (SC4-14/6R),10 rpm, 25°C±0.2°C) 145-210 Coverage [cm2/g] Based on wet thickness of 50µm 80-110 Thinner 4036 or 8250 or 4553

Shelf Life (months) 6

TERMINATIONS

Use of a different termination material may cause a shift of TCR and resistivity values from those stated.

RESISTOR GEOMETRY

17G–Series compositions are quality Assured tested using a 1.5mm x 1.5mm resistor with prefired DuPont Au termination. Variations in resistor geometry will result in slight variations of resistivity and TCR values. Length effect curves are presented in figure 3, with data based on tests of 0.5-1.5 mm wide resistors varying in aspect ration from 0.4—4.0sq.

BLENDING ADJACENT MEMBERS

Adjacent members of 17G-Series are blendable. See figure 2.

SERIES RESISTORS SYSTEM HR COMPOSITIONS

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STORAGE AND SHELF LIFE

Containers may be stored in a clean, stable environment at room temperature (between 5°C – 30°C) with their lids tightly sealed. Storage in high temperature (<30°C) or in freezers (temperature <0° C) is NOT recommended as this could cause irreversible changes in the material. The shelf life of compositions in factory-sealed (unopened) containers between (5°C – 30°C) is 6 months from date of shipment.

SUBSTRATES

Substrates of different compositions and from various

manufacturers may result in variations in performance properties. THINNER

17G-Series compositions are optimized for screen printing and thinning is not normally required. Use the DuPont recommended thinner for slight adjustments to viscosity or to replace evaporation losses. The use of too much thinner or the use of a

non-recommended thinner may affect the rheological behaviour of the material and its printing characteristics. Please refer to table 1. Typical Physical Properties’

PRINTING

The composition should be thoroughly mixed before use. This is best achieved by slow, gentle hand stirring with a clean burr-free spatula (flexible plastic or stainless steel) for about 1-2 minutes. Care must be taken to avoid air entrapment. Printing should be performed in a well ventilated area. Additional information on requirements for printing areas is contained in DuPont Technical Guide EUT 7.3 ‘Processing-Screen Printing Rooms’ available on request. Note: optimum printing characteristics are generally achieved in the room temperature range of 20°C-23°C. It is therefor e important that the material, in its container, is at the temperature prior to commencement of printing. Class 10,000 printing area is recommended for building complex hybrids and multilayer circuits, otherwise severe yield losses could occur. Refer to ‘Processing Summary’.

DRYING

Allow prints to level at room temperature, then dry in a well ventilated oven or conveyor dryer. Refer to ‘Processing Summary’.

FIRING

Fire in well ventilated belt, conveyor furnace or static furnace. Air flows and extraction rates should be optimized to ensure that oxidizing conditions exist within the muffle and that no exhaust gases enter the room.

Full information on requirements for firing is contained in DuPont Technical Guide EUT 7.4 ‘Process Guide-Firing’. Refer to ‘Processing Summary’.

ENCAPSULATION

In general, glass encapsulation is not required. However, in applications which require mechanical protection or protection from extreme environments such as high temperature nitrogen or forming gas, DuPont encapsulant compositions QQ550 and QQ620 are recommended.

GENERAL

Performance will depend to a large degree on care exercised in screen printing. Scrupulous care should be taken to keep the composition, printing screens and other tools free of metal contamination. Dust, lint and other particulate matter may also contribute to poor yields.

SAFETY AND HANDLING

DuPont thick film compositions are intended for use in an industrial environment by trained personnel. All appropriate health/ safety regulations regarding storage, handling and processing of such materials should be complied with. For information on health / safety regulations please refer to the specific product MSDS and to the DuPont Safety Guide EUT 7.1 ‘Practical Safe Handling of Thick Film Compositions’.

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Table 2-Typical Fired Properties1

1703H 1708H 1718H 1728 1738R 1748R 1758

Resistivity1 (Ωsq, %) 3 ± 10 10 ± 10 100 ± 10 1k ± 10 10k ± 10 100k ± 10 1M ± 10 Temperature Coefficient of Resistance (TCR)

ppm/°C 0 ± 100 0 ± 100 0 ± 100 0 ± 100 0 ± 100 0 ± 100 0 ± 100

Short Term Overload Voltage2,V/mm 5 9 30 75 250 280

Standard Working Voltage3: V/mm 2 4 12 30 100 110

Maximum Rated Power Dissipation4: mW/mm2 888 864 900 562 1000 120

Quan Tech Noise5 ,dB -31 -24 -16 -13 -6 2

1 Shipping specifications: reported to Dried thickness 25 μm. Fired on 5715 Au prefired termination. Resistor geometry: 1.5 mm x 1.5 mm. Temperature coefficient of resistance : –55 to 25°C and 25 to 125°C Firing : 60-min cycle to peak temperature of 850°C for 10 min.

All tests performed on 96% alumina substrate

2 Short term overload voltage — voltage required (5-sec duration) to induce a resistance change of 0.25% in a 1 mm x 1 mm trimmed resistor at 25°C 3 Standard working voltage : 0.4 x short term overload voltage.

4 Maximum rated power = (Standard Working Voltage)2 / Resistance

5 Resistor geometry : 1 mm x 1 mm; Firing cycle : 60-min cycle to peak temperature of 850°C for 10 min .

Chart 1. Firing Profile

Temper at ur e (°C) Time/minutes 60 Minute Cycle 1,000 800 600 400 200 0 0 10 20 30 40 50 60 10 min at Peak Rise Rate ~50°C/min 300±500°C Descent Rate ~50°C/min 700±300°C 850°C Peak 20 min Entry Exit 30 min Belt Travel

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1,000 800 600 400 50 25 0 –25 –50 –75 –100 –125 –150 –175 –200 Blend, wt% 1703H 100 75 50 25 0 1708H 0 25 50 75 100 Re sis ta nc e TCR, p pm/C 1703H/1708H 500 100 50 10 5 1 50 25 0 –25 –50 –75 –100 –125 –150 –175 –200 Blend, wt% 1708H 100 75 50 25 0 1718H 0 25 50 75 100 Re sis ta nc e TCR, p pm/C 1708H/1718H Re sis ta nc e 10,000 1,000 100 TCR, p pm/C 75 50 25 0 –25 –50 –75 –100 –125 –150 –175 –200 Blend, wt% 1718H 100 75 50 25 0 1728 0 25 50 75 100 1718H/1728 Sheet R es is tiv ity , /s q 10k 8k 6k 5k 4k 3k 2k 1k TCR, p pm/C 100 80 60 40 20 0 –20 –40 –60 –80 Blend, wt% 1728 100 80 60 40 20 0 1738 0 20 40 60 80 100 1728/1738R Sheet R es is tiv ity , /s q 100k 80k 60k 50k 40k 30k 20k 8k 10k TCR, p pm/C 60 40 20 0 –20 –40 –60 –80 –90 Blend, wt% 1738R 100 80 60 40 20 0 1748R 0 20 40 60 80 100 1738R/1748R Sheet R es is tiv ity , /s q 1M 800k 600k 500k 400k 300k 200k 80k 100k TCR, p pm/C 60 40 20 0 –20 –40 –60 –80 –90 Blend, wt% 1748R 100 80 60 40 20 0 1758 0 20 40 60 80 100 1748R/1758 HTCR CTCR

Figure 2. Blending Characteristics

Adjacent members of 17G-Series are blendable. Resistivities and TCRs blend smoothly and predictably for all blend ratios. The data required in these curves were generated using resistors terminated with prefired 5715 Au Conductor.

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Re si stiv ity F act or 1.4 1.2 1.0 0.8 0.6 0.4 Re si stiv ity F act or 1.4 1.2 1.0 0.8 0.6 0.4 Re si stiv ity F act or 1.4 1.2 1.0 0.8 0.6 0.4

Resistor Length, squares

0 1 2 3 4 5 1718H 1708H 1703H Re si stiv ity F act or 1.4 1.2 1.0 0.8 0.6 0.4 Re si stiv ity F act or 1.4 1.2 1.0 0.8 0.6 0.4 Re si stiv ity F act or 1.4 1.2 1.0 0.8 0.6 0.4 Re si stiv ity F act or 1.4 1.2 1.0 0.8 0.6 0.4

Resistor Length, squares

0 1 2 3 4 5 1758 1748R 1738R 1728 0.50mm 0.75mm 1.00mm 1.50mm

Figure 3. Length Effect Curves for Resistivity

Data for the 0.5–4.0 sq resistors are reported for resistor widths of 0.5mm–1.5 mm. The 1.5 mm x 1.5 mm resistor was

controlled to a dried thickness of 25µm. All of the resistivity data have been referenced to this resistor. Terminations are prefired 5715 Gold Conductor.

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FOR MORE INFORMATION ON DUPONT 17G-SERIES OR OTHER DUPONT MICROCIRCUIT MATERIALS PRODUCTS, PLEASE CONTACT YOUR LOCAL REPRESENTATIVE:

Americas

DuPont Microcircuit Materials 14 TW Alexander Drive

Research Triangle Park, NC 27709 USA

Tel +1 800 284 3382 (calls within USA) Tel +1 919 248 5188 (calls outside USA)

Europe, Middle East & Africa

Du Pont (UK) Ltd Coldharbour Lane Bristol BS16 1QD UK Tel +44 117 931 3191 Asia

DuPont Kabushiki Kaisha Sanno Park Tower, 11-1 Nagata-cho 2-chome Chiyoda-ku, Tokyo 100-611 Japan Tel +81-3-5521-8650 DuPont Taiwan Ltd 45, Hsing-Pont Road Taoyuan, 330 Taiwan Tel +886 3 377 3616

DuPont China Holding Company Ltd Bldg. 11, 399 Keyuan Road

Zhangjiang Hi-Tech Park Pudong New District Shanghai 201203 China Tel +86 21 6386 6366 ext. 2202

DuPont Korea Inc. 3-5th Floor, Asia tower #726 Yeoksam-dong, Gangnam-gu Seoul 135-719, Korea Tel +82 10 6385 5399

E.I. DuPont India Private Limited 7th Floor, Tower C, DLF Cyber Greens Sector-25A, DLF City, Phase-III Gurgaon 122 002 Haryana, India Tel +91 124 409 1818

Du Pont Company (Singapore) Pte Ltd 1 HarbourFront Place, #11-01

HarbourFront Tower One Singapore 098633 Tel +65 6586 3022

mcm.dupont.com

Copyright © 2015 DuPont. All rights reserved. The DuPont Oval Logo, DuPont™, and all DuPont products denoted with ® or ™ are registered trademarks or trademarks of E. I. du Pont de Nemours and Company or its affiliates.

This information corresponds to our current knowledge on the subject. It is offered solely to provide possible suggestions for your own experimentations. It is not intended, however, to substitute for any testing you may need to conduct to determine for yourself the suitability of our products for your particular purposes. This information may be subject to revision as new knowledge and experience becomes available. Since we cannot anticipate all variations in end-use conditions, DuPont makes no warranties, and assumes no liability in connection with any use of this information. Nothing in this publication is to be considered as a license to operate under or a recommendation to infringe any patent right.

CAUTION: Do not use in medical applications involving permanent implantation in the human body. For other medical applications, see “DuPont Medical Caution Statement,” H-50102-5. K-26774-5 2/15

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