Influence of Solder Reaction
Across Solder Joints
Kejun Zeng
FC BGA Packaging Development
Semiconductor Packaging Development
Outline
Introduction
Solder reactions of metals
− Dissolution of metals in molten solders
− IMC formation during reflow
− IMC formation during solid state aging
Solder reactions across joints
– Cu
6Sn
5appears on Au/Ni(P) pad of substrate
– AuSn
4forms throughout solder joint
Influence of metals on reliability across joints
– Au enhances consumption of Ni(V)/Cu UBM
– Ni plating is consumed by Cu
6Sn
5Introduction
With the electronic devices being continuously scaled down, solder
reaction is becoming one of the major concerns for packaging reliability.
Due to the Pb-free requirement, new surface finishes have appeared in
the market and more are being studied.
Persistence of the Black Pad problem results in the application of
OSP-Cu or bare OSP-Cu.
Local effects of solder reaction on joint reliability has been extensively
studied, but its effects on the other side of the joint is relatively new to the
industry.
Theories for the study of solder reactions:
− Local equilibrium
− Reaction path
Dissolution of metals in molten solders
W
Stable phase diagram
Metastable phase diagram
Sta ble M eta sta ble
Actual concentration of Cu in molten solder at the interface can be higher than what the stable phase diagram indicates, depending on the surface
0.0001 0.001 0.01 0.1 1 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 1000/T(K) S ol ub ili ty (M ol e fr ac tio n) Au Ni Pd Cu 0.0001 0.001 0.01 0.1 1 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 1000/T(K) S ol ub ili ty (M ol e fr ac tio n) Cu Ag Au Ni Pd
Metal solubility in Sn-Pb Metal solubility in Sn-Ag
Thermodynamically calculated equilibrium saturation solubility of metals in molten solders. (1) Ni has the lowest solubility in solders. (2) Solubility of metals in Sn-Ag, SnCu, and
Dissolution rates of various metals in the 60Sn-40Pb solder as a function of T [Bader, 1969]. Note that the latest experimental results showed that the solder reaction of Pd was very fast [Wang & Tu, 1995]. Schematic concentration profile of metal in
moleten solder. Higher solubility greater
gradient higher diffusion rate higher
dissolution rate.
Solder
M
eta
IMC formation during reflow
350°C
Reaction path (arrows exaggerated for readability). After saturation solubility is
reached, Cu6Sn5 forms at interface. Because
Cu6Sn5 is not in equilibrium with Cu, Cu3Sn
appears between Cu6Sn5 and Cu.
400°C
Following the same procedure, it is
predicted that in high Pb solder joint Cu3Sn
is the first IMC to form. This is in
agreement with experimental results by Grivas et al., 1986.
220°C
After reflow process, Cu6Sn5 is usually
observed in the eutectic solder joint. A thin
layer of Cu3Sn forms but is not easy to see.
Eutectic SnPb/Cu joint after 1 reflow. SEM image (Texas Instruments).
Cu6Sn5
Cu3Sn
Cu
Eutectic SnPb/Cu/Ni(V)/Al joint after 3 reflows. Voids are marked by red arrows. TEM image. (Courtesy of K. N. Tu, UCLA)
1µm
Cu6Sn5 Ni(V) Al Al SiO2 Si Cu3SnIMC formation during solid state aging
175°C
During solid state aging, both Cu6Sn5 and
Cu3Sn grow thicker.
SnPb/Cu joint after 40 days at 150°C. Since
Cu is the dominant diffuser in Cu6Sn5,
Kirkendall voids form in the Cu3Sn layer.
SIM image (Texas Instruments).
Cu
6Sn
5Cu
3Sn
Cu
Solder
SnPb/Au/Ni/Cu BGA joint after 500 hours at 160°C. During reflow, Au
plating was totally dissolved away. After aging, Au diffused back to the interface
and form (Au,Ni)Sn4. SEM image.
(Courtesy of C. R. Kao, National Central University, Taiwan).
Ni can be dissolved into AuSn4 by replacing
gold atoms. This is because the dissolution of
Ni can lower Gibbs energy of AuSn4.
Thermodynamic calculation shows that the max. solubility is 10 at.% or 4.9 wt.% and the max. energy change is 3 kJ/mole of atoms.
Cu
6
Sn
5
appeared on other side
SnPb flip chip bumps on Ni/Au pad. Cu in the interfacial compounds came from Cu UBM
on the die side. (Cu,Ni)6Sn5 composition (at.%): 46.7Cu, 8.2Ni, 45.1Sn. (Texas
Instruments)
This is an indication that Ag and Pd can also reach the other side of a joint after reflow.
Cu
6Sn
5Ni
3Sn
4Ni
Cu
Solder
(Cu,Ni)
6Sn
5Cu
Ni
a) After 3 reflows
b) After 150°C/1000 hour baking
AuSn
4
formed throughout joint
Eutectic Sn-Pb solder cap on Au at 200°C. a) after 5 seconds, b) after 60 seconds. AuSn4
compound has extended all the way to the surface of the cap. With a diffusivity of 10-5 cm2/s,
Au atoms can diffuse a distance of 100 µm in 5 seconds to the cap top. (Kim & Tu, 1996).
Au enhances consumption of Ni(V)/Cu UBM
Ni(V): 400 nm Passivation layer SiO2 Cu: 300 nm Al: 400 nm Au: 0.125 µm Ni(P): 10 µm Solder Si FR4 Cu pad50% after 1 reflow; 100% after 3 reflows Sn-3.5Ag-1.0Cu
30% after 10 reflows; 100% after 20 reflows Sn-37Pb
Ni(P)/Au/solder/Cu/Ni(V)/Al
60% after 10 reflows Sn-3.5Ag-1.0Cu
No dissolution after 20 reflows Sn-37Pb
Solder/Cu/Ni(V)/Cu/Al
Fraction of Ni(V) dissolved by molten solder Solder
Au/Ni(P) pad Cu/Ni(V)/Al UBM SnAgCu bump (a) Au/Ni(P) pad SnAgCu bump Cu/Ni(V)/Al UBM (b)
SEM images of cross-section of a eutectic SnAgCu flip chip joint. (a) As-bonded. (b) After 10 reflows, IMC crystals have been spalled into bulk solder. Ni(V) layer has been completely dissolved. The presence of Au has enhanced the dissolution of Ni(V) layer. (Courtesy of M. Li, Institute of Materials Research and Engineering, Singapore)
Cu6Sn5
compound
Cr Si
5 µm 1µm
(a) SnPb on Au/Cu/Cr UBM. Cu6Sn5
scallops were decorated with small particles. [Liu&Tu, 1996]
(b) SnPb on Cu/Ti UBM. Surface of
Cu6Sn5 scallops were smooth.
[Kim&Tu, 1996] Ni(V) r Cu6Sn5 Ni(V) R Cu6Sn5