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Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint

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Figure

Fig. 1 Schematic of cross-sectioned Sn-Ag solder bump.
Fig. 2 Refow profle of Sn-Ag solder bump.
Fig. 5 Bump shear strength variation with site and amount of corrosion product.
Fig. 6 SEM micrographs of the Sn-Ag bumps; (a) before and (b) after shear test, (c) corresponding F-x curves and (d) shear strength.
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