SMP-QFN DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS

(1)

34±0.125 socket body 34.225±0.125 socket lid

32.600±0.125 socket lid

A A

1.700 6.350 2.500

3.5 hole

5hole

32 SECTION A-A

customer's device

Recommended torque 11.3 N-cm [1 lbf-in]

34.956 14.40 6.40

12.75 12.75

32 customer's target PCB

SMP-QFN DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS

Features

• Wide temperature range (-55C to +155C).

• High current capability (up to 4A).

• Excellent signal integrity at high frequencies.

• Low and stable contact resistance for reliable production yield.

• Highly compliant to accommodate wide co-planarity variations.

• Automated probe manufacturing enables low cost and short lead time.

Dual latch removable lid shown. See page 7 for optional open top lid

Description: SMP socket for 5x5mm 0.5mm pitch QFN32

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

(2)

34±0.125 socket body 34.225±0.125 socket lid

32.600±0.125 socket lid

R R

A

1.700 6.350 2.500

3.5 hole

5hole

32 SECTION R-R

customer's device

Recommended torque 1 in lb

W

SECTION A-A

device 0.80 thickness

0.025 0.605 at test 4.5513±0.0250

compression plate height

DETAIL W SCALE 5 : 1

SMP-QFN DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: SMP socket for 5x5mm 0.5mm pitch QFN32

(3)

8±0.025 (X4)

8±0.0250 (X2)

32±0.125 socket base outline

8±0.025 (x4)

4X 2.40±0.05 THRU ALL non plated mounting holes

2.02+ 0.030

0 THRU ALL 1.75

1.75 34.225±0.125 socket lid outline 32.60±0.125

socket lid outline

8.50±0.125 latch outline

6.35±0.125 latch outline 1.52+ 0.03

0 THRU ALL

4

4 B

The component keepout area on the top side of the PCB is the area inside the red contour

0.50 typ

3.45

0.28

0.50

4.10

5.80

0.85 DETAIL B

Target PCB Recommendations Total thickness: 1.5mm min.

Plating: Gold or Solder finish Description: Recommended PCB layout

(4)

5.15 4.85

5.15 4.85 Pin 1 index area

B A

1.00 0.80

0.05 max

0.20 REF

0.08 C C

4x 3.50

32x 0.30 0.18

0.50 0.5 0.3

0.10

^M

C A B

Description: Compatible QFN device

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2

3 4 1

6 6 7 7

5

3 19 4

12

13

14

15

16 17 20

11 18

9 10

?

22 8

?

ITEM

NO. DESCRIPTION Material

1 Socket Lid clamshell double latch 7075-T6 Aluminum Alloy 2 M10x0.75 fluted knob compression

screw, Ni plated 7075-T6 Aluminum Alloy

3 Latch 7075-T6 Aluminum Alloy

4 Hinge Pin and Snap Ring, 3mm OD,

25mm long, SS Stainless Steel (ferritic) 5 Precision Compression Spring, Zinc-

Plated Music Wire, 1/2" Length, .12"

OD, .016" Wire Zinc Plated Music Wire 6 Screw, M3 x 12mm, Low Head Cap,

SS 18-8 Stainless Steel

7 Spring Clamshell lid assembly Steel Music Wire 8 M2 Dowel Pin 4mm SS Stainless Steel (18-8) 9 Dowel Pin, M1.5 x 5mm, SS AISI 347 Annealed Stainless

Steel (SS)

10 Dowel Pin M2x5mm Stainless Steel (18-8)

11 M2x0.4 Flat Head Phillips 16m long 1.1158 (C25E)

12 Socket base Torlon 5530

13 Protective Layer for 10x10 mm QFN68, 0.5mm pitch Kapton Polyimide/Cirlex 14 SM interposer for 5x5 mm QFN32,

0.5mm pitch SM elastomer

15 Customer's target PCB FR4 Standard

16 Insulation Plate Ultem 1000

17 Backing Plate 7075-T6 Aluminum Alloy

18 #0-80 internal Thread brass insert,

Press fit Brass

19 Customer's device FR4

20 Compression plate 7075-T6 Aluminum Alloy

21 Dowel Pin, M1 x 3mm, STL Alloy Steel

22 1/16" x 3/8" long dowel pin Alloy Steel Description: Socket assembly

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34±0.125

4X 2.6000±0.1000 THRU ALL insulating plate hole

12.8150 (x4) 5 6.1818 (x4)

R0.80

4.50 (x4) 2.75 (x4)

4X M2X0.4 - 6H THRU ALL backing plate hole 70°

6.35 - 0 0.05 2.50±0.07

backing plate insulating plate

Description: Insulating plate

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34±0.125 socket body 28±0.125 socket lid

4

4 C C

Recommended TBD

6.35 2.50 2.50

32 SECTION C-C

customer's device

3.61 9.54 2.08

32 customer's target PCB

SMP-QFN DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS

Features

• Wide temperature range (-55C to +180C).

• High current capability (up to 8A).

• Excellent signal integrity at high frequencies.

• Low and stable contact resistance for reliable production yield.

• Highly compliant to accommodate wide co-planarity variations.

• Automated probe manufacturing enables low cost and short lead time.

Open top lid C14222 is sold separately

Description: SMP socket for 5x5mm 0.5mm pitch QFN32

(8)

D

TOP VIEW

BOTTOM VIEW

DETAIL D SCALE 8 : 1

Description: Socket base on target PCB

(9)

29 TOP VIEW

FRONT VIEW

8.5512

SIDE VIEW

ISO TOP 12.50

BOTTOM VIEW

ISO BOTTOM

Description: Compression plate w/hard stop