HERAEUS ELECTRONICS YOUR MATERIALS SOLUTIONS PARTNER

(1)

HERAEUS ELECTRONICS

YOUR MATERIALS SOLUTIONS PARTNER

(2)

2

MORE THAN

50

^YEARS

OF EXPERIENCE WITH PROVIDING MATERIALS TO THE ELECTRONICS INDUSTRY

50+

COUNTRIES WHERE OUR PRODUCTS ARE SOLD HEADQUARTERED IN

HANAU,

GERMANY

1400+

EMPLOYEES WORLDWIDE

10

PRODUCTION SITES IN

7

^COUNTRIES

We are one of the leading manufacturers of materials for the assembly and packaging of devices in the electronics industry.

We develop sophisticated materials solutions for consumer electronics and computing, automotive, LED, power electronics and communications.

Our core competences include bonding wires, assembly materials, thick film pastes as well as roll clad strips and substrates, and their integration into perfectly matched systems.

WE ARE

HERAEUS ELECTRONICS

(3)

MARKETS KEY

AUTOMOTIVE LED

COMMUNICATIONS POWER

ELECTRONICS CONSUMER ELECTRONICS

& COMPUTING

In today’s highly competitive and fast-paced markets, short lead time and development process are your key to remain competitive. Customer expectations on device features and tough price competition are ever increasing.

To succeed and be ahead of your competition, it is essential to optimize your design and processes, shorten your development cycles which in turn reduce costs, and also mitigate risks in all aspects. Our mission is to help you fulfill all requirements at maximum yield.

With a good combination of material expertise and technological know-how, our team can look into your processes and challenges, and develop high-quality solutions that strengthen your competitiveness.

We are your ideal partner to achieve your business objectives and guide your business to greater success.

YOUR SUCCESS

IN A COMPETITIVE AND FAST MOVING MARKET

3 Key Markets

(4)

Innovative components

Matched materials

Engineering services

Proven materials

portfolio New

materials

MATERIALS SOLUTIONS

PARTNER

Pre-applied and qualified

material systems

Electronic devices consist of many materials: substrates, connectors, active and passive components, solders, adhesives, bonding wires, insulation and molding compounds and housings. When these materials are combined in a single device, complexity increases.

Different suppliers make it even more complex.

We dissolve these issues by creating perfectly matched solutions that minimize complexity and compromises. With our expertise, we provide you with innovative materials as well as sets or systems of matched materials.

We also support you with excellent engineering services.

In order to verify the quality of our tailored solutions we offer extensive prototyping, testing and qualification.

It takes deep materials knowledge in combination with systems know-how, testing expertise and manufacturing process experience to solve technical challenges.

Therefore, outsourcing of the material system design to Heraeus experts creates a double advantage. On the one hand you are getting a better, smaller, more reliable, environmentally-friendlier, easy-to-manufacture and integrate electronic component. On the other hand you are gaining the freedom to concentrate on other development tasks at the same time.

YOUR ONE-STOP

MATERIALS SOLUTIONS PARTNER

Materials Solutions Partner 4

(5)

Shorter time to market

It is crucial to deliver new solutions fast and ideally be a first mover on the market. By partnering with Heraeus, we can support with our material expertise and shorten your time to market. We have the capability to match all materials in a perfectly matched system with optimized interfaces between the materials, enabling us to develop and deliver better solutions in shorter time.

Demand for reliability

The operational life span of an electronic component should outlast the operating time of the device it is used in. Degradation mechanisms must be considered in the design of a component to make it as robust as possible against thermo-mechanical stress and harsh environmental conditions. It takes deep materials knowledge in combination with systems know-how, testing expertise and

manufacturing process experience to simulate long-time operating spans.

Miniaturization and weight reduction

Demands on the performance and functionalities of consumer devices in a smaller space is ever increasing. Smaller components require less material, saves space and in most cases are lighter. It also saves costs, especially if precious metals are involved.

Thermal management

The heat caused by power losses needs to be dissipated. This requires efficient management of thermal energy, otherwise chips can be damaged and service lifetime lowered. Our matched materials systems offer unique advantages as our development team can work with the specification data of the whole system.

MANAGING

YOUR CHALLENGES

Time to market is extremely important in the fast growing electronics market. With each new technology generation, electronic devices need to deliver higher performance and greater functions in a smaller form factor.

Development targets are to reduce device size and weight, improve reliability and heat dissipation, and also to ensure compliance with global environmental regulations. Heraeus is a reliable partner to overcome these challenges.

Legal compliance requirements

In order to improve environmental protection and sustainability, legislations such as RoHS, ELV, REACH and others have a growing influence on the design of technical solutions. It is important to substitute legislation critical materials, however, alternatives often do not offer the same absolute performance. A broad spectrum of materials knowledge is required to develop solutions with a similar outcome, good manufacturability and full compliance with the law.

5 Managing Your Challenges

(6)

From stand-alone materials to matched materials solutions, we support applications in markets like automotive, consumer electronics, communications, LED, and power electronics.

Our core competencies include bonding wires, adhesives, solder materials, sinter materials, thick film pastes, metal substrates, and metal ceramic substrates.

Hybrid Pastes Thick Printed Copper

Paste for Fuel Senders Passive Component Pastes

Sensor Pastes LTCC Materials Pastes on Steel

THICK FILM MATERIALS

Small design spaces, harsh conditions and requirements for reliable circuits are the challenges of many industries including the automotive sector, medical devices, aerospace, telecommunications, and consumer electronics. Heraeus Thick Film Materials provide the solutions needed across these broad application ranges.

METAL SUBSTRATES

Heraeus supplies roll clad strips and metallic substrates which meets all requirements of miniaturization. Our highly engineered processes create very clean and functional products with very narrow tolerances. All solutions are designed with high robustness and high conductivity, while being able to fit into tight spaces effortlessly.

OUR MATERIALS

Bondpads Complex Stamped Parts Roll Clad Strips

METAL CERAMIC SUBSTRATES - Condura^®

Comprehensive portfolio of metal ceramic substrates to optimally address the diverse requirements of the power electronic industry from low-power applications up to the most demanding ones.

Condura^®.classic

DCB-Al₂O₃ substrates (direct copper bonded alumina)

Condura^®.extra

DCB-ZTA substrates (zirconia toughened alumina)

Condura^®.prime

AMB-Si₃N₄ substrates (active metal brazed silicon nitride) DCB-Al2O3 DCB-ZTA AMB-Si₃N₄

Materials 6

(7)

Conductive Adhesives Non-Conductive Adhesives SMT Adhesives

ADHESIVES

Heraeus offers conductive and non-conductive adhesives for electronic component mounting applications. The materials are matched to the common processes used to mount components with excellent printing and dispensing properties. Our solutions simplify manufacturing processes and increase efficiency.

Solder Pastes Solder Wires for Die Attach Solder Powder Solder Fluxes

SOLDER MATERIALS

Heraeus specializes in the manufacturing of interconnected solder materials with products ranging from solder powders to wires, for die attach and SiP applications in semiconductors, advanced packaging, SMT, and other components of the electronics industry. Our solutions meet the highest standards in quality and process stability; ensuring superior reliability.

mAgic Sinter Pastes

SINTER MATERIALS

Heraeus mAgic series of silver sintered pastes offers a robust lead-free and halogen-free die-attach alternative where high reliability is vital. Designed for applications which demand excellent electrical and thermal conductivity, mAgic is an attractive solution, especially for power electronics.

Gold and Silver Bonding Wires

Aluminum Fine and Thick Bonding Wires and Ribbons Copper, Copper Thick and Coated Copper Bonding Wires

Fine Bonding Wires Special Wires

BONDING WIRES

Heraeus offers a portfolio of bonding wires with materials ranging from gold to copper, exactly fitting to your different applications and requirements. For the selection of the ideal solution, our specialists with years of experience support you with their technical expertise and application know-how.

7 Materials

(8)

OUR

MATERIALS SOLUTIONS

Due to continuous rise in power density, coupled with higher operating temperatures and demand for improved reliability, packaging materials are brought to their limits.

Material improvement in one single layer would only lead to a small contribution and shift the weakest point to the

next joining layer. It is necessary to work on solutions which take into account the whole stack of materials in the power module to enable significant performance improvement.

Aluminum bonding wire

Copper foil

Die fixation adhesive (optional) Surface plating (eg. NiPdAu)

Pre-applied sinter paste Pre-applied sinter paste Copper bonding wire

Silver plating on die

Metal ceramic substrate with silver plating

Die Top System (DTS^®)

The new Heraeus Die Top System (DTS^®) enables use of copper wire in combination with sinter technology.

It enables easy processing and significantly improves the electrical, thermal and reliability performance of the die connection, and improves the whole module performance.

Benefits:

Increase of die current capability vs. Al-wire by > 50 %

Increase of reliability vs. solder die attach / Al-wire of > 10 x or die shrink respectively

Uniform temperature distribution across the die;

avoiding hot spots

Compatible for high temperature semiconductors, enabling junction temperatures of 200 °C

8 Materials Solutions

(9)

Condura

^®

Choose your plus

Heraeus Condura^®+ offers a comprehensive solutions portfolio: for example, Condura^® with pre-applied solder reduces complexity in production by eliminating the step of printing solder and cleaning of flux residues.

At the same time it increases the yields and enables cost savings.

Condura

^®

with pre-applied solder

Direct copper bonded alumina substrates with pre- applied flux-free solder pads for die attachment.

Thanks to the innovative die fixation dot, the soldering process is significantly simplified.

Benefits:

50% less soldering process steps

No cleaning steps required

Lower investment

No solder or flux splatters

Improved yield

Lower production risks

No need for solder-stop

Options

n Burr-free holes

n Data matrix code

n AOI

n Ultrasonic testing

n Customized packing

Processing

n Pre-applied solder

n Pre-applied sinter paste

Services

n Matching materials

n Design

nThermal simulation

n Prototyping

n Active power cycling

n Testing

n Analytics

Properties

n Ceramic thickness

nCustomized warpage

n Copper thickness

n Surface finishing

n Laser scribing for singulation

n Customized dimples

n Grinding

Aluminum bonding wire

Copper foil

Die fixation adhesive (optional) Surface plating (eg. NiPdAu)

Pre-applied sinter paste Pre-applied sinter paste Copper bonding wire

Silver plating on die

Metal ceramic substrate with silver plating

Die Top System (DTS^®)

9 Materials Solutions

(10)

LET OUR SERVICES

BECOME YOUR STRENGTH

Our state-of-the-art application center offers a range of services to develop customer solutions in Hanau, near Frankfurt (Germany). Over 25 developers enable fast development and an efficient use of resources in the value chain. The application center offers an infrastructure for simulation, design, prototyping, testing and qualification of material systems in power electronic modules on 730 m², thereof 110 m² ISO8 clean room.

Our regional service labs in West Conshohocken (USA), Shanghai and Changshu (China) and Singapore are specialized in the needs of the local markets and guarantee a close proximity and quick response time for our customers.

Our R&D and services work in close cooperation with customers, universities, and research institutes.

Our service offer includes:

Processing support

Optimization of process parameters

Electrical and mechanical design of power modules

Prototyping of subassemblies and complete modules

Destructive and non-destructive material testing

Active and passive reliability tests

Environmental tests

Metallography and microscopy

Thermal, thermo-mechanical and lifetime simulation

By using our comprehensive state-of-the-art equipment and tools the customers benefit from faster development with higher first-time success rates. Our service portfolio together with our experience in packaging solutions contribute to customer’s problem solving.

10 Services

(11)

PRODUCTION SITES

SERVICE LABS

Hanau, Germany | West Conshohocken, USA | Changshu, China | Shanghai, China | Singapore HANAU

WEST CONSHOHOCKEN

CHISODA

KULAIJAYA CHANGSHU

SHANGHAI ZHAOYUAN

INCHEON

SINGAPORE

OUR WORLDWIDE LOCATIONS

Close to your development centers and factories we have experts located in Asia, US and Europe to grant fast reaction and easy access without language barriers.

Being ISO/TS 16949, ISO 9001, and ISO 14001 certified allows Heraeus to offer an even higher level of service and it is our conviction to develop environmentally friendly products that meets RoHS, ELV and REACH compliance regulations.

11 Services

(12)

A globally leading technology group, Heraeus is headquartered in Hanau, Germany. Founded in 1851, it is a family-owned portfolio company which traces its roots back to a pharmacy opened by the family in 1660. Today, Heraeus combines businesses in the environmental, energy, electronics, health, mobility and industrial applications sectors.

In the 2018 financial year, Heraeus generated revenues of €20.3 billion with approximately 15.000 employees

(including staff leasing) in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany and holds a leading position in its global markets.

With technical expertise, a commitment to excellence, a focus on innovation and entrepreneurial leadership, we are constantly striving to improve our performance. We create high-quality solutions for our clients and strengthen their long-term competitiveness by combining unique material expertise with leadership in technology.

HERAEUS GROUP

THE GLOBAL TECHNOLOGY COMPANY

Heraeus Electronics Americas China

Heraeus Deutschland GmbH & Co. KG Phone +1 610 825 6050 Phone +86 21 3357 5457 Heraeusstraße 12-14 [email protected] [email protected] 63450 Hanau, Germany

www.heraeus-electronics.com

Asia Pacific Europe, Middle East and Africa

Phone +65 6571 7677 Phone +49 6181 35 3627 [email protected] [email protected]

The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application. The Heraeus logo, Heraeus, Condura®, DTS®, Die Top System® and the Condura, DTS, Die Top System figurative mark are trademarks or registered trademarks of Heraeus Holding GmbH or its affiliates. All rights reserved.

The data given in this brochure are valid. Subject to alterations.06/2018 / Layout: www.data-graphis.de_ HET62001-0819-6

(13)

Continuing A Strong Bond

Advancing the Next Challenge in

Semiconductor Packaging

(14)

New end-market applications such as 5G, Internet of Things (IoT) and Artificial Intelligence (AI) are revolutionizing the semiconductor industry.

Driving the Digital Age - Advanced Packaging Rides on the Waves of 5G, AI, IoT Technologies

2

(15)

Innovations in affordable smart devices and accelerated growth in connectivity are driving the demand for advanced packaging technologies. Beyond the mobile market; the advanced packaging industry also serves other market segments in Automotive Infotainment, Artificial Intelligence and Server/Cloud industries. Big data requires greater processing power and higher speeds. As the world migrates to 5G networks and IoT; miniaturization results in increasingly complex semiconductor packaging requirements.

To meet these demands, the semiconductor packaging industry is re-inventing rapidly to develop new solutions. Heraeus Electronics seeks to do the same by innovating new advanced packaging solutions that address new packaging architectures such as System-in-Packaging, package stacking and heterogenous integration. It is our conviction to assist customers to stay as leaders of the technology landscape.

3

(16)

4

We at Heraeus Electronics are

ready for innovative 5G Device Solutions

Server Room

Wearables

Phone

Infotainment Dashboard

(17)

5

Continuing a Strong Bond with Heraeus Advanced Packaging Solutions

Advanced Packaging & SiP

Bonding Wire

Page 7

Welco^® Technology

Page 8

Page 9

Welco^® Smartflux Heraeus has been a leading materials supplier to the semiconductor industry for decades.

Widely known as a technology leader for bonding wires, we have been tackling the next technological challenge in semiconductor packaging and developed best-in-class advanced packaging solutions.

(18)

6

Heraeus Electronics - Taking on the Next Technological Challenge Together

Challenges Faced in the Digital Age

Heterogenous Integration of Devices

With wireless and mixed-signal devices, bio-chips, power devices and others in a single package, new requirements are constantly placed on the electronics industry.

Cost Pressure

The rising costs of raw materials, coupled with a competitive market, create cost-sensitive pressure on manufacturers.

Miniaturization

The continuous trend towards miniaturization of electronic components is demanding new technical requirements for the production processes.

High Performance Computing

With miniaturization, devices are operating in higher current density. Materials must meet such requirements.

Customization and Flexibility

The trend toward customized products is also creating challenges in deadline and meeting quality standards as compared to standard manufacturing operations.

Higher Integration Support

Advanced materials must demonstrate the capability to manage chip-package interactions and integration with other materials during processing and assembly.

(19)

7

From Melting Precious Metals to Micro-Joining Technology

As requirements for applications become more demanding, Heraeus has developed a series of bonding wires of finer structures that can withstand harsher conditions. All our wires can be adapted to suit your specific needs.

Gold Bonding Wire

Available in a full range of diameters to suit your applications, our gold bonding wires span from high-power and discrete components to high pin-count, ultra-fine pitch devices. It can be used for different bonding processes such as ball bonding, stud bumping and wedge bonding.

We have a broad selection for the best workability and highest reliability gold bonding wires, namely AW14, AW66, AW99, HD5, HA6, Radix, Formax, RelMax, FP2, HA3 and LiteGold.

Gold-Coated Silver Wire

The newest addition to our bonding wire family is AgCoat^® Prime. Designed to relieve the stress of rising costs, AgCoat^® Prime is the world’s first bonding wire that offers a real alternative to gold wire for the memory device packaging. It is a silver alloy bonding wire coated with a layer of gold, that characteristics are closely aligned to gold bonding wire. No inert gas is required. Therefore, no additional investment or changes to production equipment and facilities are necessary.

Silver Bonding Wire

Our silver bonding wires have been developed to offer the perfect combination of significant cost reduction compared to gold wires and having the required bonding features for sensitive devices. They achieve excellent reliability and bondability.

Our wide choice of Ag-based alloyed wires includes AgLite^®, AgUltra^®, AgUltra-HR^® and AgUltra-LR^®. It is made of quality materials and can be used as a cost-effective alternative to Au wires.

Copper Bonding Wire

Due to its relatively low-cost materials and excellent thermal and electrical properties, these copper bonding wires are developed as an alternative interconnect material to gold-based solutions.

Our copper bonding wire is the market leader with the best established Maxsoft^® series.

Palladium Coated Copper Bonding Wire

These wires are designed with a layer of palladium and gold ash on the surface of copper to prevent oxidation and improve its second bond workability.

We have PdSoft, PdPro^® and PdFlash^® in the Palladium Coated Copper series.

(20)

8

Heraeus Electronics Proprietary - Welco

^®

Technology

Our proprietary Welco^® Technology produces best-in-class fine powders for Advanced Packaging Applications. With our uniquely formulated Welco^® Fine Pitch solder paste, our technology improves yield by eliminating voids and with excellent consistency in solder volume.

Welco powder has very tight particle size distribution that exceeds IPC specifications, thus allowing smaller pitch to be attained and having the ability to pack more devices into the packaging.

8-2μm >80%

For FCs with line space <50μm For FCs with line

space up till 50μm Up to 008004 &

FCs with Pitch up till 100 μm Up to 01005 &

FCs with Pitch up till 200μm

WLCSP Bumping & Attach

Welco^® AP5112/ Welco^®Smartflux

Package Assembly

Tacky Flux/ Welco^®Smartflux for Ball Attach

Flip Chip Bump & Cu Pillar Attach

Welco^®Smartflux

Substrate Printing

Welco^® AP5112/ Welco^®F590

SiP Component Attach

Welco^® AP5112/ Welco^® F590/

Welco^® AP9131/ SOP92132/ Welco^® AP645

TYPE 8

11-2μm >85%

TYPE 7

15-5μm >90%

TYPE 6

25-15μm >90%

TYPE 5

(21)

9

Welco

^®

AP5112

Welco

^®

Smartflux

Welco^®Smartflux uses Welco^® Technology Powder to create a dipping and pin transfer solder paste for flip chip and BGA applications.

This product has a unique rheology that allows a consistent amount of solder paste to be coated on the flip chips and pins. This improves the wetting of the substrate surface and promotes joint formation, thus significantly increasing overall yield.

Welco^®Smartflux is compatible with Welco^® AP5112.

It is widely used in applications such as mobile communications, consumer electronics and computing and automotive infotainment.

Welco^® AP5112 is a halogen-free water-soluble solder paste specifically formulated for Advanced Packaging and System-in-Package. It has excellent printability, offering superior fine pitch printing performance while producing minimal, easily cleanable residues that maximizes yield.

Benefits

• Low voids with minimal solder beading

• Zero splashing

• Long work life

• All-in-One Printing with Type 7 Welco^®powder

This high-performing paste is RoHS compliant and enables manufacturers to have low voids performance even in multiple reflow processes.

It is designed for use in fine pitch applications such as mobile

communications, consumer electronics and computing and automotive infotainment.

Welco^® AP5112 is available in Type 5 standard as well as in Type 6 and 7 Welco^® powder.

Experience the Welco difference

Benefits

• Yield improvement over traditional flux

• Prevents movement of flip chips/BGAs

• Improve metal coalesce during the reflow process

• Ensure good solderability on pad finishes

• Eliminates pre-washing/clean of Copper OSP substrates

• Halogen-free

• Available in Type 5 & 6 Welco^® powder MAGNIFICATION

x2000

IPC Spec PSD >80%

RECOMMENDATION

(22)

10

We are Heraeus Electronics

Production Sites and Service Labs

Strategic Locations to Support Our Customers Worldwide

We are one of the leading manufacturers of materials for the assembly and packaging of devices in the electronics industry. We develop sophisticated material solutions for the automotive, power electronics, and semiconductor industry. Our core competencies include bonding wires, solder and sinter materials, thick film pastes, and substrates.

Headquartered in Hanau, Germany, Heraeus Electronics has a global footprint with eight production sites across six countries, ensuring a high supply chain reliability.

Additional four service centers located across Asia, USA and Europe enable us to support the needs of local markets, ensuring proximity and quick response time for our regional customers. Our customers benefit from shortened development cycles with higher first-time success rates, leading to faster time to market.

Headquartered in

Hanau, Germany

of experience in providing materials for the electronics industry

More than

50 years

Hanau, Germany Chisoda, Romania West Conshohocken, USA Kulaijaya, Malaysia Changshu, China Zhaoyuan, China Singapore (2x)

Hanau, Germany West Conshohocken, USA Shanghai, China Singapore

Over

1400

employees worldwide

8 production sites

across 6 countries Product distribution to

over 50 countries

PRODUCTION SITES

SERVICE LABS

Zhaoyuan Changshu Shanghai

Kulaijaya Singapore

Chisoda Hanau

West Conshohocken

(23)

11

Providing Material Solutions That Matter

Your Reliable Partner Who is Always There for All Your Needs

With an optimal infrastructure and comprehensive equipment, we shorten product development cycles through our application knowhow and expertise in matching materials, thereby lowering costs and bringing next-generation products faster to market.

Our expertise in material integration, optimization and understanding of material combinations, and the ability to test them under simulated conditions in our lab allow manufacturers to better understand material behaviors and the reliability of their products under simulated conditions. This accelerates the development process with higher first-time success rates.

PROTOTYPE ASSEMBLY

• Documentation

• Traceability

MATERIAL ANALYSIS

• Fatigue Analysis

• Root Cause Analysis PROCESS

OPTIMIZATION

• Parameter Definition

• Yield Optimization

• Reflow Profile Optimization Application

Knowledge

Heraeus Engineering

Services Model

Simulation Competence

PROTOTYPE DESIGN

• Mechanical Design

• Stencil Design

SIMULATION

• Thermal Simulation

• Thermo-Mechanical Stress Simulation

Asssembly Process Development

Optimization Sample Desig

n and P rototy

ping

Analy ses Com

petence

(24)

Heraeus Group

The Global Technology Company

The data given here is valid. We reserve the right to make technical alterations.

Heraeus Electronics

Heraeus Deutschland GmbH & Co. KG Heraeusstraße 12-14

63450 Hanau, Germany www.heraeus-electronics.com Japan

Phone +81 (3) 6902 6585 [email protected]

Americas

Phone +1 610 825 6050 [email protected]

Asia Pacific Phone +65 6571 7677 [email protected]

China

Europe, Middle East and Africa Phone +49 6181 35 3027 [email protected]

The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.

The Heraeus logo, Heraeus, AgCoat^® Prime, AgLite^®, AgUltra^®, AgUltra-HR^®, AgUltra-LR^®, Maxsoft^®, PdPro^®, PdFlash^®, Welco^®, Microbond^® and the figurative marks are trademarks or registered trademarks of Heraeus Holding GmbH or its affiliates.

A globally leading technology group, Heraeus is headquartered in Hanau, Germany. Founded in 1851, it is a family-owned portfolio company which traces its roots back to a pharmacy opened by the family in 1660. Today, Heraeus combines businesses in the environmental, energy, electronics, health, mobility and industrial applications sectors.

In the 2018 financial year, Heraeus generated revenues of €20.3 billion with approximately 15.000 employees (including staff leasing) in 40 countries.

Heraeus is one of the top 10 family-owned companies in Germany and holds a leading position in its global markets.

With technical expertise, a commitment to excellence, a focus on innovation and entrepreneurial leadership, we are constantly striving to improve our performance.

We create high-quality solutions for our clients and strengthen their long-term competitiveness by

combining unique material expertise with leadership in technology.

05.2020 / Layout : HET-Marcom_HET71007ENG-0620-2

(25)

mAgic DA295A

mAgic sinter paste DA295A is a lead-free die attach solution with improved workability and performance to meet challenging demands of semiconductor packaging.

Lead-free and zero halogen formulation Stable rhelogy

Excellent dispensing performance Open time up to 120mins Consistent adhesion on Au surface

Low temperature processing (200ºC and above) Void-free

No cleaning required

Application Information

Material Properties Conductive

Adhesive Solder Paste

(PbSn5Ag2.5) mAgic Sinter Paste

DA295A

Process Temperature (°C) 175 ~ 200 360 - 390 ≥ 200

Ag Content (%) 75 ~ 85 2.5 100 (after sintering)

Electrical Resistivity (mΩ.cm) ≤ 0.1 0.046 ≤ 0.008

Thermal Conductivity (W/m.K) 3 – 10 44 ≥ 100

Residue free Yes No Yes

Pb-free Yes No Yes

Non-Pressure Sinter Paste

mAgic DA295A benefits

DISPENSE DIE

ATTACH

NON- PRESSURE

SINTER

Sintering Profile in Air / N2 250

200

150

100

50

0 50 100 150 200 250

Sintering Time (minutes)

Sintering Temperature (°C)

Material Comparison

Process parameters can be adjusted depending on application specific requirements

(26)

The data given in this brochure are valid. Subject to alterations.08.2017/ Layout: HET-MarCom_ HET23026ENG-1219-1

63450 Hanau, Germany www.heraeus-electronics.com

Americas

China

Physical Properties DA295A

Fillers Silver

Metal content 82 %

Particle size ≤ 25 µm

Sinter temperature ≥ 200 °C

Halogen content Zero Halogen

Compatible surfaces Ag / Au

Sinter atmosphere Air / N₂

Application/Process

Dispensing Yes

Features & Benefits

Work life 12 hrs

Shelf life 4 mths

Residue cleaning Not required

Storage condition 2 – 10°C

Product Properties Dispensing Performance Over Time

Open Time 0 hr 1 hr 2 hr

Voids Performance

High Resolution Magnification No missing or irregular pattern detected.

Consistent (no missing or irregular pattern) dispensing up to 12 hours.

Japan

Phone +81 (3) 6902 6585 [email protected]

(27)

Welco

^®

Smartflux

FLX89161 Dipping Paste

FLX89161 is a water soluble halogen free fine pitch dipping paste designed for Flip Chip and BGA applications. Formulated using state-of-the-art Welco®

powder, the product revolutionized chip and ball attach processes.

FLX89161 Benefits

Improves solder joint formation for better yield Increases bump height

Good wetting performance Halogen free

Easy to clean using DI water

What is Welco^® Smartflux Dipping Paste?

Process Benefits of Welco^®Smartflux

Tacky Flux Process

Welco^®Smartflux Process

Yield improvement (missing ball, shorts, etc) + ++

Eliminates process steps (OSP cleaning, scrap, etc) + ++

Using existing equipment + +

Cost effective + +

Welco^® Smartflux fine powders provide anchors to hold the BGA balls in place during reflow process thus reduces mis-alignment of flip chip that results in yield loss caused by missing balls for BGA attach.

High quality fine powders added in low percentage enables fine pitch application of Smartflux for flip chip attach at

< 100 µm pitch copper pillar. Solder joint of

flip chip is also strengthened with no creeping of Tin- Silver cap onto copper pillar sidewall.

Traditional flip chip attach process only uses flux which results in non-wetting of copper pillars and solder bumps, due to substrate warpage and complexity of package. With the inclusion of fine powders, it is able to bridge and close the small gaps produced and prevent non-wet or open joints hence achieving higher yield.

(28)

Flux Process Welco^®Smartflux Process

The data given in this brochure are valid. Subject to alterations.03.2018/ Layout: HET MarCom_ HET22031-0620-5

CuOSP CuOSP

NiAu NiAu

Americas

China

Europe, Middle East and Africa Phone +49 6181 35 3627 [email protected] Effects of Welco^®Smartflux on Bump Height

100 % Yield

Value Proposition of Welco^®Smartflux

Solder bump height after reflow

Features Flux Welco^®Smartflux

(with 10% metal particle to BGA)

Ball size (µm) 500 500

Pad size (µm) 500 500

On OSP Cu (µm) ~ 350 – 370 ~ 370 – 390

BOn NiAu (µm) ~ 370 – 390 ~ 380 – 400

Pad Finish SS Peak Temp.

(° C) Dwell Time (secs) Pin Dia.

(mm) Tray Depth (mm) Yield Imm Sn

19 235

60 –

75 0.5 0.4 100

300 245 %

20 250

SOPBGA

20 235

60 –

75 0.5 0.4 100

280 245 %

18 250

CuOSP

135 235

60 –

75 0.5 0.4 100

135 245 %

135 250

No missing balls, bridging balls, joined balls, partial wetting or flux residue issue was observed from the external evaluation data.

Imm Sn SOPBGA

CuOSP

Welco^®Smartflux high activity level cleans pad or trace surface, eliminating the need for pre-cleaning process to remove contaminants prior to flip chip attach. This saves costs and reduces passive attach solder paste defects caused by cleaning flux interactions.

Another benefit of Welco^®Smartflux is its compatibility with solder paste Welco^® AP5112 in achieving low defects

and improving solder joints. Typically, advanced packages make use of a single reflow process for passive component or flip chip attach application whereby there is a need for solder pastes used to have a compatible reflow profile.

By using Welco^®Smartflux, there would be no compromise in the reflow profile.

(29)

New Product: Welco

^®

AP5112

Water Soluble Halogen Free Solder Paste

Welco^® AP5112 Halogen Free Water Soluble Printing Solder Paste series is designed for use in fine pitch applications.

WS5112 vs. F541 ₅ Solderability WS5112 vs. F510 Solderability

5

4 4

3 3

2 2

1 1

0 0

Slump behaviour Slump behaviour

Residue

cleanability Residue

cleanability

Void rate Tackiness Void rate Tackiness

Stencil life Stencil life

F510 AP5112 F541

AP5112 Remark: 0 5 (from worst to best)

Benchmarking (WS5112 vs. halogen containing pastes) Halogen free

Good printability on fine pitch pad size Good wetting performance

Good cleaning properties Long stencil life Minimal splashing Minimal residue

Available in Type 4 to 7 powders

Available in low alpha count SAC 305 alloy T5 to T7

008004 Component Attach with WS5112 Type 7 Solder Paste X-ray Images Zero Voids WS5112 Benefits

Product ID: WS5112

(30)

08.2017/ Layout: HET_MarCom_ HET24181-0819-6

Viscosity Changes Over Printing Time

Void Rate Changes Over Printing Time Product Properties Table

System In Package Die attach, components attach Fine Pitch Assembly Flipchip attach

Bumping Wafer bumping, substrate bumping

Water Soluble Solder Paste – Overview

Series WS5112

SIP (Die/Component attach) +++

FC Attach/Wafer/Substrate bumping +++

Application

Print +++

Properties

Flux activity (J-STD-004) H1

Halogen free +++

Solderability +++

Slump behavior +++

Tackiness +++

Stencil life +++

Void rate +++

Residue cleanability +++

Powder compatibility (Type 3 – 4) +++

Powder compatibility (Type 5 – 7) +++

0 20 40 60 80 100 120 140 160 180 200

0h 1h 2h 4h 6h 8h 10h

Applications

The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application. The Heraeus logo, Heraeus, Welco^® and the Welco figurative mark are trademarks or registered trademarks of Heraeus Holding GmbH or its affiliates. All rights reserved.

Americas

China

0 5 10 15

0h 4h 8h 10h

Total Single

Viscosity Over Time

Time (Hrs)

Time (Hrs) Void Rate Over Time

Industry specification

Void Rate (%)Viscosity (Pa.s) The data given here is valid. We reserve the right to make technical alterations.