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Design and Verification Methodology for Complex Three-Dimensional Digital Integrated Circuit

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Figure

Figure 1.1: Interconnect roadmap.
Figure 1.2: Illustration of 3D integration technologies. (a) wire bond; (b) microbump-3D
Figure 1.3: 3D wafer bonding process flowchart.
Figure 1.4: MITLL FDSOI wafer stacking example (source [19]).  (a) Tier are fabricated
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