VIA Embedded evolution
VIA Embedded
Tiziano Albani
EU Business Development
Milan, April 2013
Agenda
•
VIA at a Glance
•
About the “Technology group”
•
VIA embedded & evolution
•
X86 and ARM solutions
VIA at a Glance
Established:
1987, Fremont, California
Business:
Fabless semiconductor
design; embedded board,
system design and
manufacturing
Headquarters:
Taipei, Taiwan since 1992
CEO:
Wen Chi Chen
Employees:
2,000 (70% engineers)
Capital:
USD 16 million
CDMA
ARM
x86
World Leading x86
Technology
Leader in Mobile
Communication
Leading-Edge ARM (SoC)
Technology
Real Alternative IC Solution Provider
The only company with x86, ARM and 3G platform capabilities
Long term vision to leverage these capabilities to create a new breed of innovative
devices for a wide variety of mobile and other distributed computing applications
VIA Embedded Milestones
2001
» Established VIA Platform Solutions Division (2001.10)
2002
» Launched Mini-ITX to market, and set as an industry open standard (2002.01)
2004
» Launched Nano-ITX to market, and set as a industry open standard (2004.03) » EPIA N Nano-ITX won the 2004 Computex Best Choice Award (2004.05)
2007
» Announced Pico-ITX to market, and set as a industry open standard (2007.04) » Celebrated 5th birthday of EPIA Mini-ITX boards
2008
» Small Form Factor SIG adopted Pico-ITXe specification (2008.04) »Launched Pico-ITXe to market (2008.10)
2009
»Unveiled Em-ITX form factor(2009.03)
» Pico-ITXe won the 2009 Computex Best Choice Award (2009.05) » Launched ACE-CNX customization security service (2009.09) » Announced Mobile-ITX form factor (2009.12)
» VB8003 and EITX-3000 won Taiwan Excellence Award (2009.12)
2010
» Mobile-ITX won the 2010 Industrial Innovation Achievement Award (2010.09) » EPIA-M850 & P830 won Taiwan Excellence Award (2010.12)
VIA Embedded Milestones (cont’d)
2011
» EPIA-P830 won Taiwan Excellence Gold Award (2011.04)
» Glade Blade Server won the 2011 Computex Best Choice Award (20011.05)
2012
» Unveiled VIA System-on-module(COM Express, QSeven and ETX series) with application specific customization for modular solutions
» Launched VIA’s first ARM solution (VAB-800) with choice of embedded boards and systems » AMOS-5002 won Taiwan Excellence
VIA’s Small Form Factor Innovation
Mini-ITX
17 cm x 17 cm
Em-ITX
17 cm x 12 cm
Nano-ITX
12 cm x 12 cm
Industry-leading Low Power
Consumption
• Market-leading performance per watt
• Ultra low power consumption
• Low temperature operation
• Super energy efficient
800MHz Eden X2
5 W 4.5 W
13 W
World’s lowest power x86 multi-core processor
Ultra low power unified digital media IGP
chipset
VX900
18.5 W 2.3 W
Ultra low power unified digital media IGP
chipset
VX855
12.84 W 22.8 W
QuadCore
World’s lowest power x86 quad core processor
VIA x86 Platform Highlights
•
Pin-to-Pin compatible processors
•
Great performance per watt
•
Built-in hardware security
encryption engine
•
Proven track record with tier-one
customers
•
Specific chipsets optimized for
multimedia and multiple-display
applications
First Mover in Low Power
x86 Platforms
Enabling Multicore Technology in
Low Power Markets
Continuing the Optimization of
Small Form Factor Designs
First Mover and Standard-creator of
Embedded Small Form Factor Boards
VIA Embedded Evolution
Solution Provider for
Embedded Applications
Embedded Computing
Hardware Provider
Complete x86 Embedded
Platform Provider
Provider for x86 and ARM
Total Embedded Solution
System-On-Module
Solution Provider
Single-Board Computers
VIA Embedded Value Proposition
•
Superior R&D capability
VEPD has over 40% personnel in R&D
•
Unique software capability
VIA has a complete software team that manages from the silicon
driver source code, up to applications/tools/BSPs, etc.
•
One-stop-shop
From components to boards, systems to displays
•
Pin-to-pin-compatible processor strategy
VIA’s x86 platform can scale from fanless single core up to low
power quad core, with the same board
Silicon
Solutions
Board
Solutions
Spearhead
Platforms
Mini-ITX Em-ITX Nano-ITX Pico-ITX Life Automation Transit System Digital Signage Healthcare Home Media POS & Retail In-vehicle Platform Self-ServiceSystem
Solutions
Total Solutions
VIA provides end-to-end x86
silicon and platform solutions
VIA x86 Embedded Boards
EPIA Series
• Platforms embodying VIA’s
latest feature rich
technologies
• Wide selection of Mini-ITX,
Nano-ITX, Pico-ITX boards
VB Series
• Entry-level series for merging
segment markets
Em-ITX Series
• Dual-sided IO coastline form
factor with IO module
COM Express Module
• Computer-on-module with
proprietary multi-I/O
baseboard for a variety of
applications
Qseven Module
• Computer-on-module form
factor for small footprint
designs and specific
applications
ETX Module
• Computer-on-module form
Small Form Factor From
Industrial Standard
COM Express
ETX
11.4 cm x 9.5 cm
Qseven
7 cm x 7 cm
•
Basic Form Factor - 12.5 cm x 12.5 cm
•
Compact Form Factor - 9.5 cm x 9.5 cm
System Solutions for Segments
Vertical Market Embedded System
ART Series
Industrial LCD Monitor
VID
Fanless Panel System
VIPRO
Semi-Embedded System
ARTiGO Series
AMOS-3001
Palm-size design with strong vibration and shock resistant
Compact Fanless Embedded System
AMOS Series
AMOS-3002
VIA’s first dual core system with lockable USB
ARTiGO A1200
Fanless and ultra low profile (only 3 height) ART-3000 Automation ART-5450 Fleet Management/ In vehicle AMOS-5210 Kiosk/Automation AMOS-5002 ARTiGO A1150 Portable Pico-ITX box computer ARTiGO A1250 The smallest QuadCore system NEW AMOS-5001
Low profile, fanless and unique dual-side I/O coastlines
NEW
NEW
NEW
Innovative buckled-blade thermal dispatch fins
Embedded ARM
Solutions
Why Choose VIA for ARM Solutions?
•
VIA has true organic expertise
at any level by providing our
own silicon, boards, modules and systems with extensive
know-how capabilities
•
VIA has strong hardware integration capabilities
including robust roadmap that offers the best power/watt
performance and available longevity
•
VIA has flexible software capabilities
to support a full
range of operating systems and specific optimized driver
services
•
VIA provides excellent customer service
with responsive
and consistent technical supports around the world
ARM Software Support and Service
•
Enhance Android Display Support
– OS image
– User guide
•
Development Kit
– Standard BSP with kernel source
– Tool chain
– Development guide
•
Customization Service
– BSP customization by hardware change
BSP
•
Toolchain
•
Bootloader
•
Kernel
•
Device Drivers
•
Basic Filesystem
•
SDK (e.g.DS or TC)
Development Environment
•
Install Toolchain
•
Select Components
•
Add Built-in Apps
Target Machine
•
Boot Development
•
Run App
• VIA Embedded provide and do
technical support for BSP
• Customers use the BSP to
build, test and ship the system
with their own apps
Manufacturing & Mass
Production
•Worldwide logistic supply •MTBF burn-in tests
•Strict manufacturing control
•Green computing
Planning & Consulting
•Design concept evaluation •Proper design andspecifications proposition •Global procurement
Technical Support &
Post Sales Service
•Responsive technicalsupport from FAE team •Software development
support
•BIOS customization and VBIOS fine-tuning
Hardware & Software
Development
•Mechanical drawing •Board-level and
system-level design
•Rigorous validation testing •Well-structured software
support for middle-ware & application level
development