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(51) Int Cl.: H05K 1/02 ( )

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Note: Within nine months of the publication of the mention of the grant of the European patent in the European Patent Bulletin, any person may give notice to the European Patent Office of opposition to that patent, in accordance with the

1 2

29 767

B1

&  

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EP 1 229 767 B1

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EUROPEAN PATENT SPECIFICATION

(45) Date of publication and mention

of the grant of the patent:

20.01.2010 Bulletin 2010/03

(21) Application number: 02001990.7 (22) Date of filing: 05.02.2002

(51) Int Cl.:

H05K 1/02(2006.01)

(54) Bus bar arrangement with an integrated printed circuit board

Stromschienenanordnung mit einer inegrierten Leiterplatte

Conducteur de barres à bus avec une plaque de circuit imprimé, integré (84) Designated Contracting States:

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

(30) Priority: 05.02.2001 FR 0101743 (43) Date of publication of application:

07.08.2002 Bulletin 2002/32 (73) Proprietor: IDEALEC 25300 Pontarlier (FR) (72) Inventors: • Chevassus-More, Alain 25370 Touillon et Loutelet (FR) • Pernot, Christian 25300 Pontarlier (FR)

(74) Representative: Palix, Stéphane et al

Cabinet Laurent & Charras "Le Contemporain" 50, Chemin de la Bruyère 69574 Dardilly Cédex (FR) (56) References cited: EP-A- 0 929 123 US-A- 3 818 119 US-A- 5 875 101 US-A- 6 083 047

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5 10 15 20 25 30 35 40 45 50 55 Description

[0001] The present invention relates to a bus bar

ar-rangement according to the preamble of claim 1. Such a bus bar arrangement is already known from documents EP 0 929 123 A1 and US 3 818 199. Such arrangements are principally used in the field of strong currents. In this field, currents of some ten ampere can circulate at volt-ages of some hundred volt. Until now, these power cir-cuits have been strictly separated from signal processing circuits, since in the latter case, currents of lesser volt-ages in view of order of magnitude are used, and it was feared that, according to circumstances, disturbing inter-actions between the strong current lines and the signal processing circuits might occur. Thus, since perfectly separated line systems for strong current and for signal processing had to be provided, cabling expenses were high.

[0002] Document EP 0 929 123 A1 describes a device

in which the bus bars are molded integrally within a resin support and can be connected to electric circuits, the resin support being adapted to be fixed to or serve as a support for a printed circuit. This molding represents an operation which is complex and difficult to carry out.

[0003] It is the aim of the present invention to suppress

these drawbacks and to propose a bus bar arrangement integrating the two circuits.

[0004] This aim is achieved by the bus bar

arrange-ment according to claim 1.

[0005] According to a complementary embodiment,

the bus bars have connection tabs on their front and/or longitudinal sides, which tabs are fixed onto the printed circuit board.

[0006] According to another complementary

embodi-ment, the connection tabs are arranged on the edge of the printed circuit board.

[0007] According to another complementary

embodi-ment, a protection is placed between the bus bars and the printed circuit board.

[0008] According to yet another complementary

em-bodiment, the printed circuit board is situated between two bus bars.

[0009] It has become apparent that, when using a

con-figuration of high intensity lines in flat conductive bands stacked one onto the other and comprising an insulation between them, these lines did not have an important dis-turbing influence on the immediately adjacent signal processing lines, but that, on the contrary and according to circumstances, they were even able to serve as a pro-tection against outer perturbation sources. The present invention is based on the idea to arrange printed circuit boards by interposing insulating sheets in immediate contact with bus bars conceived as flat bands, and to assemble them within a laminate.

[0010] This leads to lesser space requirements and to

a general simplification of cabling disposition in machine cabling or in other applications.

[0011] The present invention will be better understood

by means of the description of an embodiment referring to the annexed unique figure.

[0012] This figure shows a perspective view of an

em-bodiment of a bus bar.

[0013] On a printed circuit board (PCB) 1, two bus bars

2, 3 are interposed in layers with intermediate layers of insulating sheets (not shown). On its front side and on a longitudinal side, the printed circuit board 1 presents con-nection contact surfaces 4, 5 for impressing the printed circuit board into corresponding connectors of the edge of the printed circuit board. On their front or longitudinal sides, the bus bars 2, 3 also present connection tabs 6, 7 which are disposed such as to be also fixed to the edge of the printed circuit board. Thus, the connection tabs 6, 7 are situated within the disposition of the contacts 4, 5 of the printed circuit board 1 in such a way as to be brought into contact with the same connectors of the edge of the printed circuit board. Between the bus bars 2, 3 and the printed circuit board 1, a sheet with a protection (not shown) can be provided. The final dispositon of the print-ed circuit board and of the bus bars with intermprint-ediate insulating sheets is obtained by a laminating process. The insulating sheets may be made of polyamide (of the Nomex type), which permits to obtain the best tempera-ture results. Other materials can also be used for the sheets, like for example PET (polyester terephthalate), PVC, PI (polyimide). Appropriate glues are used, de-pending on the chosen material. The bus bars are then composed of copper or copper alloy plates. As far as their thermal dilatation qualities are concerned, the com-ponents are chosen such that they can be implanted at operational temperatures between -40 and +130°C.

[0014] Preferably, the printed circuit board PCB is

placed between two bus bars, thus avoiding the defor-mation of the laminated product, which defordefor-mation might arise due to differential dilatations between the layers.

[0015] The bus bar arrangement thus formed carries

at the same time strong currents and integrated signal processing circuits, so that the expense in cabling is min-imized compared to traditional solutions.

[0016] The present description of an example of

em-bodiment should not be understood in a restrictive man-ner. On the contrary, the invention comprises all variants which are possible within the frame of the claims.

Claims

1. Bus bar arrangement comprising at least two bus

bars (2, 3), and at least one printed circuit board (PCB) (1), characterized in that the printed circuit board (1) is situated on one side or between the bus bars (2, 3), in that the complete arrangement is lam-inated, and in that electrical connections (6, 7) of the bus bars (2, 3) are integrated into the arrange-ment of the connections (4, 5) of the printed circuit board.

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5 10 15 20 25 30 35 40 45 50 55

2. Bus bar arrangement according to claim 1, charac-terized in that the bus bars are stocked and

insu-lated from each other by insulating sheets.

3. Bus bar arrangement according to any one of claims

1 to 2, characterized in that on their front and/or longitudinal sides, the bus bars have connection tabs (6, 7) which are fixed onto the printed circuit board.

4. Bus bar arrangement according to any one of claims

1 to 3, characterized in that the connection tabs (6, 7) of the bus bars (2, 3) are disposed on the edge of the printed circuit board.

5. Bus bar arrangement according to claim 4, charac-terized in that a protection is disposed between the

bus bars (2, 3) and the printed circuit board (1).

6. Bus bar arrangement according to any one of the

preceding claims, characterized in that the printed circuit board (1) is disposed between two bus bars.

7. Bus bar arrangement according to any one of the

preceding claims, characterized in that the bus bars (2, 3) are made of copper or a copper alloy and that the insulation is composed of polyamide sheets.

8. Bus bar arrangement according to any one of the

preceding claims, characterized in that there is no overlapping with the bus bars (2, 3) in the connection areas at the edges of the printed circuit board (1).

Patentansprüche

1. Sammelschienenanordnung, die mindestens zwei

Sammelschienen (2, 3) und mindestens eine druckte Leiterplatte (PCB) (1) aufweist, dadurch

ge-kennzeichnet, dass die gedruckte Leiterplatte (1)

sich auf einer Seite oder zwischen den Sammel-schienen (2, 3) befindet, dass die komplette Anord-nung laminiert ist, und dass elektrische Verbindun-gen (6, 7) der Sammelschienen (2, 3) in die Anord-nung der Verbindungen (4, 5) der gedruckten Leiter-platte integriert sind.

2. Sammelschienenanordnung nach Anspruch 1, da-durch gekennzeichnet, dass die Sammelschienen

durch Isolierfolien gelagert und durch diese von ein-ander isoliert sind.

3. Sammelschienenanordnung nach einem der

An-sprüche 1 bis 2, dadurch gekennzeichnet, dass die Sammelschienen an ihren Front- und/oder Längsseiten Anschlussfahnen (6, 7) haben, die an der gedruckten Leiterplatte befestigt sind.

4. Sammelschienenanordnung nach einem der

An-sprüche 1 bis 3, dadurch gekennzeichnet, dass die Anschlussfahnen (6, 7) der Sammelschienen (2, 3) am Rand der gedruckten Leiterplatte angeordnet sind.

5. Sammelschienenanordnung nach Anspruch 4, da-durch gekennzeichnet, dass ein Schutz zwischen

den Sammelschienen (2, 3) und der gedruckten Lei-terplatte (1) angeordnet ist.

6. Sammelschienenanordnung nach einem der

vorher-gehenden Ansprüche, dadurch gekennzeichnet,

dass die gedruckte Leiterplatte (1) zwischen zwei

Sammelschienen angeordnet ist.

7. Sammelschienenanordnung nach einem der

vorher-gehenden Ansprüche, dadurch gekennzeichnet,

dass die Sammelschienen (2, 3) aus Kupfer oder

einer Kupferlegierung hergestellt sind, und dass die Isolierung aus Polyamidfolien besteht.

8. Sammelschienenanordnung nach einem der

vorher-gehenden Ansprüche, dadurch gekennzeichnet,

dass es keine Überlappung mit den

Sammelschie-nen (2, 3) in den Verbindungsbereichen an den Rän-dern der gedruckten Leiterplatte (1) gibt.

Revendications

1. Agencement de barres omnibus comprenant au

moins deux barres omnibus (2, 3), et au moins une carte de circuit imprimé (PCB) (1), caractérisé en

ce que la carte de circuit imprimé (1) est située sur

un premier côté ou entre les barres omnibus (2, 3),

en ce que l’agencement complet est stratifié, et en ce que des connexions électriques (6, 7) des barres

omnibus (2, 3) sont intégrées à l’agencement des connexions (4, 5) de la carte de circuit imprimé.

2. Agencement de barres omnibus selon la

revendica-tion 1, caractérisé en ce que les barres omnibus sont stockées et isolées les unes des autres par des feuilles isolantes.

3. Agencement de barres omnibus selon la

revendica-tion 1 ou 2, caractérisé en ce que sur leurs côtés avant et/ou longitudinal, les barres omnibus ont des pattes de connexion (6,7) qui sont fixées sur la carte de circuit imprimé.

4. Agencement de barres omnibus selon l’une

quelcon-que des revendications 1 à 3, caractérisé en ce

que les pattes de connexion (6, 7) des barres

om-nibus (2, 3) sont disposées sur le bord de la carte de circuit imprimé.

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revendica-5 10 15 20 25 30 35 40 45 50 55

tion 4, caractérisé en ce qu’une protection est dis-posée entre les barres omnibus (2, 3) et la carte de circuit imprimé (1).

6. Agencement de barres omnibus selon l’une

quelcon-que des revendications précédentes, caractérisé

en ce que la carte de circuit imprimé (1) est disposée

entre deux barres omnibus.

7. Agencement de barres omnibus selon l’une

quelcon-que des revendications précédentes, caractérisé

en ce que les barres omnibus (2, 3) sont réalisées

en cuivre ou en alliage de cuivre, et en ce que l’iso-lant est constitué de feuilles de polyamine.

8. Agencement de barres omnibus selon l’une

quelcon-que des revendications précédentes, caractérisé

en ce qu’il n’y a pas de chevauchement avec les

barres omnibus (2, 3) dans les zones de connexion au niveau des bords de la carte de circuit imprimé (1).

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REFERENCES CITED IN THE DESCRIPTION

This list of references cited by the applicant is for the reader’s convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

Patent documents cited in the description

References

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