A shared information framework across design and manufacturing:
Opportunities, Objectives and Obstacles
A shared information framework across design and manufacturing:
Opportunities, Objectives and Obstacles
Donald R. Cottrell
Silicon Integration Initiative, Inc.
Introduction
• What is DFM
• Design for Money… (Mark Mason, TI) • It includes:
• Lithography aware design, • Yield aware design,
• Power aware design,
• Performance aware design, DFT, . . .
• It requires: knowledge about the effects of
design tradeoffs on mfg. and of mfg. decisions on design
What the Industry is Observing
• Increasing mask costs and design cycles areimpacting ASIC’s and fabless companies
• Ownership of wafer yield is moving from the the
fab manager to product designers
• Design rules are becoming increasingly complex
while less representative of the real-world
• Significant investments made in DFM and DFY
technology (>$100M VC alone), but it’s a challenge to evaluate or get evaluated
Static Design Rules
Static Design Rules
Static Design Rules
Functional Design Functional
Design PhysicalDesign Physical Design Mask Correction Data Prep Mask Correction Data Prep Wafer Correction Verification Wafer Correction Verification Wafer Fab Test Analyze Wafer Fab Test Analyze Mask Mfg. Inspect Repair Mask Mfg. Inspect Repair
Issues in the Current Methodology
Circuit-Driven Geometry-Driven Process-Driven
Design rules are complex
Rules do not characterize process variation
Communication of design intent is incomplete
Access to predictive design and analysis models is lacking across the design flow
Mfg. impacts determined late in design Mfg. impacts hinder reuse Long volume cycle
Original Compliments of: Aprio Technologies
Non-trivial inspect/repair Lack information to determine defect disposition Sequential flow Geometric Data Geometric Data Geometric Data
Full design intent
Full design intent Technology/Process
characteristics and models
Technology/Process characteristics and models
Industry standard data model and access Industry standard data model and access
Industry standard data model and access
Functional Design Functional
Design PhysicalDesign Physical Design Mask Correction Data Prep Mask Correction Data Prep Wafer Correction Verification Wafer Correction Verification Wafer Fab Test Analyze Wafer Fab Test Analyze Mask Mfg. Inspect Repair Mask Mfg. Inspect Repair
The Need
• Access to needed information
• Integrated flows - allowing tools of choice • Concurrent processes to shorten cycles
• Additional knowledge to reduce cycles
Virtual Integration
of the supply chainMfg.-aware Design Tools Mfg
Source: Intel
Some Arguments for Change
• Lithography - design geometry is but a binary
approximation of the manufactured result
• Yield Ramp - now a shared problem
Lithography Issues
• OPC and other RETs used to compensate for
sub-wavelength effects impact processing times, data volume and cycle times
• Lacking manufacturing impact models, RET is
Litho Opportunities
• Design aware RET can reduce correction time
and data volume
• Ex.: timing slack allowances, pre-corrected blocks
identified, feature purposes, . . .
• Design related geometry can improve
manufacturing cycle-time and yield
• Ex.: Full CD specificity, mask fault disposition, feature
purposes, . . .
• Mfg. characterization models provide
correct-by
rather than
correct-after
construction design• A method to access and explore complete
Product Yi el d Technology Node Feature-limited yield Defect-limited yield Defect-driven
Defect-driven vsvs. feature-driven. feature-driven yield yield Source: PDF Solutions Product Yi el d Technology Node Feature-limited yield Defect-limited yield Defect-driven
Defect-driven vsvs. feature-driven. feature-driven yield
yield
Source: PDF Solutions
Yield Issue
• Increasingly, yield is becoming limited more by
design features and parametrics
• Product designer must now share responsibility for yield with fab manager
Number of desi gn rul es 0 100 200 300 400 500 600 700 0.35um 0.25um 180nm 150nm 130nm 90nm
Design Rule Growth
Source: TSMC Spacing rule failure model vs. actual
0 0.2 0.4 0.6 0.8 1 1 41 81 121 161 201 241 281 321 361 Distance (nm) Pr obability
Rule-based Model-based Actual
Source: Ponté Solutions
Current Methodology for Yield
• Binary DFM rules are used to characterize the
analog mfg. process - and, do not reflect variation or probability
• Numerous and complex rules complicate and
Yield Opportunities
• Model-based Mfg. process characterization
provides:
• Continuous statistical-view • Process variation
• Product-driven design with predictable results
• But, the models must:
• Be fab specific
• Be available, accessible and usable
Vendor SW Internal SW University SW Vendor SW Internal SW University SW
The Opportunity
Open Standard APICommon software interface
Data Model
Common definition of information
Reference Database
Production quality database:
compliant and royalty-free
Reference Database API . Data Model OpenAccess Technology
OpenAccess Technology Adoption across the supply-chainAdoption across the supply-chain
(Virtual integration) Design Software Design Software Wafer Fab Software Wafer Fab Software Mask Mfg. Software Mask Mfg. Software
Vendor SW Internal SW University SW Vendor SW Internal SW University SW Open Standard API
Common software interface
Data Model
Common definition of information
Reference Database
Production quality database:
compliant and royalty-free
Reference Database API . Data Model OpenAccess Technology
OpenAccess Technology Adoption across the supply-chainAdoption across the supply-chain
(Virtual integration) Design Software Design Software Wafer Fab Software Wafer Fab Software Mask Mfg. Software Mask Mfg. Software
The Opportunity
DTMC OAC RTL through GDS II GDS II through Device Test API Reference Database DataModel Data FlowScope
OA OA-UDM Design Mask Litho Wafer A P I A P I
The Opportunity
Vendor SW Internal SW University SW Vendor SW Internal SW University SW Open Standard APICommon software interface
Data Model
Common definition of information
Reference Database
Production quality database:
compliant and royalty-free
Reference Database API . Data Model OpenAccess Technology
OpenAccess Technology Adoption across the supply-chainAdoption across the supply-chain
(Virtual integration) Design Software Design Software Wafer Fab Software Wafer Fab Software Mask Mfg. Software Mask Mfg. Software
• Direct access and consistent interpretation of required information
• Incremental operations
• Concurrent vs. Sequential flows • Scalable infrastructure
• Facilitate research through private and secure data extensions
• Improved DFM technology transfer • Secured data, protected models
Industry Speaks
Ra
nk
Smarter EDA applications
More efficient EDA applications
More efficient RET applications
More manufacturing and technology rules to constrain design
More complete characterization of manufacturing
More characterization of the impact of design tradeoffs on manufacturing
Better design methodology
Better integration between design, DFM and manufacturing softwareIndustry Speaks
How do you feel non-competitive industry collaboration can best serve?
Foster communication of issues and requirements between supply-chain players
Coordinate events to increase awareness and knowledge
Develop open standards
Facilitate joint research and analysis between supply-chain players
Repository for test designs and technology libraries useful for DFM R&DDon't know
Obstacles
• Is the industry ready?• Supplier reluctance to expose yield
• Customers view of supplier responsibility
• Open technology proven to reduce startups’
development cost and TTM but:
• Established players have greatest influence on change
• Industry players recognize need to change, but
