Epoflex® Base Materials series of MSC Polymer AG offers flexible base materials from simple sin-gle side flexible boards, flex-rigid applications up to highly complex multilayer boards.
The dielectric is made of a well known polyimide with high dimensional stability. It’s reliability is proven in industrial applications for many years.
For the abundance of possible applications Epoflex® is available with claddings of ED and RA cop-per. Electro deposited copper (ED) provides a highly ductile copper surface. Cladding of rolled an-nealed copper (RA) is suitable for applications where permanent flexibility is needed.
The 15 µm thick layer of epoxy adhesive is designed for flexible PCB applications and optimized for excellent temperature resistance. It combines copper cladding and dielectric to a laminate with excellent solder bath resistance.
Epoflex® products are suitable for reel-to-reel production and halogene free.
Epoflex® base materials and coverlays are compatible to usual etching and cleaning techniques and all flexible lacquers.
Make up
Epoxy adhesive
Polyimide
Availability
Copper Polyimide Copper
Epoflex® SSC 17/25 17 µm 25 µm -- Epoflex® DSC 17/25 17 µm 25 µm 17 µm Epoflex® SSC 17/50 17 µm 50 µm -- Epoflex® DSC 17/50 17 µm 50 µm 17 µm Epoflex® SSC 35/25 35 µm 25 µm -- Epoflex® DSC 35/25 35 µm 25 µm 35 µm Epoflex® SSC 35/50 35 µm 50 µm -- Epoflex® DSC 35/50 35 µm 50 µm 35 µm
In all types copper and polyimide are connected by a 15 µm epoxy adhesive layer.
Coverlay
Epoflex® series offers an adhesive coated coverlay that concert to the properties of the copper cladded laminates. Epoflex® PCL’s epoxide adhesive and polyimide are of the same materials as used for the cladded laminates. Epoflex® PCL coverlays can be laminated by standard processes on printed circuit boards. It protects their functionality reliable for a long time.
Epoflex® PCL is available with polyimide foils of 25 µm or 50 µm and adhesive layers of 25 µm or 50 µm.
Availability of copper clad laminates and coverlays Roll width... 305 mm, 50 mm, and 610 mm Roll length ... 80 m
Core ... 76 mm (Plastics)
Epoflex® SSC 17/25 – 17 µm copper cladding / 25 µm polyimide dielectric
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % 2.2.4 C < 0.20 0.09
Tensile Strength N/mm2 2.4.19 > 165 > 165 Bending Strength % 2.4.19 > 25 > 45 Tear Resistance N 2.4.16 > 5 > 5 Peel Strength as d el iv ered N/mm 2.4.9 > 0.7 > 1.3 after s o l d er b ath N/mm 2.4.9 > 0.525 > 1.25
after thermal tes t N/mm 2.4.9 > 0.7 > 1.3
Flexural Strength Cycles 2.4.3* n.a. > 2000
Solder Bath Resistance
at 2 80 °C s 2.4.13 B > 10 > 180
at 300 °C s 2.4.13 n.s. > 180
at 2 6 0 °C w itho u t p re-tes t d rying† s 2.4.13 n.s. > 10
Temperature Index °C UL 796 n.d. 150
Co rp o rativ e T rack ing I nd ex (CTI) V D I N I E C 6 0112 n.s. 175
Loss Tangent at 1 MHz -- ASTM D 150 < 0.04 < 0.03
Epoflex® DSC 17/25 – 17 µm copper cladding / 25 µm polyimide dielectric/ 17 µm copper cladding
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % 2.2.4 C < 0.20 0.10
Tensile Strength N/mm2 2.4.19 > 165 > 165 Bending Strength % 2.4.19 > 25 > 45 Tear Resistance N 2.4.16 > 5 > 5 Peel Strength as d el iv ered N/mm 2.4.9 > 0.7 > 1.3 after s o l d er b ath N/mm 2.4.9 > 0.525 > 1.25
after thermal tes t N/mm 2.4.9 > 0.7 > 1.3
Flexural Strength Cycles 2.4.3* n.a. > 100
Solder Bath Resistance
at 2 80 °C s 2.4.13 B > 10 > 180
at 300 °C s 2.4.13 n.s. > 180
at 2 6 0 °C w itho u t p re-tes t d rying† s 2.4.13 n.s. > 10
Temperature Index °C UL 796 n.d. 150
Co rp o rativ e T rack ing I nd ex (CTI) V D I N I E C 6 0112 n.s. 175
Loss Tangent at 1 MHz -- ASTM D 150 < 0.04 < 0.03
n.a. = not applicable; n.s. = not specified; n.d. = no data
*
Test machine according IPC TM-650 2.4.3.1, dThorn =2 mm †
Epoflex® SSC 35/25 – 35 µm copper cladding / 25 µm polyimide dielectric
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % 2.2.4 C < 0.20 0.10
Tensile Strength N/mm2 2.4.19 > 165 > 165 Bending Strength % 2.4.19 > 25 > 45 Tear Resistance N 2.4.16 > 5 > 5 Peel Strength as d el iv ered N/mm 2.4.9 > 1.4 > 1.5 after s o l d er b ath N/mm 2.4.9 > 1.225 > 1.25
after thermal tes t N/mm 2.4.9 > 1.4 > 1.5
Flexural Strength Cycles 2.4.3* n.a. > 400
Solder Bath Resistance
at 2 80 °C s 2.4.13 B > 10 > 180
at 300 °C s 2.4.13 n.s. > 180
at 2 6 0 °C w itho u t p re-tes t d rying† s 2.4.13 n.s. > 10
Temperature Index °C UL 796 n.d. 150
Co rp o rativ e T rack ing I nd ex (CTI) V D I N I E C 6 0112 n.s. 175
Loss Tangent at 1 MHz -- ASTM D 150 < 0.04 < 0.03
Epoflex® DSC 35/25 – 35 µm copper cladding / 25 µm polyimide dielectric/ 35 µm copper cladding
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % 2.2.4 C < 0.20 0.04
Tensile Strength N/mm2 2.4.19 > 165 > 165 Bending Strength % 2.4.19 > 25 > 45 Tear Resistance N 2.4.16 > 5 > 5 Peel Strength as d el iv ered N/mm 2.4.9 > 1.4 > 2.1 after s o l d er b ath N/mm 2.4.9 > 1.225 > 1.25
after thermal tes t N/mm 2.4.9 > 1.4 > 2.0
Flexural Strength Cycles 2.4.3* n.a. > 40
Solder Bath Resistance
at 2 80 °C s 2.4.13 B > 10 > 180
at 300 °C s 2.4.13 n.s. > 180
at 2 6 0 °C w itho u t p re-tes t d rying† s 2.4.13 n.s. > 10
Temperature Index °C UL 796 n.d. 150
Co rp o rativ e T rack ing I nd ex (CTI) V D I N I E C 6 0112 n.s. 175
Loss Tangent at 1 MHz -- ASTM D 150 < 0.04 < 0.03
n.a. = not applicable; n.s. = not specified; n.d. = no data
*
Test machine according IPC TM-650 2.4.3.1, dThorn =2 mm †
Epoflex® DSC 35/25 – 35 µm copper cladding / 25 µm polyimide dielectric/ 35 µm copper cladding
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % 2.2.4 C < 0.20 0.04
Tensile Strength N/mm2 2.4.19 > 165 > 165 Bending Strength % 2.4.19 > 25 > 45 Tear Resistance N 2.4.16 > 5 > 5 Peel Strength as d el iv ered N/mm 2.4.9 > 1.4 > 2.1 after s o l d er b ath N/mm 2.4.9 > 1.225 > 1.25
after thermal tes t N/mm 2.4.9 > 1.4 > 2.0
Flexural Strength Cycles 2.4.3* n.a. > 40
Solder Bath Resistance
at 2 80 °C s 2.4.13 B > 10 > 180
at 300 °C s 2.4.13 n.s. > 180
at 2 6 0 °C w itho u t p re-tes t d rying† s 2.4.13 n.s. > 10
Temperature Index °C UL 796 n.d. 150
Co rp o rativ e T rack ing I nd ex (CTI) V D I N I E C 6 0112 n.s. 175
Loss Tangent at 1 MHz -- ASTM D 150 < 0.04 < 0.03
Epoflex® SSC 17/50 – 17 µm copper cladding / 50 µm polyimide dielectric
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % 2.2.4 C < 0.20 0.10
Tensile Strength N/mm2 2.4.19 > 165 > 165 Bending Strength % 2.4.19 > 25 > 45 Tear Resistance N 2.4.16 > 5 > 5 Peel Strength as d el iv ered N/mm 2.4.9 > 0.7 > 1.3 after s o l d er b ath N/mm 2.4.9 > 1.225 > 1.25
after thermal tes t N/mm 2.4.9 > 0.7 > 1.3
Flexural Strength Cycles 2.4.3* n.a. > 2000
Solder Bath Resistance
at 2 80 °C s 2.4.13 B > 10 > 180
at 300 °C s 2.4.13 n.s. > 180
at 2 6 0 °C w itho u t p re-tes t d rying† s 2.4.13 n.s. > 10
Temperature Index °C UL 796 n.d. 150
Co rp o rativ e T rack ing I nd ex (CTI) V D I N I E C 6 0112 n.s. 175
Loss Tangent at 1 MHz -- ASTM D 150 < 0.04 < 0.03
n.a. = not applicable; n.s. = not specified; n.d. = no data
*
Test machine according IPC TM-650 2.4.3.1, dThorn =2 mm †
Epoflex® DSC 17/50 – 17 µm copper cladding / 50 µm polyimide dielectric/ 17 µm copper cladding
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % 2.2.4 C < 0.20 0.10
Tensile Strength N/mm2 2.4.19 > 165 > 165 Bending Strength % 2.4.19 > 25 > 45 Tear Resistance N 2.4.16 > 5 > 5 Peel Strength as d el iv ered N/mm 2.4.9 > 0.7 > 1.3 after s o l d er b ath N/mm 2.4.9 > 1.225 > 1.25
after thermal tes t N/mm 2.4.9 > 0.7 > 1.3
Flexural Strength Cycles 2.4.3* n.a. > 100
Solder Bath Resistance
at 2 80 °C s 2.4.13 B > 10 > 180
at 300 °C s 2.4.13 n.s. > 180
at 2 6 0 °C w itho u t p re-tes t d rying† s 2.4.13 n.s. > 10
Temperature Index °C UL 796 n.d. 150
Co rp o rativ e T rack ing I nd ex (CTI) V D I N I E C 6 0112 n.s. 175
Loss Tangent at 1 MHz -- ASTM D 150 < 0.04 < 0.03
Epoflex® SSC 35/50 – 35 µm copper cladding / 50 µm polyimide dielectric
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % 2.2.4 C < 0.20 0.05
Tensile Strength N/mm2 2.4.19 > 165 > 165 Bending Strength % 2.4.19 > 25 > 45 Tear Resistance N 2.4.16 > 5 > 5 Peel Strength as d el iv ered N/mm 2.4.9 > 1.4 > 2.1 after s o l d er b ath N/mm 2.4.9 > 1.225 > 1.25
after thermal tes t N/mm 2.4.9 > 1.4 > 1.5
Flexural Strength Cycles 2.4.3* n.a. > 400
Solder Bath Resistance
at 2 80 °C s 2.4.13 B > 10 > 180
at 300 °C s 2.4.13 n.s. > 180
at 2 6 0 °C w itho u t p re-tes t d rying† s 2.4.13 n.s. > 10
Temperature Index °C UL 796 n.d. 150
Co rp o rativ e T rack ing I nd ex (CTI) V D I N I E C 6 0112 n.s. 175
Loss Tangent at 1 MHz -- ASTM D 150 < 0.04 < 0.03
n.a. = not applicable; n.s. = not specified; n.d. = no data
*
Test machine according IPC TM-650 2.4.3.1, dThorn =2 mm †
Epoflex® DSC 35/50 – 35 µm copper cladding / 50 µm polyimide dielectric/ 35 µm copper cladding
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % 2.2.4 C < 0.20 0.05
Tensile Strength N/mm2 2.4.19 > 165 > 165 Bending Strength % 2.4.19 > 25 > 45 Tear Resistance N 2.4.16 > 5 > 5 Peel Strength as d el iv ered N/mm 2.4.9 > 1.4 > 2.1 after s o l d er b ath N/mm 2.4.9 > 1.225 > 1.25
after thermal tes t N/mm 2.4.9 > 1.4 > 2.0
Flexural Strength Cycles 2.4.3* n.a. > 3
Solder Bath Resistance
at 2 80 °C s 2.4.13 B > 10 > 180
at 300 °C s 2.4.13 n.s. > 180
at 2 6 0 °C w itho u t p re-tes t d rying† s 2.4.13 n.s. > 10
Temperature Index °C UL 796 n.d. 150
Co rp o rativ e T rack ing I nd ex (CTI) V D I N I E C 6 0112 n.s. 175
Loss Tangent at 1 MHz -- ASTM D 150 < 0.04 < 0.03
Coverlay
Epoflex® PCL 25/25 – 25 µm polyimide dielectric/ 25 µm adhesive
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % Manufacturer norm n.s. 0.06
Tensile Strength % 2.2.4 A < 0.2 0.10 Bending Strength N/mm2 2.4.19 > 165 > 165 Tear Resistance % 2.4.19 > 25 > 45 Peel Strength N 2.4.16 > 5 > 5 as d el iv ered after s o l d er b ath N/mm 2.4.9 > 1.4 > 1.4
after thermal tes t N/mm 2.4.9 > 1.225 > 1.23
Flexural Strength N/mm 2.4.9 > 1.4 > 1.4
Solder Bath Resistance Cycles 2.4.3* n.a. > 3
at 2 80 °C
at 300 °C s 2.4.13 B > 10 > 180
at 2 6 0 °C w itho u t p re-tes t d rying† °C UL 796 n.d. 130
Temperature Index mm 2.3.17.1 < 0.127 < 0.127
Co rp o rativ e T rack ing I nd ex (CTI) -- ASTM D 150 < 0.04 < 0.03 n.a. = not applicable; n.s. = not specified; n.d. = no data
*
Test machine according IPC TM-650 2.4.3.1, dThorn =2 mm †
Coverlay
Epoflex® PCL 25/35 – 25 µm polyimide dielectric / 35 µm adhesive
Unit Test method
IPC TM-650
Specification
IPC-4202/2 Typical Value Dimensional Stability
After etching & 30 min at 150 °C % Manufacturer norm n.s. 0.07
Tensile Strength % 2.2.4 A < 0.2 0.16 Bending Strength N/mm2 2.4.19 > 165 > 165 Tear Resistance % 2.4.19 > 25 > 45 Peel Strength N 2.4.16 > 5 > 5 as d el iv ered after s o l d er b ath N/mm 2.4.9 > 1.4 > 1.4
after thermal tes t N/mm 2.4.9 > 1.225 > 1.23
Flexural Strength N/mm 2.4.9 > 1.4 > 1.4
Solder Bath Resistance Cycles 2.4.3* n.a. > 3
at 2 80 °C
at 300 °C s 2.4.13 B > 10 > 180
at 2 6 0 °C w itho u t p re-tes t d rying†
°C UL 796 n.d. 130
Temperature Index mm 2.3.17.1 < 0.127 < 0.127
Co rp o rativ e T rack ing I nd ex (CTI) -- ASTM D 150 < 0.04 < 0.03 n.a. = not applicable; n.s. = not specified; n.d. = no data
Processing Guide for Coverlays
See the following example for application of Epoflex® PCL in a heated multi-platen press.
Press temperature: 170 °C
Kiss pressure: 3,5 bar (0.35 MPa) for 1 min.
Pressure: 30 bar (3 MPa)
Duration: 30 min.
Cooling: Step 1: Over 100 °C at 30 bar (3 MPa)
Step 2: No pressure after cooling below 100 °C
Press pads: - Individual combination of:
ViaPad® Thermo, ViaPad® DAF and ViaPad® UTF
- Reusable press pad ViaPad® X-Board (silicone free) up to 250 °C - Reusable press pad ViaPad® T-Pad (silicone rubber) up to 220 °C
Recommended press cycle:
