0603 Package Chip LED (0.8 mm Height)
19-21SYGC/S530-E2/TR8
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within ROHS complaint version.
Descriptions
․The 19-21 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
․Indoor signboard use.
Device Selection Guide
Chip Part No.
Material Emitted Color Resin Color 19-21SYGC/S530-E2/TR8 AlGaInP Brilliant Yellow Green Water Clear
19-21SYGC/S530-E2/TR8
Package Outline Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
19-21SYGC/S530-E2/TR8
Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Rating Unit
Reverse Voltage VR 5 V
Forward Current IF 25 mA
Peak Forward Current
(Duty 1/10 @1KHz) IFP 60 mA
Power Dissipation Pd 60 mW
Electrostatic Discharge(HBM) ESD 2000 V
Operating Temperature Topr -40 ~ +85 ℃
Storage Temperature Tstg -40 ~ +90 ℃
Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Electro-Optical Characteristics (Ta=25℃)
Parameter Symbol Min. Typ. Max. Unit Condition
Luminous Intensity Iv 16 21 --- mcd
Viewing Angle 2θ1/2 --- 100 --- deg
Peak Wavelength λp --- 575 --- nm
Dominant Wavelength λd --- 573 --- nm
Spectrum Radiation
Bandwidth △λ --- 20 --- nm
Forward Voltage VF 1.7 2.0 2.4 V
IF=20 mA
Reverse Current IR --- --- 10 μA VR=5V
19-21SYGC/S530-E2/TR8
Typical Electro-Optical Characteristics Curves
19-21SYGC/S530-E2/TR8
Label explanation
CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
RoHS
Pb
CPN :
P N : XXXXXXXXXXXXX
XXXXXXXXXXXXX QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
CAT : XXX HUE : XXX REF : XXX
EVERLIGHT
MADE IN TAIWAN
19-21SYGC/S530-E2/TR8
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
19-21SYGC/S530-E2/TR8
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level：90%
LTPD：10%
No. Items Test Condition Test Hours/Cycles
Sample
Size Ac/Re 1 Reflow Soldering Temp. : 260℃±5℃
Min. 5sec. 6 Min. 22 PCS. 0/1 2 Temperature Cycle
H : +100℃ 15min
∫ 5 min L : -40℃ 15min
300 Cycles 22 PCS. 0/1
3 Thermal Shock
H : +100℃ 5min
∫ 10 sec L : -10℃ 5min
300 Cycles 22 PCS. 0/1
4 High Temperature
Storage Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1 5 Low Temperature
Storage Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1 6 DC Operating Life I
F= 20 mA 1000 Hrs. 22 PCS. 0/1 7 High Temperature /
High Humidity 85℃/ 85%RH 1000 Hrs. 22 PCS. 0/1
19-21SYGC/S530-E2/TR8
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
19-21SYGC/S530-E2/TR8
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com
