198VAC~265VAC/50Hz, 21V/370mA+3.3V/50mA Single-Stage,Single-Chip Solution for Smart LED The Future of Analog IC Technology
DESCRIPTION
The EV4057A-K-00A Evaluation Board is designed to demonstrate the capabilities of MP4057A. The MP4057A is a single stage single chip solution for smart LED application. It can regulate the LED current with PSR control and meanwhile to supply power for MCU/wireless module. It is an ideal solution for smart LED lighting because of simplest design, fewest external components and lowest cost. The EV4057A-K-00A adopts the Flyback topology to drive a 21V LED and supply a 3.3V/50mA smart control module. Its specification lists below.
Determined by the customer specification about the standby power, the EV4057A-K-00A can be configured two kinds of circuits. The default EVB board is designed for less than 30mW standby power, as Fig1 shows. It can also be configured as 15mW standby power as Fig2 shows
ELECTRICAL SPECIFICATION
Parameter Symbol Value Units
Input Voltage VIN 198 to 265 VAC
LED Voltage VOUT 21 V
LED Current ILED 370 mA
Output Power POUT 8 W
Vo Voltage Vo 3.3 V
Vo Current Io 50 mA
FEATURES
Single stage/single chip solution Ultra low standby power
Fast start up 5% deep dimming No flicker Low audible noise
Valley switching mode for good efficiency High Power Factor(typical>0.9)
Good transient response
Cycle by cycle current limit in CV operation Primary side over current protection Output OCP/OVP
Under voltage lockout(UVLO) Thermal shutdown(160°C/100°C) MSOP-10/SOIC-14 packages
APPLICATIONS
LED lighting with Zigbee/Bluetooth control DALI, DMAX, etc. smart lighting
All MPS parts are lead-free, halogen free, and adhere to the RoHS directive. For MPS green status, please visit MPS website under Quality Assurance.
“MPS” and “The Future of Analog IC Technology” are Registered Trademarks of Monolithic Power Systems, Inc.
Warning: Although this board is designed to satisfy safety requirements, the engineering prototype has not been agency approved. Therefore, all testing should be performed using an isolation transformer to provide the AC input to the prototype board.
EV4057A-K-00A EVALUATION BOARD
(L x W x H) 66mm x 25mm x 15mm
Board Number MPS IC Number
EVALUATION BOARD SCHEMATIC
Figure 1—EV4057A-K-00A with 30mW Standby Power
Figure 2—EV4057A-K-00A with 15mW Standby Power
2.2mH/0.25A L2 100nF/400V C2 29k/1% R14 10nF/630V C1 200k/1206R2 S1MLD2 1uF/10V C10 30k/1206 R5 330uF/35VC6 330uF/35V C3 50m/1206 R10 1.2ohm/1206 R6 Lp=2.2mH RM6 2.2nF/4kV CY1 5.1k/1206 R8 BD1 MB6S MBRS320T3D1 7.5k/1% R13 TVR10431 RV1 L N 198VAC-265VAC 2.2mH/0.25AL1 5.1k/1206 R1 LED+ LED-1000V/1A 7.5M/1%/0.25W R3 200V/3A 21V/370mA 2 3 1 Q1ISU04N65A 500m/1206R11 1 2 220uF/35V C8 1R/1206 R12 1 2 150uF/35V C9 1 2 BZT52C16D5 2 1 220nF/25V C7 GND 1N4148WS 1 2 D4 115T 23T 18T 4T 1 2 D6 DIODES/SMA 2 1 22uF C11 100k/1% R15 68nF/400V Cx1 10/1W RF1 D 1 S 2 VCC 3 COMP 4 ZCD 5 GND 6 DIM 7 VO 8 VDD 9 NLP 10 U1 MP4057A GND 10pF/50V C4 FLYBACK FLYBACK CENTER CE N T E R 1D7 2 DIODES/SMA 1 VO TP1 1 GNDTP2 1 DIM TP3 Forward winding Forward winding 1N4148WS 1 2D8 392 R4 500m/1206 R16 10nF/50V C12 2ohm/1206 R17 2 1 center FORWARD B W FLYBACK T? 2.2mH/0.25A L2 100nF/400V C2 29k/1% R14 10nF/630V C1 200k/1206R2 S1MLD2 1uF/10V C10 30k/1206 R5 330uF/35VC6 330uF/35V C3 50m/1206 R10 1.2ohm/1206 R6 Lp=2.2mH RM6 2.2nF/4kV CY1 5.1k/1206 R8 BD1 MB6S MBRS320T3D1 7.5k/1% R13 TVR10431 RV1 L N 198VAC-265VAC 2.2mH/0.25AL1 5.1k/1206 R1 LED+ LED-1000V/1A 7.5M/1%/0.25W R3 200V/3A 21V/370mA 2 3 1 Q1ISU04N65A 3 2 1 M1 DMZ6005 500m/1206R11 1 2 220uF/35V C8 1R/1206 R12 1 2 150uF/35V C9 1 2 BZT52C16D5 2 1 220nF/25V C7 GND 1N4148WS 1 2 D4 2.2k/1% R9 100nF/50V C5 GND 1Meg/1%R7 115T 23T 18T 4T 1 2 D6 DIODES/SMA 2 1 22uF C11 100k/1% R15 68nF/400V Cx1 10/1WRF1 D 1 S 2 VCC 3 COMP 4 ZCD 5 GND 6 DIM 7 VO 8 VDD 9 NLP 10 U1 MP4057A GND 10pF/50V C4 FLYBACK FLYBACK CENTER C E N TER 1D7 2 DIODES/SMA 1 VO TP1 1 GNDTP2 1 DIM TP3 D9 BAV21W Forward winding Forward winding 1N4148WS 1 2D8 392 R4 500m/1206 R16 10nF/50V C12 2ohm/1206 R17 2 1 center FORWARD B W FLYBACK T?
PCB LAYOUT (SINGLE-SIDED)
Bottom layer
CIRCUIT DESCRIPTION
The EV4057A-K-00A is configured as a single-stage Flyback topology and gets a cost effective BOM.
FR1, RV1, BD1, CX1, C2, L1 and L2 compose the input stage. The fusible resistor FR1 fuses the AC input to protect for the component failure or some excessive short event. RV1 is used for surge test. CX1, C2, L1 and L2 form an EMI filter. The diode rectifier BD1 rectifies the input line voltage.
C1, R2 and D2 are used as the RCD snubber network to absorb the voltage spike of the main mosfet Q1.
R3, C7 and D5 are used to startup and bias the gate of the Q1. R12, D7 and C9 are used to supply the power of VCC. R11, D8 and C6 are used to supply the power of VDD.
R14, R13 and C4 are used to sense the Zero current point to achieve valley switching and also used for OVP and brown out detection.
R6, R10 and R16 are sensing resistors for LED current control.
C12 and R17 are placed for absorbing the voltage ringing of the forward winding to achieve better EMI.
R15 is used to set the CV mode as the default operation.
C10 is the compensation network of the control loop.
C11 can filer the noise and ripple of Vo. Without C11, the chip may not work.
Diode D1 is the rectifier diode. The capacitor C3 and C6 are the output filter. The resistor R5 is placed as a dummy load to consume the output power in open load condition.
M1 and R7 are used to achieve 15mW standby power. D9, C5 and R9 are placed for bias the gate of Q1 due to R3 is cut off from AC bus line.
EV4057A-K-00A BILL OF MATERIALS
Qty Ref Value Description Package Manufacturer Part Number
1 BD1 MB6S Rectifier Bridge,
600V, 0.5A SOIC-4 Taiwan Semi MB6S
1 C1 10nF/630V Ceramic Cap, 630V,X7R 1206 Murata GRM31BR72J103KW01L
1 CX1 68nF/400V CBB, 400V DIP FARA C222G683K30C000
1 C2 100nF/400V CBB, 400V DIP Panasonic ECQE4104KF
2 C3,
C6 330μF/35V
Electrolytic Capacitor,
35V DIP Jianghai CD263-35V330
1 C4 10pF/50V Ceramic Cap, 50V,COG 0603 Murata GRM1885C1H100JA01
1 C7 220nF/50V Ceramic Cap,50V,X7R 0603 TDK C1608X7R1H224K
1 C8 220μF/25V Electrolytic Capacitor,
25V DIP Ymin LKM_25V_220u_6.3*11
1 C9 150μF/35V Electrolytic Capacitor,
35V DIP Ymin LKM_35V_150u_6.3*11
1 C10 1μF/10V Ceramic Cap,10V,X7R 0603 Murata GRM188R71A105KA61D
1 C11 22μF/6.3V Ceramic Cap,
6.3V,X7R 1206 Murata GRM31CR70G226KE19L
1 C12 10nF/50V Ceramic Cap,50V,X7R 0603 Murata GRM188R71H103JA01D
1 CY1 2.2nF Y Capacitor,4000V DIP Hongke JNK12E222MY02N
1 D1 MBRS3200T3G Schottky Diode, 200V, 3A SMB ON Semi MBRS3200T3G
1 D2 WSGC10MH Diode, 1A, 1kV 1206 Zowie WSGC10MH
1 D4 1N4148W Diode, 0.15A, 75V SOD-123 Diodes 1N4148W
1 D8 1N4148W Diode, 0.15A, 75V SOD-123 Diodes 1N4148W
1 D5 BZT52C18 Zener Diode, 18V,
500mW
SOD-123 Diodes BZT52C18
1 D6 ES1B Diode, 1A, 100V SMA Vishay ES1B-E3/61T
1 D7 ES1D 200V, 1A SMA Taiwan Semi ES1D
2 L1, L2 2.2mH DM inductor DIP TDK TSL1112RA-222JR33
1 Q1 SVF2N60 N-Channel Mosfet; 600V; To-251 SILAN SVF2N60
2 R1,
R8 5.1kΩ
Thick Film Chip RES,
5% 1206 Yageo
1 R2 200kΩ Thick Film Chip RES, 5% 1206 Yageo
1 R3 7.5M Metal Film RES, 1/4W, 1% DIP Any
1 R4 392ohm Thick Film Chip RES,
EV4057A-K-00A BILL OF MATERIALS
(continued)Qty Ref Value Description Package Manufacturer Part Number
1 R5 30kΩ Film RES, 1% 1206 Yageo
1 R6 1.2Ω Thick Film Chip RES, 1% 1206 Yageo
1 R10 50mΩ Thick Film Chip RES, 1% 1206 Yageo
1 R11 500mΩ Thick Film Chip RES, 1% 1206 Yageo
1 R12 1Ω Thick Film Chip RES, 1% 1206 Yageo
1 R13 7.5k/1% Thick Film Chip RES, 1% 0603 Yageo
1 R14 29.4k/1% Thick Film Chip RES, 1% 0603 Yageo
1 R15 100k/1% Thick Film Chip RES, 1% 0603 Yageo
1 R16 500m/1206 Thick Film Chip RES, 1% 1206 Yageo
1 R17 2.2ohm/1206 Thick Film Chip RES, 1% 1206 Yageo
1 R18 0Ω Thick Film Chip RES, 1% 0603 Yageo
1 RF1 10/0.5W Fuse resistor DIP
1 RV1 430V/2500A MOV DIP TKS TVR10431KSY
1 T1 2.2mH RM6/2.2mH/115:23:18:4 DIP EMEI FX0474
1 U1 MP4057AGS
Smart LED lighiting controller
with MCU power supply
TRANSFORMER SPECIFICATION
Electrical Diagram6
2
3
W
1B
11
58Ts
Φ0.15mm
57Ts
Φ0.15mm
18Ts 2*Φ0.2mm23Ts
Φ0.3mm
T.I.W
3
E
2: 0.025mm×6mm
N
4Pri.
N
1Pri.
N
2N
3Sec.
RM6
Winding Start
5
4
4Ts 3*Φ0.2mmN
5Figure 3—Transformer Electrical Diagram
Winding Diagram
Figure 4—Winding Diagram
N3 N5 N1 Top. Side 1Ts 1Ts 1Ts Pin. Side 1Ts N2 Bobbin N4
Winding Order
Tape Layer Number
Winding
No. Start & End Magnet Wireφ Turns Remark Teflon Tube
1 N1 2—〉1 0.15*1(AWG) 58
1 N2 5—〉3 0.2*2(AWG) 18
well-distributed in one layer
Matching with wire 1 N5 3—〉4 0.2*3(AWG) 4 Matching with wire
1 N3 W—〉B 0.3*1 (AWG T.I.W) 23
2 N4 1—〉6 0.15*1(AWG) 57
Electrical Specifications
Electrical Strength 60 second, 60Hz, from Winding to CORE. 3000VAC
Primary Inductance Pins 2- 6, all other windings open, measured at 60kHz, 0.1 VRMS 2.2mH±8
EVB TEST RESULTS
Performance Data
Efficiency, PF and THD
f (Hz) Vin(V) Pin(W) VLED(V) ILED (mA) Po(W) Efficiency (%) PF THD(%)
50
198 8.8 20.68 367 7.59 86.25 0.953 15.4
230 8.85 20.64 368 7.6 85.83 0.928 16.8
265 8.95 20.64 371 7.66 85.56 0.897 17.6
Dimming Performance(Test@230Vac, 7LED output)
ILED(mA) 200Hz 1kHz 5kHz 0 0 0 0 1% 19 20 20 2% 22 22 23 3% 26 26 26 4% 30 30 31 5% 34 34 34 6% 37 37 38 7% 40 40 41 8% 44 44 44 9% 48 48 48 10% 51 51 51 20% 86 86 86 30% 122 122 122 40% 157 157 157 50% 192 192 193 60% 228 227 228 70% 263 263 263 80% 298 298 298 90% 333 333 333 100% 369 369 368
EVB TEST RESULTS
Performance waveforms are tested on the evaluation board.
VIN=230VAC/50Hz, 7LEDs in series, ILED=370mA, VLED=21V, Lp=2.2mH.
Line Regulation
VIN=(198-265)Vac/50Hz, Full Load Load Regulation VIN=(198-265)Vac/50Hz, Full Load
Efficiency
VIN=(198-265)Vac/50Hz, Full Load PF VIN=(198-265)Vac/50Hz, Full Load
THD
VIN=(198-265)Vac/50Hz, Full Load Dimming Curve VIN=230Vac, 7 LED Output
-0.60 -0.40 -0.20 0.00 0.20 0.40 0.60 190 210 230 250 270 LIN E R E GU LA TION (% ) Vin(V) 360 365 370 375 380 385 390 15 16 17 18 19 20 21 L E D CU RRE NT (m A ) VLED(V) 198V 230V 265V 84.00 84.50 85.00 85.50 86.00 86.50 87.00 87.50 88.00 190 210 230 250 270 E F F ICI E N CY (% ) VIN(V) 0.8 0.82 0.84 0.86 0.88 0.9 0.92 0.94 0.96 0.98 1 190 210 230 250 270 PF VIN(V) 11 12 13 14 15 16 17 18 19 20 TH D (% ) 40 80 120 160 200 240 280 320 360 400 L E D C URR E N T (mA )
EVB TEST RESULTS
(continued)Performance waveforms are tested on the evaluation board.
VIN=230VAC/50Hz, 7 LEDs in series, ILED=370mA, VLED=21V, Lp=2.2mH.
Conduct EMI-L Line
VIN=230Vac, 7 LED Output Conduct EMI-N Line VIN=230Vac, 7 LED Output
CDN
VIN=230Vac, 7 LED Output
9 kHz 30 MHz 1 PK CLRWR 2 AV CLRWR SG 6D dBµV dBµV TD 100 kHz 1 MHz 10 MHz 0 10 20 30 40 50 60 70 80 90 100 110 120 EN55015Q EN55015A 9 kHz 30 MHz 1 PK CLRWR 2 AV CLRWR SGL 6DB dBµV dBµV TDS 100 kHz 1 MHz 10 MHz 0 10 20 30 40 50 60 70 80 90 100 110 120 EN55015Q EN55015A
EVB TEST RESULTS
(continued)Performance waveforms are tested on the evaluation board.
VIN=230VAC/50Hz, 7 LEDs in series, ILED=370mA, VLED=21V, Lp=2.2mH.
Steady State
VIN=230Vac, 7 LED Output Steady State VIN=230Vac, 7 LED Output
CH1: VS 500mV/div. CH2: VZCD 2V/div. CH3: VCOMP 1V/div. CH3: ILED 200mA/div. CH1: VS 500mV/div. CH2: VZCD 2V/div. CH3: VCOMP 1V/div. CH3: ILED 200mA/div. 4ms/div. 10μs/div. Steady State
VIN=230Vac, 7 LED Output Start-Up VIN=230Vac, 7 LED Output
CH1: VS 500mV/div. CH2: VZCD 2V/div. CH3: VCOMP 1V/div. CH3: ILED 200mA/div. CH1: VDD 5V/div. CH2: VZCD 2V/div. CH3: VCOMP 2V/div. CH3: ILED 200mA/div. 10μs/div. 40ms/div. Shutdown
VIN=230Vac, 7 LED Output CV-CC VIN=230Vac, 7 LED Output, Full Load
CH1: VDD 5V/div. CH2: VZCD 2V/div. CH3: VCOMP 2V/div. CH3: ILED 200mA/div. CH2: VOUT 1V/div. CH1: VDD 5V/div. CH4: VCC 5V/div. CH3: ILED
EVB TEST RESULTS
(continued)Performance waveforms are tested on the evaluation board.
VIN=230VAC/50Hz, 7 LEDs in series, ILED=370mA, VLED=21V, Lp=2.2mH.
CC-CV
VIN=230Vac, 7 LED Output, Full Load CV-CC VIN=230Vac, 7 LED Output, DIM=1%
CH2: VOUT 1V/div. CH1: VDD 5V/div. CH4: VCC 5V/div. CH3: ILED 100mA/div. CH2: VOUT 1V/div. CH1: VDD 5V/div. CH4: VCC 5V/div. CH3: ILED 10mA/div. 40ms/div. 100ms/div. CC-CV
VIN=230Vac, 7 LED Output, DIM=1% OVP VIN=230Vac, 7 LED Output
CH2: VOUT 1V/div. CH1: VDD 5V/div. CH4: VCC 5V/div. CH3: ILED 10mA/div. CH2: VZCD 2V/div. CH1: VDD 5V/div. CH4: ILED 200mA/div. CH3: VCOMP 2V/div. 100ms/div. 1s/div. SCP
VIN=230Vac, 7 LED Output
CH2: VZCD 2V/div. CH1: VDD 5V/div. CH4: ILED 200mA/div. CH3: VCOMP 2V/div. 400ms/div.
QUICK START GUIDE
1. Preset AC Power Supply to 198VAC VIN265VAC.
2. Turn Power Supply off.
3. Connect the LED string between “LED+” (anode of LED string) and “LED-”(cathode of LED string). 4. Connect the Zigbee/Bluetooth module to “Vo”, “DIM” and “GND”.
5. Connect Power Supply terminals to AC VIN terminals (“L” and “N”) as shown on the board.