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An Optimized Thermal Analysis of Electronic Unit Used in Aircraft

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Figure

Table 1  Parameters of PCB
Table 4  Heat dissipation (Q) of electronic  components at various nodes
Table 5   Values of conductance for the different cases of effective thermal conductivities  Conductance of
Fig.  2  presents  that  even  a  thin  layer  of  copper  cladding  (in microns)  can  largely  improve  the heat
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