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Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing

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Figure

Fig. 1Shape and dimensions of solder joints.
Fig. 4Acoustic images IN and subtracted images �IN at different cycles N for specimen broken at 58,000 cycles
Fig. 5Change in bonded area AN estimated from acoustic image withnumber of fatigue cycles N.
Fig. 10Model of crack propagation in bonded region under repeated shearstress.
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