ATP Electronics Inc.
資深產品經理 Jes Wang
Education & Experiences:
伊利諾理工學院 CIS Master Degree
台灣微軟產品經理
研華科技產品經理
快閃記憶體的產業應用與製程
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 2
ATP Electronics Inc.
ATP Electronics Inc.
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 4
ISO Certified Company
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 6
Contents
A.
A.
Memory Type
Memory Type
B.
B.
DRAM
DRAM
C.
C.
Flash Memory
Flash Memory
D.
D.
Manufacture Process
Manufacture Process
E.
Memory
¾
什麼是DRAM ?
¾
什麼是SRAM ?
¾
什麼是NVRAM ?
¾
什麼是SDRAM ?
¾
什麼是DDR SDRAM ?
¾
什麼是DDR2 SDRAM ?
¾
什麼是DDR3SDRAM ?
¾
什麼是RD RAM ?
¾
什麼是MRAM ?
¾
什麼是SIMM ?
¾
什麼是DIMM ?
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 8
Motherboard (MB)
z
North Bridge
Function:
The connection
between CPU、
Memory and VGA
card
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 10
Motherboard (MB)
z
South Bridge
Function:
The connection
between CPU and
others Peripheral
How BIOS works?
BIOS use flash memory, a type of ROM
Booting the Computer
Configuring BIOS
The basic input-output system (BIOS) is the first thing
you see when you turn on your computer
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 12
Motherboard (MB)
Memory (RAM)
Type:
¾
ROM
(Read Only Memory)
Ex: BIOS Read Only Memory
¾
RAM
(Random Access Memory)
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Memory (RAM)
z
長條狀物體
z
必須在供電的狀況下才能保存
資料
z
一般電腦的記憶體容量大約是
256MB到4GB左右
Memory (RAM)
1.散熱片
2.記憶體顆粒
3.SPD:Serial Presence Detect
4.防呆凹槽
5.金手指
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 16
Memory (RAM)
記憶體的常用規格
1)
SDRAM
2)
DDR
3)
DDR II
Memory (RAM)
1) SDRAM
¾ 這類記憶體規格有
PC100、PC133、
PC150
¾ 大都為168pin DIMM
記憶體模組
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 18
Memory (RAM)
2) DDR
(Double Data Rate)
¾ 規格有DDR266、
DDR333、DDR400
¾ 大都為184pin DIMM
記憶體模組
Memory (RAM)
3) DDR II
¾ 採240pin DIMM記憶
體模組
¾ 晶片顆粒更小、耗電量
更低、單位容量更大
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 20
顯示卡(Graphic Card,VGA )
輔助GPU的顯示
憶體(這張顯示卡
有8個)
核心晶片GPU(拆開
散熱器後)
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顯示卡(Graphic Card,VGA )
Flash Memory ?
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 24
History
Flash memory (both NOR and NAND types) was invented by Dr. Fujio
Masuoka while working for Toshiba in 1984. According to Toshiba, the
name "flash" was suggested by Dr. Masuoka's colleague, Mr. Shoji
Ariizumi, because the erasure process of the memory contents reminded
him of a flash of a camera. Dr. Masuoka presented the invention at the
IEEE 1984 International Electron Devices Meeting (IEDM) held in San
Francisco, California. Intel saw the massive potential of the invention and
introduced the first commercial NOR type flash chip in 1988.
Flash Memory
Nor Flash Architecture (in physical)
Nand Flash Architecture (in
physical)
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 26
Standard Flash Architecture for Nor &
Standard Flash Architecture for Nor &
Nand
Nand
flash (in physical)
flash (in physical)
Nor Flash Architecture
(in physical).
.
Nand Flash Architecture (in physical).
*
This difference( cell connection)
will make NOR allows
random-access for reading. NAND allows
only block access . And the Nand
flash ’s capacity will be always
larger than nor flash can offer.
Flash Memory
串列存取
較慢
較快
較高
較小
約100萬次
隨機存取
較快
較慢
較低
較大
約10萬次
存取方式
讀取速度
寫入速度
單位面積密度
移除區塊
讀寫壽命
資料 (Data)
程式碼 (Code)
儲存格式
Toshiba/
Samsung
Intel/ AMD
主要廠牌
NAND
NOR
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 28
Why Flash Memory?
¾
Diversified Application Domains
¾
Portable Storage Devices
¾
Critical Systems Components
¾
Consumer Electronics
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 30
Manufacture Process 封裝製程
z
SIP (System In Package) A hybrid technology that mounting
an unpackaged silicon die directly onto the substrate by flying
gold wires. It contains a few bare chips, for example Nand
flash and controller dies per package to construct one system,
and the dies can be arranged either side-by-side or stacked
on top of each other. It is a die level processing. And provide
system a complete packaging solution.
z
SMT( Surface Mount Technology) The process of
assembling printed circuit boards with packaged components
soldered to the surface rather than to plated through-holes.
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SIP
工業等級封裝製程
z
Complete encapsulation and protection of the flash
components and contacts.
z
Complete to isolated all components with real 100% of water
proof, ESD proof, Shock proof and Dust proof
z
Reliable & Stabile in higher densities of major form factor
memory cards such as CF, SD, microSD and miniSD.
z
More consistent yield (more exact and physically consistent
SIP & SMT
Example: ATP SIP comparing with
other SMT manufacture process
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 34
NAND flash is intrinsic to be certainly increase bad
block during System Operation
¾
ATP SIP can do much better protection than SMT
¾
ATP industrial grade using top grade level industrial components
with wear leveling algorithms technology to extend memory
lifetime
Maximal of each flash Memory Card bad block is
2%
only
(“Initial bad block” + “Runtime bad block”)
Life Cycle : SIP > SMT
Industrial Level of SW & HW Protection
SIP Technology
Software
Software
Protection (
Protection (
Controller)
Controller)
Hardware
Hardware
Protection
Protection
( SIP)
( SIP)
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 36
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 38
Standard Form Factor
¾
¾
microSD
microSD
¾
¾
miniSD
miniSD
¾
¾
SD
SD
¾
¾
SDHC
SDHC
¾
¾
Compact Flash
Compact Flash
¾
¾
MMC
MMC
¾
¾
RS
RS
-
-
MMC
MMC
¾
¾
MMCplus
MMCplus
¾
¾
MMCmobile
MMCmobile
¾
¾
MMCmicro
MMCmicro
Mobile Storage Solution
7
10
13
8
11
Pin no.
10 yrs/
100,000 cycles
10 yrs/
100,000 cycles
10 yrs/
100,000 cycles
10 yrs/
100,000 cycles
10 yrs/
100,000 cycles
Data Retention/
Endurance
Free
128MB-512MB
12MB/s
Dual Vol.
1.8V & 3.3V
MMC v4.1
14x12x1.1
MMCmicro
MMC v3.31
MMC v4.1
SD v1.1
SD v1.1
Compliant
128MB-1GB
128MB-1GB
128MB-256MB
128MB-2GB
Capacity
Ranging
Free
Free
Yes*
Yes*
Royalty Fee
2.5MB/s
20MB/s(R)
15MB/s(W)
12MB/s(R)
22.5MB/s(R)
15MB/s(W)
Data Transfer
Rate
3.3V
Dual Vol.
1.8V & 3.3V
3.3V
3.3V
Operation
Voltage
18x24x1.4
18x24x1.4
11x15x1.0
21.5x2.0x1.4
Size (mm)
Picture
RS-MMC
MMCmobile
microSD
miniSD
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 40
z
Memory Stick PRO
Memory Stick PRO
MagicGate copyright protection technology is supported.
Memory Stick PRO Duo
Has 1/3 reduced size of a Memory Stick PRO
Memory Stick (MagicGate/High-speed data transfer compatible)
Memory Stick
MagicGate Memory Stick
Supports a copyright protection function to expand its applications for audio.
Memory Stick (with Memory Select Function)
The switch on the reverse provides options to select a memory.
Memory Stick-ROM
Archive media in which contents can be pre-recorded. Most suitable for distributing contents.
Memory Stick I/O Expansion
Can expand functions beyond what Memory Stick already has by using a Memory Stick slot as a standard interface.
z
Memory Stick Micro (M2)
Ultra-small IC recording media for mobile phones
z
Memory Stick PRO-HG
December 2006
IC recording media with high-speed writing and data transfer capability (8-bit Parallel Data Transfer)
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 42
Memory Card Applications
Audio
Audio
Picture
Picture
Video
Video
Document
Document
File System Layer
File System Layer
Physical Layer
Physical Layer
Security Layer
Application
Layer
Music
Still Image
Moving picture
Print/fax
Audio Data for music
distribution and CD ripping
Audio Recording
Receiving ringtones for
mobile phone
e-KARAOKE
MIDI/Voice data storage
Still pictures for DSC (in.
Motion JPEG data)
Standby image for mobile
phone
E-distributed photo data
Store Video data for
video camera (MP2/MP4)
E-distributed video data
Exchange, view, display
for printable data
Store, View, print for
e-publish document data
Exchange, archive for
personal data
The Application of Mobile Memory Card
Cell phone / Smart phone
DSC
PDA
DVC
Home entertainment center
Memory card
Adapter
PC/ Laptop
Printer/fax
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How to catch the new trend
and opportunity?
我準備好了嗎
我準備好了嗎
?
?
9
了解自己 (資工學生or 將來IT產業的一員)
9
練功(培養自己的基礎能力包含語文能力)
9
了解產業與市場動態 (找方向與找出路)
9
創造自己的核心價值 (不可取代性的能力)
9
培養自己不斷進步與學習能力(職能訓練)
9
產業技術發展 & 標準 Standard (CPU, JEDEC,SDA,
Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 56