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ATP Electronics Inc.

資深產品經理 Jes Wang

Education & Experiences:

伊利諾理工學院 CIS Master Degree

台灣微軟產品經理

研華科技產品經理

快閃記憶體的產業應用與製程

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 2

ATP Electronics Inc.

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ATP Electronics Inc.

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 4

ISO Certified Company

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 6

Contents

A.

A.

Memory Type

Memory Type

B.

B.

DRAM

DRAM

C.

C.

Flash Memory

Flash Memory

D.

D.

Manufacture Process

Manufacture Process

E.

(7)

Memory

¾

什麼是DRAM ?

¾

什麼是SRAM ?

¾

什麼是NVRAM ?

¾

什麼是SDRAM ?

¾

什麼是DDR SDRAM ?

¾

什麼是DDR2 SDRAM ?

¾

什麼是DDR3SDRAM ?

¾

什麼是RD RAM ?

¾

什麼是MRAM ?

¾

什麼是SIMM ?

¾

什麼是DIMM ?

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 8

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Motherboard (MB)

z

North Bridge

Function:

The connection

between CPU、

Memory and VGA

card

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 10

Motherboard (MB)

z

South Bridge

Function:

The connection

between CPU and

others Peripheral

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How BIOS works?

BIOS use flash memory, a type of ROM

Booting the Computer

Configuring BIOS

The basic input-output system (BIOS) is the first thing

you see when you turn on your computer

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 12

Motherboard (MB)

(13)

Memory (RAM)

Type:

¾

ROM

(Read Only Memory)

Ex: BIOS Read Only Memory

¾

RAM

(Random Access Memory)

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 14

Memory (RAM)

z

長條狀物體

z

必須在供電的狀況下才能保存

資料

z

一般電腦的記憶體容量大約是

256MB到4GB左右

(15)

Memory (RAM)

1.散熱片

2.記憶體顆粒

3.SPD:Serial Presence Detect

4.防呆凹槽

5.金手指

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 16

Memory (RAM)

記憶體的常用規格

1)

SDRAM

2)

DDR

3)

DDR II

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Memory (RAM)

1) SDRAM

¾ 這類記憶體規格有

PC100、PC133、

PC150

¾ 大都為168pin DIMM

記憶體模組

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 18

Memory (RAM)

2) DDR

(Double Data Rate)

¾ 規格有DDR266、

DDR333、DDR400

¾ 大都為184pin DIMM

記憶體模組

(19)

Memory (RAM)

3) DDR II

¾ 採240pin DIMM記憶

體模組

¾ 晶片顆粒更小、耗電量

更低、單位容量更大

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 20

顯示卡(Graphic Card,VGA )

輔助GPU的顯示

憶體(這張顯示卡

有8個)

核心晶片GPU(拆開

散熱器後)

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 22

顯示卡(Graphic Card,VGA )

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Flash Memory ?

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 24

History

Flash memory (both NOR and NAND types) was invented by Dr. Fujio

Masuoka while working for Toshiba in 1984. According to Toshiba, the

name "flash" was suggested by Dr. Masuoka's colleague, Mr. Shoji

Ariizumi, because the erasure process of the memory contents reminded

him of a flash of a camera. Dr. Masuoka presented the invention at the

IEEE 1984 International Electron Devices Meeting (IEDM) held in San

Francisco, California. Intel saw the massive potential of the invention and

introduced the first commercial NOR type flash chip in 1988.

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Flash Memory

Nor Flash Architecture (in physical)

Nand Flash Architecture (in

physical)

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 26

Standard Flash Architecture for Nor &

Standard Flash Architecture for Nor &

Nand

Nand

flash (in physical)

flash (in physical)

Nor Flash Architecture

(in physical).

.

Nand Flash Architecture (in physical).

*

This difference( cell connection)

will make NOR allows

random-access for reading. NAND allows

only block access . And the Nand

flash ’s capacity will be always

larger than nor flash can offer.

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Flash Memory

串列存取

較慢

較快

較高

較小

約100萬次

隨機存取

較快

較慢

較低

較大

約10萬次

存取方式

讀取速度

寫入速度

單位面積密度

移除區塊

讀寫壽命

資料 (Data)

程式碼 (Code)

儲存格式

Toshiba/

Samsung

Intel/ AMD

主要廠牌

NAND

NOR

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 28

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Why Flash Memory?

¾

Diversified Application Domains

¾

Portable Storage Devices

¾

Critical Systems Components

¾

Consumer Electronics

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 30

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Manufacture Process 封裝製程

z

SIP (System In Package) A hybrid technology that mounting

an unpackaged silicon die directly onto the substrate by flying

gold wires. It contains a few bare chips, for example Nand

flash and controller dies per package to construct one system,

and the dies can be arranged either side-by-side or stacked

on top of each other. It is a die level processing. And provide

system a complete packaging solution.

z

SMT( Surface Mount Technology) The process of

assembling printed circuit boards with packaged components

soldered to the surface rather than to plated through-holes.

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 32

SIP

工業等級封裝製程

z

Complete encapsulation and protection of the flash

components and contacts.

z

Complete to isolated all components with real 100% of water

proof, ESD proof, Shock proof and Dust proof

z

Reliable & Stabile in higher densities of major form factor

memory cards such as CF, SD, microSD and miniSD.

z

More consistent yield (more exact and physically consistent

(33)

SIP & SMT

Example: ATP SIP comparing with

other SMT manufacture process

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 34

NAND flash is intrinsic to be certainly increase bad

block during System Operation

¾

ATP SIP can do much better protection than SMT

¾

ATP industrial grade using top grade level industrial components

with wear leveling algorithms technology to extend memory

lifetime

Maximal of each flash Memory Card bad block is

2%

only

(“Initial bad block” + “Runtime bad block”)

Life Cycle : SIP > SMT

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Industrial Level of SW & HW Protection

SIP Technology

Software

Software

Protection (

Protection (

Controller)

Controller)

Hardware

Hardware

Protection

Protection

( SIP)

( SIP)

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 36

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 38

Standard Form Factor

¾

¾

microSD

microSD

¾

¾

miniSD

miniSD

¾

¾

SD

SD

¾

¾

SDHC

SDHC

¾

¾

Compact Flash

Compact Flash

¾

¾

MMC

MMC

¾

¾

RS

RS

-

-

MMC

MMC

¾

¾

MMCplus

MMCplus

¾

¾

MMCmobile

MMCmobile

¾

¾

MMCmicro

MMCmicro

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Mobile Storage Solution

7

10

13

8

11

Pin no.

10 yrs/

100,000 cycles

10 yrs/

100,000 cycles

10 yrs/

100,000 cycles

10 yrs/

100,000 cycles

10 yrs/

100,000 cycles

Data Retention/

Endurance

Free

128MB-512MB

12MB/s

Dual Vol.

1.8V & 3.3V

MMC v4.1

14x12x1.1

MMCmicro

MMC v3.31

MMC v4.1

SD v1.1

SD v1.1

Compliant

128MB-1GB

128MB-1GB

128MB-256MB

128MB-2GB

Capacity

Ranging

Free

Free

Yes*

Yes*

Royalty Fee

2.5MB/s

20MB/s(R)

15MB/s(W)

12MB/s(R)

22.5MB/s(R)

15MB/s(W)

Data Transfer

Rate

3.3V

Dual Vol.

1.8V & 3.3V

3.3V

3.3V

Operation

Voltage

18x24x1.4

18x24x1.4

11x15x1.0

21.5x2.0x1.4

Size (mm)

Picture

RS-MMC

MMCmobile

microSD

miniSD

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 40

z

Memory Stick PRO

‹

Memory Stick PRO

MagicGate copyright protection technology is supported.

‹

Memory Stick PRO Duo

Has 1/3 reduced size of a Memory Stick PRO

‹

Memory Stick (MagicGate/High-speed data transfer compatible)

‹

Memory Stick

‹

MagicGate Memory Stick

Supports a copyright protection function to expand its applications for audio.

‹

Memory Stick (with Memory Select Function)

The switch on the reverse provides options to select a memory.

‹

Memory Stick-ROM

Archive media in which contents can be pre-recorded. Most suitable for distributing contents.

‹

Memory Stick I/O Expansion

Can expand functions beyond what Memory Stick already has by using a Memory Stick slot as a standard interface.

z

Memory Stick Micro (M2)

Ultra-small IC recording media for mobile phones

z

Memory Stick PRO-HG

December 2006

IC recording media with high-speed writing and data transfer capability (8-bit Parallel Data Transfer)

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 42

Memory Card Applications

Audio

Audio

Picture

Picture

Video

Video

Document

Document

File System Layer

File System Layer

Physical Layer

Physical Layer

Security Layer

Application

Layer

Music

Still Image

Moving picture

Print/fax

ƒ

Audio Data for music

distribution and CD ripping

ƒ

Audio Recording

ƒ

Receiving ringtones for

mobile phone

ƒ

e-KARAOKE

ƒ

MIDI/Voice data storage

ƒ

Still pictures for DSC (in.

Motion JPEG data)

ƒ

Standby image for mobile

phone

ƒ

E-distributed photo data

ƒ

Store Video data for

video camera (MP2/MP4)

ƒ

E-distributed video data

ƒ

Exchange, view, display

for printable data

ƒ

Store, View, print for

e-publish document data

ƒ

Exchange, archive for

personal data

(43)

The Application of Mobile Memory Card

Cell phone / Smart phone

DSC

PDA

DVC

Home entertainment center

Memory card

Adapter

PC/ Laptop

Printer/fax

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 44

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 46

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 48

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 50

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 52

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 54

How to catch the new trend

and opportunity?

(55)

我準備好了嗎

我準備好了嗎

?

?

9

了解自己 (資工學生or 將來IT產業的一員)

9

練功(培養自己的基礎能力包含語文能力)

9

了解產業與市場動態 (找方向與找出路)

9

創造自己的核心價值 (不可取代性的能力)

9

培養自己不斷進步與學習能力(職能訓練)

9

產業技術發展 & 標準 Standard (CPU, JEDEC,SDA,

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Copyright © 2007 ATP Electronics, Inc. All rights reserved. Page 56

References

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