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Co design/simulation of flip chip assembly for high voltage IGBT packages

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Figure

Fig 1: LED driver inside a GU10 housing
Fig 3: (a) Layout of the LIGBT package in side view, (b) top view of the package
Fig 9: (a) Electric field versus distance from ‘A’ to ‘B’ across the solder bump, (b) Top view of the cross section line, (c) electric field vector sum distribution from the side view
Table 1: Elastic and thermal material properties

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