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Procedia Engineering 41 ( 2012 ) 1360 – 1366

1877-7058 © 2012 Published by Elsevier Ltd. doi: 10.1016/j.proeng.2012.07.322

International Symposium on Robotics and Intelligent Sensors 2012 (IRIS 2012)

Modal Characteristics study of CEM-1 Single-Layer Printed Circuit

Board Using Experimental Modal Analysis

M.A.Anuar

a,

*, A.A.Mat Isa

a

, Ummi Z.A.R

a

a

Department of Mechanical Engineering, Universiti Teknologi MARA, UiTM Shah Alam, 40450 Selangor, Malaysia. * Corresponding author: [email protected]

Abstract

Since the level of vibration always depends on the natural frequencies of the system, it is important to know the modal parameters of such system to control failure and provide prevention actions. The demand for structurally reliable Printed Circuit Boards (PCB) has increased as more functions are required from electronic products along with less weight and smaller size. This imposes certain limitations and critical requirements. The applications of Experimental Modal Analysis (EMA), together with Finite Element Method (FEM) allow structural modification and optimization of the PCB. However, the purpose of this paper will only investigate the dynamic characteristics of CEM-1 Single-layer PCB using Experimental Modal Analysis (EMA) method. The dynamic characteristics are extracted for free-free end condition. In EMA, a model is developed using ME’Scope and modal testing is carried out using dbFA Suite 4.9 to obtain the experimental natural frequencies and mode shapes. The understanding on dynamic behavior of this structure provides valuable insight into the nature of the response and remarkable enhancement of its model, strength and vibration.

Keywords: Dynamic Charateristics, Experimental Modal Anal;ysis, Printed Circuit Board

Nomenclature

[F] Excitation matrix

[X] Output matrix

[H] Transfer function matrix

{ }

q

o r Mode shape (modal mode)

r

k

Modal stiffness r

ω

Modal frequency r

ξ

Modal damping 1. Introduction

Vibration is an unwanted repetitive, periodic or oscillatory response of a system. In general, it is classed into two categories which are free and forced vibrations. Free vibrations occur when small displacement or deformation is given to a system and then released while forced vibration will occur if a system is applied by a cyclic force [1]. Increasing demand for safety and reliability on a structure or machine result in a lot of study related to vibration.

System identification is used as to define mathematical model of a systems using the measured input-output data where the major part is to estimate dynamics parameters for parametric model [2]. Modal identification is a branch of system identification for systems which the dynamics properties of the structures such as frequency, damping and mode shape are measured as it provides useful information for engineers to update and/or validate analytical model of structures. Besides, it also helps to get information for actual boundary conditions and also structures properties [3]. In order to understand the

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dynamics properties and behaviour of the structures, analytical, numerical or experimental approaches were used individually or combination of them. In general the modal parameters are obtained by modal identification methods and this paper will be discussing the Experimental Modal Analysis (EMA) method on the Printed Circuit Boards (PCB).

Experimental Modal Analysis (EMA) represents an interdisciplinary field that brings together the signal conditioning and computer interaction of electrical engineering, the theory of mechanics, vibrations, acoustics, and control theory from mechanical engineering, and the parameter estimation approaches of applied mathematics [4].

Printed circuit board (PCB) is one of the major components in electrical devices like computers, disc drives, mouse, etc. It is made either from an inorganic material such as a ceramic and fiber glass, or from an epoxy or other organic material. Some examples of PCB material are FR-4, CEM-1 ad CEM-3. These materials can also be of a single layer or multi layer structures. CEM-1 single layer PCB is a board made of cellulose epoxy mat with single layer of copper on one side. During various operations, the printed circuit board will be subjected to mechanical shocks. This vibration sometimes can be excessive to its structure and may result in various failures. Furthermore, a PCB is often identified for refinement in order to design or develop electrical devices with improved size, cost and weight.

Papers by Robin Alastair Amya, G.S.Agliettia, Guy Richardson [5] and Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh[6] ] describes a modal testing which is performed on a PCB with well-defined modal parameters. They correlate FEM and EMA to improve the design of the Printed Circuit Board (PCB). The correlation between EMA & FEA has been visualized in form of Modal Assurance Criterion (MAC) matrices.

The iterative updating procedure has brought remarkable enhancement of the FE model, even for a limited number of modes. One possible approach is to create an accurate model of the PCB dynamic response; subsequently, the failure probability can be determined by comparing the response model with corresponding failure criteria for the electronic components. In principle the response model can be achieved by a very detailed FE model of the PCB which would include the mass and stiffness of all components present on the PCB. The accuracy of these simplified models has not yet been quantified over a range of possible design cases [5].

This study presents Experimental Modal Analysis (EMA) to investigate the dynamic characteristics of CEM-1 Single-layer PCB. The dynamic characteristics (modal frequency and mode shape) are extracted under free-free end condition. Practically, an EMA [7] can determine modal parameters, including natural frequencies, mode shapes, and damping ratios, of the specific PCB without the need of prerequisite information of material properties and layouts of its individual constituent components [8], [9] and [10]

1.1. Experimental Modal Analysis (EMA)

Experimental Modal Analysis (EMA) is the process of determining the modal parameters; natural frequencies, mode shapes and damping ratios, of a linear, time invariant system by way of an experimental approach. Predominately, EMA is used to explain a dynamics problem, vibration or acoustic, which is not obvious from intuition, analytical models, or previous similar experience.Experimental modal analysis methods involve the theoretical relationship between measured quantities and the classic vibration theory. All modern methods trace from the matrix differential equations yield a final mathematical form in terms of measured data. This measured data can be raw input and output data in the time or frequency domains or some form of processed data such as impulse response or frequency response functions [11].

Mathematically, the frequency response function (FRF) is defined as the Fourier transform of the output divided by the Fourier transform of the input. The measurements taken during a modal test are FRF measurements. The parameter estimation routines are, in general, curve fits in the Laplace domain and result in the transfer functions [12].

Theoretically, when a structure is excited by external excitation matrix [F], the output matrix [X] (such as displacement, velocity and acceleration) can be tested in an experiment [13]. The transfer function matrix [H] is described as the following equation:

[ ] [ ]

[ ]

F

X

H =

(1)

(3)

Expression for relationship between modal parameters (modal frequency, modal damping, mode shapes and modal stiffness) and transfer function of such structures will provide the following equation:

[ ]

{ } { }

=

⎪⎭

⎪⎩

⎟⎟

⎜⎜

+

⎟⎟

⎜⎜

=

n r r r r r T r o r o

i

k

q

q

H

1 2

2

1

ω

ω

ξ

ω

ω

(2)

Where

{ }

q

o r,

k

r,

ω

r,

ξ

rare mode shapes, modal stiffness, modal frequency and modal damping, respectively. In experiment, to obtained modal parameters only one row or column in the transfer function matrix is needed for testing and normalizing due to the orthogonality of the modal mass matrix and modal stiffness matrix.

2. Measurement Procedure and Experimental Apparatus

2.1. Experimental Apparatus

In this study, the measurements were made on the CEM-1 single layer PCB using modal analysis software and equipment (dBFA Suite 4.9 and ME ‘Scope) (see Fig. 1). The size of the tested PCB is 308mm x 184mm x 1.7mm made of Cellulose epoxy material with single layer of copper on one side (Fig.2).

Fig. 1. Experimental equipment including Modal Analysis Software (dBFA Suite 4.9 and ME ‘Scope), Impact Hammer, 4-Channel Spectrum Analyzer, Accelerometer Type 3714, Toggle Key and Harmonie Card.

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2.2. Measurement Procedure for EMA

The basic test setup required for making frequency response measurements depends on a few major factors. These include;

• the excitation mechanism

• the transduction system, to measure the various parameters of interest • the analyser, to extract the desired information

The heart of the test system is the controller, or computer, which is the operator’s communication link to the analyzer. It can be configured with various levels of memory, displays and data storage. The modal analysis software such as dBFA Suite 4.9 and ME ‘Scope reside here.

In order to obtain the modal parameters, experimental procedures for modal testing need to be followed as illustrated in Fig. 3. For test specimen preparation, the dimension of CEM-1 is measured and lines are drawn on the PCB so that it has 15 nodes. CEM-1 is then hanged using very light rubber band to get a “free” condition (Fig. 4). By 'free' is meant that the test object is not attached to ground at any of its coordinates and is effectively, freely suspended in space.

The experimental model is developed using ME ‘Scope. Basic plate structure is selected and the nodes on the plate are numbered. After preparing the test specimen, toggle key and Harmonie Card are inserted to the laptop. Hammer and Accelerometer 3714 are connected to the 4-Channel Spectrum Analyzer at channel 1 and 2 respectively. Then dBFA Suite 4.9 with Transient/Impact Hammer Acquisition is activated.

Fig. 3. Flowchart of Experimental Modal Testing

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Fig. 4. CEM-1 under “free” condition.

3. Result and Discussion

The challenge of EMA technique is to be able to separate natural frequencies which having real physical deformations from forcing components, harmonics, or uncorrelated noise presents in the analysis. From all the natural frequencies that are obtained from this analysis, there are only several real natural frequencies for this experiment. Thus to choose these selected natural frequencies, the natural frequencies need to be finalized based on its mode shape.

In this study, modal parameters (natural frequency and mode shape) are extracted from the experimental data. For PCB, the main concern for the analysis is at the lower modes as according to the working environment of a computer. As a result, five natural frequencies are obtained as illustrated in Table 1.

As mentioned earlier, the modal testing is carried out under “free” condition. Practically, it is impossible to provide a truly free support condition but generally feasible to provide a closely approximates to this condition. This is achieved by hanging the structure with very soft 'springs' support such as light elastic bands (see Fig. 4). However, unlike theoretical approach, the rigid body modes no longer having zero natural frequencies but values which are very low in relation to the flexible modes.

As that can be seen in Table 2, each mode shape will correspond to each particular natural frequency. The range for natural frequency is in between 43.7 Hz to 548 Hz representing either bending modes or torsion modes. It can be seen that bending mode is dominant for the first three modes (43.7 Hz to 241 Hz) while torsion mode can be seen in the fourth and fifth mode (363 Hz and 548 Hz).

Based on the result obtained from Experimental Modal Analysis (EMA), it is proposed that the resonant should be avoided as such failure may occur at the key components of PCB. The obtained natural frequencies as well as the mode shapes suggested that the vibration is critical at this condition and such PCB design should look upon at the attain data for consideration.

Table 1. Experimental natural frequency Mode Natural Frequency (Hz) 1 43.7 2 143 3 4 5 241 363 548

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Table 2. Experimental mode shape Mode Natural Frequency (Hz) Mode Shape 1 43.7 2 143 3 4 5 241 363 548

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4. Summary

Experimental Modal Analysis (EMA) is carried out under free-free end condition and the experimental modal parameters of CEM-1 single layer Printed Circuit Board (PCB) are successfully obtained. The best experimental models is developed in ME ‘Scope. The reliability of the CEM-1 single layer PCB depends on the free vibration of its structure. The free vibration is characterized by the inherent modal parameters of the PCB. Therefore, it is crucial to study the inherent modal parameters (natural frequency and mode shapes) of the PCB. EMA are common approach to characterize the inherent dynamic characteristics of a system. Furthermore, it is advisable for future work to model the PCB using Finite Element Analysis (FEA) as this is another approached used for modal analysis. Comparison between the results obtained in this study with the suggested approach (FEA) is vital in order to get the good agreement (well correlated) from both approaches. Better correlation of FEM and EMA can be obtained via model updating and the correlation validation is best done using Modal Assurance Criterion (MAC).

Acknowledgements

The authors are pleased to acknowledge the Malaysian Ministry of Higher Education (MOHE) and Research Management Institute (RMI) of Universiti Teknologi MARA (UiTM) for providing financial support for this study through a research grant FRGS.

References

[1] C. Murthy. Introduction to Mechanical Vibration. Bangalaroe: R V College of Engineering, 2002.

[2] L. Zhang, "An Overview of Major Developments and Issues in Modal Identification," in Proceedings of the 22nd International Modal Analysis Conference (IMAC) Detroit, Michigan, 2004.

[3] D. M. Siringoringo and Y. Fujino, "System identification of suspension bridge from ambient vibration response," Engineering Structures, vol. 30, pp. 462-477, 2008.

[4] Brian J. Schwarz & Mark H. Richardson, Experimental Modal Analysis, Vibrant Technology, Inc. Jamestown, Oct 1999

[5] Robin Alastair Amya, G.S.Agliettia, Guy Richardson, Simplified Modeling of Printed Circuit Boards (PCB) for Spacecraft Applications, (Dec 2006), Astronautical Research Group, School of Engineering Sciences, University of Southampton.

[6] Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen, Finite element model verification for packaged printed circuit board by experimental modal analysis, Microelectronics Reliability, Volume 48, Issues 11–12, November–December 2008, Pages 1837-1846. [7] Ewins DJ. Modal Testing: Theory, practice and application, 2nd ed., Research Studies Press, Baldock, Hertfordshire, UK; 2000.

[8] Yang QJ, Lim GH, Lin RM, Yap FF, Pang HLJ, Wang ZP. “Experimental modal analysis of PBGA printed circuit board assemblies”, In: Proceedings of the first electronic packaging technology conference, Singapore; 1997. p. 290–6.

[9] R.F. Gibson. Modal vibration response measurements for characterization of composite materials and structures. Compos Sci Technol, 60 (15) (2000), pp. 2769–2780

[10] He X, Fulton R. “Modeling and simulation of the dynamic response of the electronic packaging”, In: Proceedings of the 50th electron components and technology conference, Las Vegas, NV, USA; 2000. p. 1535–47.

[11]Experimental Modal Analysis, UC-SDRL-RJA, CN-20-263-663/664, and Revision: June 7, 1999 [12] The Fundamentals of Modal Testing, Application Note 243-3, Agilent Technologies.

[13] Yating Y, Pingan D, Ezhong G. “Structural robustness study of a computer motherboard”, In: Proceedings of the IEEE international conference on industrial technology; 2006. p. 2370–4

References

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