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Contactless Test Access Mechanism for 3D IC

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Figure

Figure 1.1: Delay for Metal 1 and Global Wiring versus feature size according to the ITRS Roadmap [4]
Fig. 2.1: Implemented contactless probe and TSV in HFSS environment (a) before excitation and (b) After excitation
Fig. 2.2: S-parameters for communication distance between the TSV and the probe varying from 1µm to 5µm
TABLE 2.II
+7

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