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Dual N-Channel 60-V (D-S) MOSFET

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Dual N-Channel 60-V (D-S) MOSFET

FEATURES

Halogen-free According to IEC 61249-2-21 Available

• TrenchFET® Power MOSFET

• New Low Thermal Resistance PowerPAK®

Package

• Dual MOSFET for Space Savings

PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A) 60 0.021 at VGS = 10 V 9.7 0.025 at VGS = 4.5 V 8.9 1 2 3 4 5 6 7 8 S1 G1 S2 G2 D1 D1 D2 D2 6.15 mm 5.15 mm Bottom View PowerPAK SO-8

Si7960DP-T1-E3 (Lead (Pb)-free)

Si7960DP-T1-GE3 (Lead (Pb)-free and Halogen-free)

Ordering Information: N-Channel MOSFET D1 G1 S1 N-Channel MOSFET D2 G2 S2 Notes:

a. Surface Mounted on 1" x 1" FR4 board.

b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.

c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted

Parameter Symbol 10 s Steady State Unit

Drain-Source Voltage VDS 60

V

Gate-Source Voltage VGS ± 20

Continuous Drain Current (TJ = 150 °C)a TA = 25 °C ID

9.7 6.2

A

TA = 70 °C 7.8 5.0

Pulsed Drain Current IDM 40

Continuous Source Current (Diode Conduction)a IS 2.9 1.2

Single Avalanche Current L = 0.1 mH IAS 23

Single Avalanche Energy EAS 27 mJ

Maximum Power Dissipationa TA = 25 °C PD 3.5 1.4 W

TA = 70 °C 2.2 0.9

Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150

°C

Soldering Recommendations (Peak Temperature)b, c 260

THERMAL RESISTANCE RATINGS

Parameter Symbol Typical Maximum Unit

Maximum Junction-to-Ambienta t ≤ 10 s RthJA

26 35

°C/W

Steady State 60 85

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Notes

a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted SPECIFICATIONS TJ = 25 °C, unless otherwise noted

Parameter Symbol Test Conditions Min. Typ. Max. Unit

Static

Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250 µA 1 3 V

Gate-Body Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA

Zero Gate Voltage Drain Current IDSS VDS = 60 V, VGS = 0 V 1 µA

VDS = 60 V, VGS = 0 V, TJ = 55 °C 5

On-State Drain Currenta ID(on) VDS ≥ 5 V, VGS = 10 V 30 A

Drain-Source On-State Resistancea RDS(on)

VGS = 10 V, ID = 9.7 A 0.017 0.021

Ω

VGS = 4.5 V, ID = 8.9 A 0.020 0.025

Forward Transconductancea gfs VDS = 15 V, ID = 9.7 A 33 S

Diode Forward Voltagea VSD IS = 2.9 A, VGS = 0 V 0.8 1.2 V

Dynamicb

Total Gate Charge Qg

VDS = 30 V, VGS = 10 V, ID = 9.7 A 49 75 nC Gate-Source Charge Qgs 5.7 Gate-Drain Charge Qgd 8.6 Gate Resistance Rg f = 1 MHz 2 Ω

Turn-On Delay Time td(on)

VDD = 30 V, RL = 30 Ω ID≅ 1 A, VGEN = 10 V, RG = 6 Ω

12 20

ns

Rise Time tr 12 20

Turn-Off Delay Time td(off) 60 90

Fall Time tf 17 30

Source-Drain Reverse Recovery Time trr IF = 2.9 A, dI/dt = 100 A/µs 30 60

Output Characteristics 0 5 10 15 20 25 30 35 40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VGS= 10 V thru 4 V VDS- Drain-to-Source Voltage (V) -D rain Current (A) ID 3 V Transfer Characteristics 0 5 10 15 20 25 30 35 40 0.0 0 .5 1.0 1 .5 2.0 2 .5 3.0 3 .5 4.0 4 .5 T C = 125 °C - 55 °C 25 °C VGS- Gate-to-Source Voltage (V) -D rain Current (A) ID

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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted

On-Resistance vs. Drain Current

Gate Charge

Source-Drain Diode Forward Voltage 0.000 0.005 0.010 0.015 0.020 0.025 0.030 0 5 10 15 20 25 30 35 40 -On -R esistance ( Ω ) RDS (o n )

ID- Drain Current (A)

V GS = 1 0 V V GS = 4 . 5 V 0 2 4 6 8 10 0 1 0 20 30 40 50 V DS = 2 0 V I D = 9 . 7 A -Gate -t o -Source V o ltage (V)

Qg- Total Gate Charge (nC)

VGS 0.0 0 .2 0.4 0 .6 0.8 1 .0 1.2 TJ= 150 °C TJ= 25 °C 40 10 1 VSD- Source-to-Drain Voltage (V) -Source Current (A) IS Capacitance

On-Resistance vs. Junction Temperature

On-Resistance vs. Gate-to-Source Voltage 0 500 1000 1500 2000 2500 3000 3500 4000 0 VDS- Drain-to-Source Voltage (V) Crss Coss Ciss C - Capacitance (pF) 10 20 30 40 50 60 0.6 0.8 1.0 1.2 1.4 1.6 1.8 - 50 - 25 0 2 5 5 0 7 5 100 125 150 V GS = 1 0 V I D = 9 . 7 A TJ- Junction Temperature (° C) RDS (on) -O n -R esistance (Nor maliz ed) 0.00 0.01 0.02 0.03 0.04 0.05 0 2 4 6 8 10 -On - R esistance ( RDS (o n ) Ω ) VGS- Gate-to-Source Voltage (V) I D = 9 . 7 A

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Threshold Voltage - 1. 4 - 1. 2 - 1 . 0 - 0 . 8 - 0 . 6 - 0 . 4 - 0 . 2 0 . 0 0.2 0.4 0.6 - 50 - 25 0 2 5 5 0 7 5 100 125 150 ID= 250 µA (V) VGS( th) TJ- Temperature (°C)

Single Pulse Power 0 60 100 20 40 Power (W) 80 100 600 0.01 0.001 0.1 1 10 Time (s)

Safe Operating Area, Junction-to-Ambient VDS- Drain-to-Source Voltage (V) 100 1 0.1 1 10 100 0.01 10 T A = 2 5 °C Single P ulse -D rain C urrent (A) ID 0.1 IDMLimited ID(on) Limited BVDSS Limited 10 s DC 1 s

* VGS >minimum VGS at which RDS(on)isspecified

10 ms 1 ms 100 µs

100 ms Limited by RDS(on)*

Normalized Thermal Transient Impedance, Junction-to-Ambient

10 -3 10 -2 10 -1 1 1 0 600 10 -4 100 2 1 0.1 0.01 0.2 0.1 0.05 0.02 Single P ulse Dut y Cy c l e = 0. 5

Square Wave Pulse Duration (s)

Nor maliz ed Ef fectiv e T ransient Ther mal Impedance 1 . Du ty Cycle , D = 2. Per U ni t B ase = R thJ A = 6 0 °C/W 3. T JM - TA= PDMZthJA(t) t 1 t 2 t 1 t 2 No te s:

4. Sur f ace M ounted P DM

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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?73075.

Normalized Thermal Transient Impedance, Junction-to-Case

10 -3 10 -2 10 -1 10 -4 1 2 1 0.1 0.01 0.2 0.1 0.05 P ulse Dut y Cy c l e = 0. 5

Square Wave Pulse Duration (s)

Nor maliz ed E f f ectiv e T ransient Ther mal Impedance 0.02 Single

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Vishay

Disclaimer

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